PROCEEDINGS VOLUME 2153
OE/LASE '94 | 23-29 JANUARY 1994
Optoelectronic Interconnects II
OE/LASE '94
23-29 January 1994
Los Angeles, CA, United States
System-Level Integration
Proc. SPIE 2153, Optoelectronics Technology Consortium (OETC): progress and plan, (2 May 1994);doi: 10.1117/12.174503
Proc. SPIE 2153, Generic VLSI platform for system-level optical interconnection insertion, (2 May 1994);doi: 10.1117/12.174513
Proc. SPIE 2153, Photonic Exchange Network: a reconfigurable data network for mobile platforms, (2 May 1994);doi: 10.1117/12.174523
Free-Space Optical Interconnects
Proc. SPIE 2153, Analysis on link failures in free-space optical interconnects, (2 May 1994);doi: 10.1117/12.174531
Proc. SPIE 2153, Digital optical interconnects for photonic computing, (2 May 1994);doi: 10.1117/12.174532
Proc. SPIE 2153, Optically interconnected multichip module based on computer-generated holograms and flip-chip technology, (2 May 1994);doi: 10.1117/12.174533
Proc. SPIE 2153, Free-space optical implementations of connectivity-enhanced mesh-based networks, (2 May 1994);doi: 10.1117/12.174534
Proc. SPIE 2153, High-speed optical bus for multiprocessor systems with substrate mode holograms, (2 May 1994);doi: 10.1117/12.174535
Proc. SPIE 2153, Planar formation of 3D highly parallel optical fan-out interconnects for wafer scale optical clock signal distribution, (2 May 1994);doi: 10.1117/12.174495
Proc. SPIE 2153, Receiver considerations for free-space clock distribution systems, (2 May 1994);doi: 10.1117/12.174496
System Evaluation Demonstration
Proc. SPIE 2153, Optical approach to a post-2000 avionics architecture: pave pace, (2 May 1994);doi: 10.1117/12.174497
Proc. SPIE 2153, Optically integrated millimeter wave systems, (2 May 1994);doi: 10.1117/12.174498
Proc. SPIE 2153, Standard Hardware Acquisition and Reliability Program's (SHARP's) efforts in incorporating fiber optic interconnects into standard electronic module (SEM) connectors, (2 May 1994);doi: 10.1117/12.174499
Proc. SPIE 2153, Wavelength selection by an acousto-optical filter, (2 May 1994);doi: 10.1117/12.174500
Optoelectronic Packaging
Proc. SPIE 2153, Self-alignment by flip-chip bonding for OE-MCM packaging, (2 May 1994);doi: 10.1117/12.174501
Proc. SPIE 2153, Capabilities of normal metal electrical interconnections for 3D MCM electronic packaging, (2 May 1994);doi: 10.1117/12.174502
Proc. SPIE 2153, Inversion channel detection circuits for optoelectronic interconnect, (2 May 1994);doi: 10.1117/12.174504
Proc. SPIE 2153, Semiconductor lasers with dry-etched facets, (2 May 1994);doi: 10.1117/12.174505
Proc. SPIE 2153, Sandia's photonic program and its changing national role, (2 May 1994);doi: 10.1117/12.174506
Guided Wave Optical Interconnects I
Proc. SPIE 2153, Guided wave optoelectronic interconnects: their potential and future trends, (2 May 1994);doi: 10.1117/12.174507
Proc. SPIE 2153, Photodefinable benzocyclobutene as an optical waveguide material, (2 May 1994);doi: 10.1117/12.174508
Proc. SPIE 2153, Optical channel waveguides based on photopolymerizable di/tri acrylates, (2 May 1994);doi: 10.1117/12.174509
Proc. SPIE 2153, D-fiber optical backplane interconnect, (2 May 1994);doi: 10.1117/12.174510
Proc. SPIE 2153, Design considerations for high packaging density optical bus array, (2 May 1994);doi: 10.1117/12.174511
Guided Wave Optical Interconnects II
Proc. SPIE 2153, Simulation of optical interconnects in high-performance computing and communications systems, (2 May 1994);doi: 10.1117/12.174512
Proc. SPIE 2153, InP-based components for wavelength division multiplexing, (2 May 1994);doi: 10.1117/12.174514
Proc. SPIE 2153, Polyimide waveguide and laser diode encapsulated with silicone elastomere, (2 May 1994);doi: 10.1117/12.174515
Proc. SPIE 2153, Losses in NLO polymer integrated optic channel waveguide devices, (2 May 1994);doi: 10.1117/12.174516
Proc. SPIE 2153, Computer-aided design of optical interconnects, (2 May 1994);doi: 10.1117/12.174517
Proc. SPIE 2153, Multiple diffraction of massive fanout optical interconnects based on multiplexed waveguide holograms, (2 May 1994);doi: 10.1117/12.174518
System Architecture
Proc. SPIE 2153, Optical interconnects: topology and protocol issues, (2 May 1994);doi: 10.1117/12.174519
Proc. SPIE 2153, Planned development of a 3D computer based on free-space optical interconnects, (2 May 1994);doi: 10.1117/12.174520
Proc. SPIE 2153, Modeling and evaluating opto-electronic architectures, (2 May 1994);doi: 10.1117/12.174521
Proc. SPIE 2153, Reconfigurable optical switches with monolithic electrical-to-optical interfaces, (2 May 1994);doi: 10.1117/12.174522
Proc. SPIE 2153, Design limitations of highly parallel free-space optical interconnects based on arrays of vertical-cavity surface-emitting laser diodes, microlenses, and photodetectors, (2 May 1994);doi: 10.1117/12.174524
Device Demonstration
Proc. SPIE 2153, FET-SEED-based free-space optical backplanes, (2 May 1994);doi: 10.1117/12.174525
Proc. SPIE 2153, Hybrid integration of electrical and optical interconnects, (2 May 1994);doi: 10.1117/12.174526
Proc. SPIE 2153, High-speed optical backplane bus with modulation and demodulation capabilities, (2 May 1994);doi: 10.1117/12.174527
Optoelectronic Packaging
Proc. SPIE 2153, Misalignment sensitivity analysis of planar optical interconnect systems, (2 May 1994);doi: 10.1117/12.174528
Device Demonstration
Proc. SPIE 2153, Nonblocking omega network and its topological equivalence with Benes network, (2 May 1994);doi: 10.1117/12.174529
Proc. SPIE 2153, Topological equivalence variety of crossover networks with omega and banyan networks, (2 May 1994);doi: 10.1117/12.174530
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