3D Optical Interconnects
Proc. SPIE 2400, Promises and challenges for free-space digital optics in switching systems beyond the year 2000, 0000 (5 April 1995); doi: 10.1117/12.206294
Proc. SPIE 2400, Test chip fabrication of 3D optically coupled common memory for parallel processing system, 0000 (5 April 1995); doi: 10.1117/12.206304
Proc. SPIE 2400, Photonic switching demonstration focused toward high-performance optoelectronic computing (HPOC) module implementation, 0000 (5 April 1995); doi: 10.1117/12.206315
Proc. SPIE 2400, Three-dimensional guided-free-space multistage optoelectronic fanout interconnection using wavelength division multiplexing and space division multiplexing, 0000 (5 April 1995); doi: 10.1117/12.206326
Proc. SPIE 2400, Nonseparable surface-relief gratings that generate large arbitrary intensity beam arrays, 0000 (5 April 1995); doi: 10.1117/12.206330
Guided-Wave Optical Interconnects Part I
Proc. SPIE 2400, Low-cost optical interconnect module for parallel optical data links, 0000 (5 April 1995); doi: 10.1117/12.206331
Proc. SPIE 2400, Beam propagation methods for simulation and design of optoelectronic guided-wave devices, 0000 (5 April 1995); doi: 10.1117/12.206332
Proc. SPIE 2400, Integrated wavelength tunable filters based on resonant Mach-Zender interferometer, 0000 (5 April 1995); doi: 10.1117/12.206333
Proc. SPIE 2400, Cost-effective optoelectronic packaging for multichip modules and backplane level optical interconnects, 0000 (5 April 1995); doi: 10.1117/12.206334
Proc. SPIE 2400, Single-mode fiber directional coupler with continuously adjustable coupling ratio, 0000 (5 April 1995); doi: 10.1117/12.206295
Guided-Wave Optical Interconnects Part II
Proc. SPIE 2400, Polymer-based optical interconnect technology: a route to low-cost optoelectronic packaging and interconnect, 0000 (5 April 1995); doi: 10.1117/12.206296
Proc. SPIE 2400, Optical interconnection on silicon LSI chips, 0000 (5 April 1995); doi: 10.1117/12.206297
Proc. SPIE 2400, New optical waveguide structure: a trench-channel-type high-density waveguide in Si, 0000 (5 April 1995); doi: 10.1117/12.206298
Proc. SPIE 2400, Compact surface-normal coupled optical interconnects with wavelength-division-demultiplexing capability, 0000 (5 April 1995); doi: 10.1117/12.206299
Proc. SPIE 2400, Five-channel surface-normal wavelength division demultiplexer using substrate guided waves in conjunction with polymer-based Littrow hologram, 0000 (5 April 1995); doi: 10.1117/12.206300
Proc. SPIE 2400, Demonstration of a free-space optical interconnect in a CMOS chip, 0000 (5 April 1995); doi: 10.1117/12.206301
Guided-Wave Optical Interconnects Part III
Proc. SPIE 2400, Heteroepitaxy on high-quality GaAs on Si for optical interconnection on Si chip, 0000 (5 April 1995); doi: 10.1117/12.206302
Proc. SPIE 2400, Novel Si-substrate-mode-based wafer scale optical clock distribution architecture, 0000 (5 April 1995); doi: 10.1117/12.206303
Proc. SPIE 2400, Practical considerations for fabrication of active AlxGa1-xAs zero-gap directional couplers, 0000 (5 April 1995); doi: 10.1117/12.206305
Intermodule and Backplane Optical Interconnects
Proc. SPIE 2400, Microchannel-based optical backplane demonstrators using FET-SEED smart pixel arrays, 0000 (5 April 1995); doi: 10.1117/12.206306
Proc. SPIE 2400, General purpose bidirectional optical backplane bus, 0000 (5 April 1995); doi: 10.1117/12.206307
Proc. SPIE 2400, New parallel processor system with optical interconnection specific for Monte Carlo analysis, 0000 (5 April 1995); doi: 10.1117/12.206308
Proc. SPIE 2400, Optical interconnects for multiprocessors in computer backplane, 0000 (5 April 1995); doi: 10.1117/12.206309
Proc. SPIE 2400, Interconnection issues for vertical-to-surface-transmission electrophotonic device (VSTEP) optoelectronic information processing systems, 0000 (5 April 1995); doi: 10.1117/12.206310
Proc. SPIE 2400, Optical interconnects: the Parallel Optical Link Organization (POLO) approach, 0000 (5 April 1995); doi: 10.1117/12.206311
System-Related Issues in Optoelectronic Interconnects
Review on Photonic Receiver Design for Smart Pixels, Interconnects, and Communications
Proc. SPIE 2400, Design, fabrication, and automated testing of 32-channel integrated MSM/MESFET optoelectronic integrated circuit (OEIC) receiver arrays, 0000 (5 April 1995); doi: 10.1117/12.206319
Proc. SPIE 2400, Receiver design issues for parallel optical interconnections fabricated in the FET-SEED technology, 0000 (5 April 1995); doi: 10.1117/12.206320
Proc. SPIE 2400, High-speed MSM/MESFET-based optoelectronic integrated circuit (OEIC) receivers for data communications, 0000 (5 April 1995); doi: 10.1117/12.206321
Proc. SPIE 2400, Compact receivers and smart-pixel chips for optical interconnects and signal processing, 0000 (5 April 1995); doi: 10.1117/12.206322
Proc. SPIE 2400, Silicon CMOS optical receiver circuits with integrated thin-film compound semiconductor detectors, 0000 (5 April 1995); doi: 10.1117/12.206323
Proc. SPIE 2400, Monolithically integrated silicon NMOS-PIN photoreceiver, 0000 (5 April 1995); doi: 10.1117/12.206324
Proc. SPIE 2400, Optical FET receivers for neural network applications, 0000 (5 April 1995); doi: 10.1117/12.206325
Intermodule and Backplane Optical Interconnects
Proc. SPIE 2400, High-speed optical interconnect technology for a reconfigurable multiprocessor network, 0000 (5 April 1995); doi: 10.1117/12.206327
System-Related Issues in Optoelectronic Interconnects
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