PROCEEDINGS VOLUME 1673
MICROLITHOGRAPHY '92 | 8-12 MARCH 1992
Integrated Circuit Metrology, Inspection, and Process Control VI
MICROLITHOGRAPHY '92
8-12 March 1992
San Jose, CA, United States
Linewidth Metrology I: Applications
Proc. SPIE 1673, Cost analysis and risk assessment for metrology applications, 0000 (1 June 1992); doi: 10.1117/12.59780
Proc. SPIE 1673, Performance of a submicron litho process under CLSM metrology with linearity and discrimination measurements, 0000 (1 June 1992); doi: 10.1117/12.59781
Proc. SPIE 1673, Submicrometer dimensional measurements with optical microscopy, 0000 (1 June 1992); doi: 10.1117/12.59782
Proc. SPIE 1673, Application of statistical models to decomposition of systematic and random error in low-voltage SEM metrology, 0000 (1 June 1992); doi: 10.1117/12.59783
Proc. SPIE 1673, Scanning electron microscope system for linewidth measurement of IC, 0000 (1 June 1992); doi: 10.1117/12.59784
Linewidth Metrology II: Modeling/Simulations
Proc. SPIE 1673, Numerical reference models for optical metrology simulation, 0000 (1 June 1992); doi: 10.1117/12.59785
Proc. SPIE 1673, Pattern recognition algorithms for linewidth measurement, 0000 (1 June 1992); doi: 10.1117/12.59786
Proc. SPIE 1673, Progress in optical imaging theory for trenches and lines, 0000 (1 June 1992); doi: 10.1117/12.59787
Proc. SPIE 1673, Model for electron-beam metrology algorithm, 0000 (1 June 1992); doi: 10.1117/12.59788
Proc. SPIE 1673, Simulation of linearity in optical microscopes, 0000 (1 June 1992); doi: 10.1117/12.59789
Overlay Metrology
Proc. SPIE 1673, Application of mark diagnostics to overlay metrology, 0000 (1 June 1992); doi: 10.1117/12.59790
Proc. SPIE 1673, Tool and mark design factors that influence optical overlay measurement errors, 0000 (1 June 1992); doi: 10.1117/12.59791
Proc. SPIE 1673, Overlay measurements using the scanning electron microscope: accuracy and precision, 0000 (1 June 1992); doi: 10.1117/12.59792
Proc. SPIE 1673, Novel approach to placement accuracy analysis, 0000 (1 June 1992); doi: 10.1117/12.59793
Phase-Shift Mask Metrology
Proc. SPIE 1673, Metrology on phase-shift masks, 0000 (1 June 1992); doi: 10.1117/12.59794
Proc. SPIE 1673, Single-level electric testsites for phase-shifting masks, 0000 (1 June 1992); doi: 10.1117/12.59795
Proc. SPIE 1673, Novel architecture for high-speed dual-image generation of pattern data for phase-shifting reticle inspection, 0000 (1 June 1992); doi: 10.1117/12.59796
Proc. SPIE 1673, Direct phase measurements in phase-shift masks, 0000 (1 June 1992); doi: 10.1117/12.59797
Lithographic Process Monitoring/Metrology I
Proc. SPIE 1673, Latent image exposure monitor using scatterometry, 0000 (1 June 1992); doi: 10.1117/12.59798
Proc. SPIE 1673, Develop end-point detection: a manufacturer's perspective, 0000 (1 June 1992); doi: 10.1117/12.59799
Proc. SPIE 1673, Electrical resistance measurements for full-field lens characterization, 0000 (1 June 1992); doi: 10.1117/12.59800
Proc. SPIE 1673, Advanced wafer manufacturing control for yield improvement in the ULSI age, 0000 (1 June 1992); doi: 10.1117/12.59801
Proc. SPIE 1673, Integrated circuit critical-dimension optimization through correlation of resist spin speed, substrate reflectance, and scanning electron microscope measurements, 0000 (1 June 1992); doi: 10.1117/12.59802
Lithographic Process Monitoring/Metrology II
Proc. SPIE 1673, Overlay and field-by-field leveling in wafer steppers using an advanced metrology system, 0000 (1 June 1992); doi: 10.1117/12.59803
Proc. SPIE 1673, Direct measurement of stepper mark detection accuracy on processed wafers, 0000 (1 June 1992); doi: 10.1117/12.59804
Proc. SPIE 1673, Correlation of 150-mm silicon wafer site flatness with stepper performance for deep submicron applications, 0000 (1 June 1992); doi: 10.1117/12.59805
Proc. SPIE 1673, Performance of through-the-lens/off-axis laser alignment systems and alignment algorithms on Nikon wafer steppers, 0000 (1 June 1992); doi: 10.1117/12.59806
Proc. SPIE 1673, Characterization of a one-layer overlay standard, 0000 (1 June 1992); doi: 10.1117/12.59807
Particles and Defects
