PROCEEDINGS VOLUME 2610
PHOTONICS EAST '95 | 22-26 OCTOBER 1995
Laser Diode Chip and Packaging Technology
PHOTONICS EAST '95
22-26 October 1995
Philadelphia, PA, United States
System Implications
Proc. SPIE 2610, Study of distortions in CATV DFB laser diodes, 0000 (15 January 1996); doi: 10.1117/12.230068
Proc. SPIE 2610, Chaotic instabilities in modulated external-cavity semiconductor lasers, 0000 (15 January 1996); doi: 10.1117/12.230086
Proc. SPIE 2610, Modulation characteristics of multiple quantum-well lasers including coupling effects between wells, 0000 (15 January 1996); doi: 10.1117/12.230089
Proc. SPIE 2610, Rate equation description of carrier transport effects in multiple quantum-well lasers, 0000 (15 January 1996); doi: 10.1117/12.230090
Component Technology
Proc. SPIE 2610, High-reliability nonhermetic 1.3-um InP-based uncooled lasers, 0000 (15 January 1996); doi: 10.1117/12.230091
Proc. SPIE 2610, Lens-coupled laser-diode module integrated on silicon platform, 0000 (15 January 1996); doi: 10.1117/12.230092
Proc. SPIE 2610, Coolerless operation of a high-speed data link at 1 GBit/s over a temperature range from -10oC-125oC, 0000 (15 January 1996); doi: 10.1117/12.230093
Proc. SPIE 2610, 1.625-um high-power lasers for OTDR monitoring systems for optical transmission lines, 0000 (15 January 1996); doi: 10.1117/12.230069
Chip Technology
Proc. SPIE 2610, High-power, high-efficiency, and highly uniform 1.3-um uncooled InGaAsP/InP strained multiquantum-well lasers, 0000 (15 January 1996); doi: 10.1117/12.230070
Proc. SPIE 2610, Extremely low-threshold 1.3-um strained-MQW lasers for parallel high-speed optical interconnections, 0000 (15 January 1996); doi: 10.1117/12.230071
Proc. SPIE 2610, Integrated strained-layer photonic devices by selective area epitaxy, 0000 (15 January 1996); doi: 10.1117/12.230072
Proc. SPIE 2610, Performance comparison of 1300-nm semiconductor optical amplifiers with bulk and MQW active layers, 0000 (15 January 1996); doi: 10.1117/12.230073
Packaging Technologies
Proc. SPIE 2610, New technology developments make passive laser/fiber alignment a reality, 0000 (15 January 1996); doi: 10.1117/12.230074
Proc. SPIE 2610, Demonstration of highly reliable nonhermetic planar InGaAs/InP photodiodes, 0000 (15 January 1996); doi: 10.1117/12.230075
Proc. SPIE 2610, Uncooled laser packaging based on silicon optical bench technology, 0000 (15 January 1996); doi: 10.1117/12.230076
Proc. SPIE 2610, Packaging of photonic devices using laser welding, 0000 (15 January 1996); doi: 10.1117/12.230077
Proc. SPIE 2610, Silicon wafer board alignment of laser arrays to single-mode optical fiber for analog optoelectronic module applications, 0000 (15 January 1996); doi: 10.1117/12.230078
Design of optoelectronic Packages
Proc. SPIE 2610, Waveguide coupling optimization using lenses, 0000 (15 January 1996); doi: 10.1117/12.230079
Proc. SPIE 2610, Optical design of a low-cost fiber optic coupling device for data communication applications, 0000 (15 January 1996); doi: 10.1117/12.230080
Proc. SPIE 2610, Analysis and compensation of ball-lens-induced pupil distortion and spherical aberration, 0000 (15 January 1996); doi: 10.1117/12.230081
Proc. SPIE 2610, Combination of ray-trace and diffraction modeling to describe coupling laser diodes to fibers and waveguides, 0000 (15 January 1996); doi: 10.1117/12.230082
Optoelectronic Packaging Elements
Proc. SPIE 2610, Diffractive optics for photonic packaging of laser diodes and fiber optics, 0000 (15 January 1996); doi: 10.1117/12.230083
Proc. SPIE 2610, Optimization of laser-to-fiber coupling to maximize manufacturing yield, 0000 (15 January 1996); doi: 10.1117/12.230084
Proc. SPIE 2610, Silicon microbench heater elements for packaging optoelectronic devices, 0000 (15 January 1996); doi: 10.1117/12.230085
High-Power Laser Diode Optoelectronic Packaging
Proc. SPIE 2610, Advances in high-power fiber-coupled laser diodes, 0000 (15 January 1996); doi: 10.1117/12.230087
Proc. SPIE 2610, High-efficiency coupling for high-aspect-ratio laser diodes, 0000 (15 January 1996); doi: 10.1117/12.230088
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