PROCEEDINGS VOLUME 1598
MICROELECTRONIC PROCESSING INTEGRATION | 1-30 SEPTEMBER 1991
Lasers in Microelectronic Manufacturing
MICROELECTRONIC PROCESSING INTEGRATION
1-30 September 1991
San Jose, CA, United States
Laser Cleaning, Ablation, and 3-D Objects
Proc. SPIE 1598, Threshold measurements in laser-assisted particle removal, (1 December 1991);doi: 10.1117/12.51020
Proc. SPIE 1598, Efficient laser cleaning of small particulates using pulsed laser irradiation synchronized with liquid-film deposition, (1 December 1991);doi: 10.1117/12.51021
Proc. SPIE 1598, Thin-film selective multishot ablation at 248 nm, (1 December 1991);doi: 10.1117/12.51022
Proc. SPIE 1598, KrF laser ablation of polyurethane, (1 December 1991);doi: 10.1117/12.51023
Proc. SPIE 1598, Excimer laser projector for microelectronics applications, (1 December 1991);doi: 10.1117/12.51024
Proc. SPIE 1598, Material influence on cutting and drilling of metals using copper vapor lasers, (1 December 1991);doi: 10.1117/12.51025
Proc. SPIE 1598, Laser-generated 3-D prototypes, (1 December 1991);doi: 10.1117/12.51026
Laser Processing of Wide-Bandgap Materials and Semiconductors
Proc. SPIE 1598, Role of defects in the ablation of wide-bandgap materials, (1 December 1991);doi: 10.1117/12.51027
Proc. SPIE 1598, Dynamics of the optical parameters of molten silicon during nanosecond laser annealing, (1 December 1991);doi: 10.1117/12.51028
Proc. SPIE 1598, Interference effect on laser trimming and layer thickness optimization, (1 December 1991);doi: 10.1117/12.51029
Proc. SPIE 1598, Characterization of microstructure of Si films grown by laser-enhanced photo-CVD using Si2H6, (1 December 1991);doi: 10.1117/12.51030
Proc. SPIE 1598, Modeling of photochemical vapor deposition of epitaxial silicon using an ArF excimer laser, (1 December 1991);doi: 10.1117/12.51031
Proc. SPIE 1598, Laser drilling vias in GaAs wafers, (1 December 1991);doi: 10.1117/12.51032
Laser Repair Processes in Microelectronic Manufacturing
Proc. SPIE 1598, Laser-induced gold deposition for thin-film circuit repair, (1 December 1991);doi: 10.1117/12.51033
Proc. SPIE 1598, Laser process for personalization and repair of multichip modules, (1 December 1991);doi: 10.1117/12.51034
Proc. SPIE 1598, Laser processes for repair of thin-film wiring, (1 December 1991);doi: 10.1117/12.51035
Proc. SPIE 1598, IC rewiring by laser microchemistry, (1 December 1991);doi: 10.1117/12.51036
Laser Applications in Advanced Packaging
Proc. SPIE 1598, Laser-formed structures to facilitate TAB bonding, (1 December 1991);doi: 10.1117/12.51037
Proc. SPIE 1598, Development of laser bonding as a manufacturing process for inner lead bonding, (1 December 1991);doi: 10.1117/12.51038
Proc. SPIE 1598, Experimental investigations in laser microsoldering, (1 December 1991);doi: 10.1117/12.51039
Poster Session
Proc. SPIE 1598, Reflow soldering of fine-pitch devices using a Nd:YAG laser, (1 December 1991);doi: 10.1117/12.51040
Proc. SPIE 1598, Cumulative effect and cutting quality improvement of XeCl laser ablation of PMMA, (1 December 1991);doi: 10.1117/12.51041
Proc. SPIE 1598, Unique symbol for marking and tracking very small semiconductor products, (1 December 1991);doi: 10.1117/12.51042
Laser Applications in Advanced Packaging
Proc. SPIE 1598, Applications of excimer lasers in microelectronics, (1 December 1991);doi: 10.1117/12.51043
Poster Session
Proc. SPIE 1598, Stoichiometry of laser-deposited Bi-Sr-Ca-Cu-O films on silicon and mass spectrometric investigations of superconductors, (1 December 1991);doi: 10.1117/12.51044
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