PROCEEDINGS VOLUME 1390
ADVANCES IN INTELLIGENT ROBOTICS SYSTEMS | 4-9 NOVEMBER 1990
Microelectronic Interconnects and Packages: System and Process Integration
IN THIS VOLUME

0 Sessions, 38 Papers, 0 Presentations
ADVANCES IN INTELLIGENT ROBOTICS SYSTEMS
4-9 November 1990
Boston, MA, United States
Part I: System Integration
Proc. SPIE 1390, Packaging technology for the NEC SX-3 supercomputers, 0000 (1 April 1991); doi: 10.1117/12.25572
Proc. SPIE 1390, Wafer scale integration modular packaging, 0000 (1 April 1991); doi: 10.1117/12.25574
Proc. SPIE 1390, State-of-the-art multichip modules for avionics, 0000 (1 April 1991); doi: 10.1117/12.25575
Proc. SPIE 1390, Challenges of using advanced multichip packaging for next generation spaceborne computers, 0000 (1 April 1991); doi: 10.1117/12.25576
Proc. SPIE 1390, System interconnect issues for subnanosecond signal transmission, 0000 (1 April 1991); doi: 10.1117/12.25577
Proc. SPIE 1390, Packaging technology for GaAs MMIC (monolithic microwave integrated circuits) modules, 0000 (1 April 1991); doi: 10.1117/12.25578
Proc. SPIE 1390, High-density multichip interconnect: military packaging for the 1990s, 0000 (1 April 1991); doi: 10.1117/12.25579
Proc. SPIE 1390, Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates, 0000 (1 April 1991); doi: 10.1117/12.25580
Proc. SPIE 1390, Skin effect in high-speed ULSI/VLSI packages, 0000 (1 April 1991); doi: 10.1117/12.25581
Proc. SPIE 1390, System interconnection of high-density multichip modules, 0000 (1 April 1991); doi: 10.1117/12.25582
Proc. SPIE 1390, Modeling progress and trends in electrical interconnects, 0000 (1 April 1991); doi: 10.1117/12.25583
Proc. SPIE 1390, Photonic Multichip Packaging (PMP) using electro-optic organic materials and devices, 0000 (1 April 1991); doi: 10.1117/12.25584
Proc. SPIE 1390, System issues for multichip packaging, 0000 (1 April 1991); doi: 10.1117/12.25585
Proc. SPIE 1390, Architecture of an integrated computer-aided design system for optoelectronics, 0000 (1 April 1991); doi: 10.1117/12.25586
Proc. SPIE 1390, CAD in new areas of the package and interconnect design space, 0000 (1 April 1991); doi: 10.1117/12.25587
Proc. SPIE 1390, CAE tools for verifying high-performance digital systems, 0000 (1 April 1991); doi: 10.1117/12.25588
Proc. SPIE 1390, Fractal description of computer interconnections, 0000 (1 April 1991); doi: 10.1117/12.25590
Proc. SPIE 1390, Power economy using point-to-point optical interconnect links, 0000 (1 April 1991); doi: 10.1117/12.25591
Proc. SPIE 1390, Generation and sampling of high-repetition-rate/high-frequency electrical waveforms in microstrip circuits by picosecond optoelectronic technique, 0000 (1 April 1991); doi: 10.1117/12.25592
Proc. SPIE 1390, Chaotic nature of mesh networks with distributed routing, 0000 (1 April 1991); doi: 10.1117/12.25593
Proc. SPIE 1390, Unique advantages of optics over electronics for interconnections, 0000 (1 April 1991); doi: 10.1117/12.25595
Proc. SPIE 1390, Self-routing interconnection structures using coincident pulse techniques, 0000 (1 April 1991); doi: 10.1117/12.25596
Proc. SPIE 1390, Pipelined communications on optical busses, 0000 (1 April 1991); doi: 10.1117/12.25597
Proc. SPIE 1390, Holographic optical interconnects for multichip modules, 0000 (1 April 1991); doi: 10.1117/12.25598
Proc. SPIE 1390, Current status and future research of the Delft 'supercomputer' project, 0000 (1 April 1991); doi: 10.1117/12.25599
Proc. SPIE 1390, All-optical interconnection networks, 0000 (1 April 1991); doi: 10.1117/12.25600
Proc. SPIE 1390, Optically coupled three-dimensional memory system, 0000 (1 April 1991); doi: 10.1117/12.25601
Proc. SPIE 1390, Packaging issues for free-space optically interconnected multiprocessors, 0000 (1 April 1991); doi: 10.1117/12.25602
Part II: Process Integration
Proc. SPIE 1390, GE high-density interconnect: a solution to the system interconnect problem, 0000 (1 April 1991); doi: 10.1117/12.25604
Proc. SPIE 1390, Projection direct imaging for high-density interconnection and printed circuit manufacture, 0000 (1 April 1991); doi: 10.1117/12.25605
Proc. SPIE 1390, Computer-Aided System Interconnect Design (CASID) in multipackage environment, 0000 (1 April 1991); doi: 10.1117/12.25606
Proc. SPIE 1390, Interactive Design and Electro-optic Analysis Liaise (IDEAL), 0000 (1 April 1991); doi: 10.1117/12.25607
Proc. SPIE 1390, Partitioning: the payoff role in telecommunication system design, 0000 (1 April 1991); doi: 10.1117/12.25608
Proc. SPIE 1390, Quick prototyping center for hybrid-wafer-scale integration (HWSI) multichip modules, 0000 (1 April 1991); doi: 10.1117/12.25610
Proc. SPIE 1390, Flow behavior of thermoset molding compound in conventional PDIP molds, 0000 (1 April 1991); doi: 10.1117/12.25611
Proc. SPIE 1390, High-density chip-to-chip interconnect system for GaAs semiconductor devices, 0000 (1 April 1991); doi: 10.1117/12.25612
Part I: System Integration
Proc. SPIE 1390, High-density interconnect technology for VAX 9000 system, 0000 (1 April 1991); doi: 10.1117/12.25614
Proc. SPIE 1390, Methods for comparative analysis of waveform degradation in electrical and optical high-performance interconnections, 0000 (1 April 1991); doi: 10.1117/12.47727
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