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Characteristics of gate oxide surface material after exposure to magnetron-enhanced reactive ion etching plasma
Plasma diagnostics as inputs to the modeling of the oxygen reactive ion etching of multilevel resist structures
Reactive ion etching of deep isolation trenches using sulfur hexafluoride, chlorine, helium, and oxygen
Expert system and process optimization techniques for real-time monitoring and control of plasma processes
Effects of environmental and installation-specific factors on process gas delivery via mass-flow controller with an emphasis on real-time behavior
Formation of heterostructure devices in a multichamber processing environment with in-vacuo surface analysis diagnostics and in-situ process monitoring