PROCEEDINGS VOLUME 2637
MICROELECTRONIC MANUFACTURING '95 | 25-27 OCTOBER 1995
Process, Equipment, and Materials Control in Integrated Circuit Manufacturing
MICROELECTRONIC MANUFACTURING '95
25-27 October 1995
Austin, TX, United States
Control through Equipment Design, Sensors, and Monitors
Proc. SPIE 2637, In-situ particle monitoring: today's technology drivers, 0000 (19 September 1995); doi: 10.1117/12.221302
Proc. SPIE 2637, Multiresolution pattern detector networks for controlling plasma etch reactors, 0000 (19 September 1995); doi: 10.1117/12.221321
Proc. SPIE 2637, Neural manufacturing: a novel concept for processing modeling, monitoring, and control, 0000 (19 September 1995); doi: 10.1117/12.221322
Proc. SPIE 2637, System integration for laser restructuring, 0000 (19 September 1995); doi: 10.1117/12.221323
Proc. SPIE 2637, Applications of laser scanning systems to deposited dielectrics, 0000 (19 September 1995); doi: 10.1117/12.221324
Proc. SPIE 2637, Elimination of monitor wafers in metal film process control, 0000 (19 September 1995); doi: 10.1117/12.221325
Proc. SPIE 2637, Materials delivery challenges in ULSI processing, 0000 (19 September 1995); doi: 10.1117/12.221326
In-Situ Process Monitoring and Control
Proc. SPIE 2637, In-situ process monitoring in metal deposition processes, 0000 (19 September 1995); doi: 10.1117/12.221303
Poster Session
Proc. SPIE 2637, Resistor, silicon dioxide, and nitrite films ion etching process: in-situ monitoring using photoemission testing, 0000 (19 September 1995); doi: 10.1117/12.221304
In-Situ Process Monitoring and Control
Proc. SPIE 2637, Sensing technologies for semiconductor process applications, 0000 (19 September 1995); doi: 10.1117/12.221305
Proc. SPIE 2637, In-situ wafer curvature measurements during rapid thermal annealing of Si(100) wafers, 0000 (19 September 1995); doi: 10.1117/12.221306
Proc. SPIE 2637, Control of CVD precursor purity for integrated circuit manufacture, 0000 (19 September 1995); doi: 10.1117/12.221307
Proc. SPIE 2637, Digital tester-based measurement methodology for process control in multilevel metallization systems, 0000 (19 September 1995); doi: 10.1117/12.221308
Proc. SPIE 2637, SCA and SPV in line monitoring, 0000 (19 September 1995); doi: 10.1117/12.221309
Proc. SPIE 2637, On-line exhaust gas analytics during plasma cleaning of PECVD facilities, 0000 (19 September 1995); doi: 10.1117/12.221310
Poster Session
Proc. SPIE 2637, Spectral ellipsometry on patterned wafers, 0000 (19 September 1995); doi: 10.1117/12.221311
Automation, Environment Control, and Models
Proc. SPIE 2637, Automation in semiconductor production minienvironments, flexibility and information flow, 0000 (19 September 1995); doi: 10.1117/12.221312
Poster Session
Proc. SPIE 2637, Evaluation of ULPA/prefilter media for the reduction of airborne boron contamination, 0000 (19 September 1995); doi: 10.1117/12.221313
Proc. SPIE 2637, Development of cost of ownership modeling at a semiconductor production facility, 0000 (19 September 1995); doi: 10.1117/12.221314
Proc. SPIE 2637, Self-learning intellectual system of expert diagnostics of technological malfunctions in ULSI manufacturing, 0000 (19 September 1995); doi: 10.1117/12.221315
Proc. SPIE 2637, Method of multilayer semiconductor structures cross section preparation for transmission electron microscopy, 0000 (19 September 1995); doi: 10.1117/12.221316
Automation, Environment Control, and Models
Proc. SPIE 2637, Relationships between process fundamentals, facility design, and production control of semiconductor manufacturing systems, 0000 (19 September 1995); doi: 10.1117/12.221317
Control through Equipment Design, Sensors, and Monitors
Proc. SPIE 2637, Effect of sputtering target crystallographic orientation on step coverage and collimation efficiency, 0000 (19 September 1995); doi: 10.1117/12.221318
Automation, Environment Control, and Models
Proc. SPIE 2637, Contamination control for ultrapure chemicals from microelectronics fab, 0000 (19 September 1995); doi: 10.1117/12.221319
Plenary Paper
Proc. SPIE 2637, Manufacturing challenges for sub-half-micron technologies, 0000 (19 September 1995); doi: 10.1117/12.221320
Back to Top