Proc. SPIE 1673, Advanced in-line process control of defects, 0000 (1 June 1992); doi: 10.1117/12.59808
Proc. SPIE 1673, Submicron defect detection standard for patterned wafer inspection systems, 0000 (1 June 1992); doi: 10.1117/12.59809
Proc. SPIE 1673, Surface defect inspection system with an optical spatial frequency filter for semiconductor patterned wafers, 0000 (1 June 1992); doi: 10.1117/12.59810
Proc. SPIE 1673, Standard patterned wafer for performance evaluation of inspection tools, 0000 (1 June 1992); doi: 10.1117/12.59811
Special Topics and Emerging Technologies
Proc. SPIE 1673, Recent developments in atomic-force microscopy applicable to integrated circuit metrology, 0000 (1 June 1992); doi: 10.1117/12.59812
Proc. SPIE 1673, Residual film detection using UV reflectance difference measurements, 0000 (1 June 1992); doi: 10.1117/12.59813
Proc. SPIE 1673, Scanning probe metrology, 0000 (1 June 1992); doi: 10.1117/12.59814
Proc. SPIE 1673, Expert system for performing measurement system characterization, 0000 (1 June 1992); doi: 10.1117/12.59815
Proc. SPIE 1673, Phase-contrast latent image metrology for microlithography, 0000 (1 June 1992); doi: 10.1117/12.59816
Integrated Circuit Manufacturing System and Technology
Proc. SPIE 1673, Microautomation of semiconductor fabrication, 0000 (1 June 1992); doi: 10.1117/12.59817
Proc. SPIE 1673, Use of computer optimization programs for the enhancement of Nikon stepper throughput with defectivity reduction benefits, 0000 (1 June 1992); doi: 10.1117/12.59818
Proc. SPIE 1673, Lithographic chip identification: meeting the failure analysis challenge, 0000 (1 June 1992); doi: 10.1117/12.59819
Proc. SPIE 1673, Automated process control for plasma etching, 0000 (1 June 1992); doi: 10.1117/12.59820
Proc. SPIE 1673, Design, performance validation, and reliability testing of a new photochemical dispense pump, 0000 (1 June 1992); doi: 10.1117/12.59821
Proc. SPIE 1673, Plasma deposition of high-quality silicon dioxide, 0000 (1 June 1992); doi: 10.1117/12.59822
Linewidth Metrology I: Applications
Proc. SPIE 1673, Metrology algorithms for machine matching in different CD SEM configurations, 0000 (1 June 1992); doi: 10.1117/12.59823
Proc. SPIE 1673, Achieving linearity for dense CD measurements with confocal metrology, 0000 (1 June 1992); doi: 10.1117/12.59824
Lithographic Process Monitoring/Metrology II
Proc. SPIE 1673, Film thickness measurement of ultrathin film using UV wavelength light, 0000 (1 June 1992); doi: 10.1117/12.59825
Overlay Metrology
Proc. SPIE 1673, Overlay process control for 16-Mb DRAM manufacturing, 0000 (1 June 1992); doi: 10.1117/12.59826
Lithographic Process Monitoring/Metrology II
Proc. SPIE 1673, Laser surface profilometer with subangstrom resolution, 0000 (1 June 1992); doi: 10.1117/12.59827
Proc. SPIE 1673, Focused ion-beam process monitoring, 0000 (1 June 1992); doi: 10.1117/12.59828
Proc. SPIE 1673, Response surface modeling utilizing lithographic process simulation, 0000 (1 June 1992); doi: 10.1117/12.59829
Proc. SPIE 1673, Application of a dielectric discontinuity microscope to process development at the Fairchild Research Center of National Semiconductor, 0000 (1 June 1992); doi: 10.1117/12.59830
Proc. SPIE 1673, Measuring thickness of a film deposited onto a multilayer metal surface, 0000 (1 June 1992); doi: 10.1117/12.59831
Proc. SPIE 1673, Use of scatterometry for resist process control, 0000 (1 June 1992); doi: 10.1117/12.59832
Proc. SPIE 1673, Measurement of multilayer film and reflectivity on wafers using ultraviolet-visible microspectrophotometry, 0000 (1 June 1992); doi: 10.1117/12.59833
Proc. SPIE 1673, Program for enhancing image contrast by optimizing noncritical film thicknesses, 0000 (1 June 1992); doi: 10.1117/12.59834
Integrated Circuit Manufacturing System and Technology
Proc. SPIE 1673, Evaluation of `bag-in-bottle` resist dispense system, 0000 (1 June 1992); doi: 10.1117/12.59835
Overlay Metrology
Proc. SPIE 1673, Lithographic overlay measurement precision and calibration and their effect on pattern registration optimization, 0000 (1 June 1992); doi: 10.1117/12.59836