PROCEEDINGS VOLUME 2639
MICROMACHINING AND MICROFABRICATION | 23-25 OCTOBER 1995
Micromachining and Microfabrication Process Technology
IN THIS VOLUME

0 Sessions, 37 Papers, 0 Presentations
LIGA  (7)
MICROMACHINING AND MICROFABRICATION
23-25 October 1995
Austin, TX, United States
Bulk Silicon Micromachining Technology
Proc. SPIE 2639, Batch-dissolved wafer process for low-cost sensor applications, 0000 (19 September 1995); doi: 10.1117/12.221265
Proc. SPIE 2639, Fabrication of bulk silicon holding structures for mounting of optical fibers in v-grooves, 0000 (19 September 1995); doi: 10.1117/12.221286
Proc. SPIE 2639, Low-doped etch stopping for micromechanical device production, 0000 (19 September 1995); doi: 10.1117/12.221292
Wafer Bonding
Proc. SPIE 2639, Examination of glass-silicon and glass-glass bonding techniques for microfluidic systems, 0000 (19 September 1995); doi: 10.1117/12.221298
Proc. SPIE 2639, Patterned eutectic bonding with Al/Ge thin films for MEMS, 0000 (19 September 1995); doi: 10.1117/12.221299
MEMS Technology
Proc. SPIE 2639, MEMS infrastructure: the multiuser MEMS processes (MUMPs), 0000 (19 September 1995); doi: 10.1117/12.221300
Proc. SPIE 2639, Material and processing issues for the monolithic integration of microelectronics with surface-micromachined polysilicon sensors and actuators, 0000 (19 September 1995); doi: 10.1117/12.221301
Proc. SPIE 2639, SOI-based micromechanical process, 0000 (19 September 1995); doi: 10.1117/12.221266
Proc. SPIE 2639, Microchannel heat exchangers for advanced climate control, 0000 (19 September 1995); doi: 10.1117/12.221269
Proc. SPIE 2639, Fabrication issues in micromachined tunable optical filters, 0000 (19 September 1995); doi: 10.1117/12.221270
LIGA
Proc. SPIE 2639, Deep x-ray lithography for micromechanics, 0000 (19 September 1995); doi: 10.1117/12.221271
Proc. SPIE 2639, Injection molding of LIGA and LIGA-similar microstructures using filled and unfilled thermoplastics, 0000 (19 September 1995); doi: 10.1117/12.221272
Proc. SPIE 2639, Electroplated nickel mold insert for LIGA, 0000 (19 September 1995); doi: 10.1117/12.221273
Proc. SPIE 2639, Laser LIGA: a cost-saving process for flexible production of microstructures, 0000 (19 September 1995); doi: 10.1117/12.221274
Proc. SPIE 2639, Surface microcomponents fabricated by UV depth lithography and electroplating, 0000 (19 September 1995); doi: 10.1117/12.221275
Proc. SPIE 2639, Novel silicon fabrication process for high-aspect-ratio micromachined parts, 0000 (19 September 1995); doi: 10.1117/12.221276
MEMS Design and Testing
Proc. SPIE 2639, Laser vibrometer system to examine the dynamic modal analysis of resonant micromechanical structures, 0000 (19 September 1995); doi: 10.1117/12.221277
Proc. SPIE 2639, Design techniques for surface-micromachining MEMS processes, 0000 (19 September 1995); doi: 10.1117/12.221278
Etching Technologies
Proc. SPIE 2639, Advanced silicon etching using high-density plasmas, 0000 (19 September 1995); doi: 10.1117/12.221279
Proc. SPIE 2639, Dry micromachining of high-aspect-ratio Si for microsensors, 0000 (19 September 1995); doi: 10.1117/12.221280
Proc. SPIE 2639, Development of a deep silicon plasma etching process for sensor application, 0000 (19 September 1995); doi: 10.1117/12.221281
Proc. SPIE 2639, Micromachining and focused ion beam etching of Si for accelerometers, 0000 (19 September 1995); doi: 10.1117/12.221282
Micromachining Processes
Proc. SPIE 2639, Microstructuring by excimer laser, 0000 (19 September 1995); doi: 10.1117/12.221283
Proc. SPIE 2639, Micromolded structures for integrated optical sensors, 0000 (19 September 1995); doi: 10.1117/12.221284
Proc. SPIE 2639, Combined TMAH and HF sacrificial layer etching technique for surface micromachined devices, 0000 (19 September 1995); doi: 10.1117/12.221285
Proc. SPIE 2639, Novel low-stress SiO2-xFx film deposited by room-temperture liquid-phase deposition method, 0000 (19 September 1995); doi: 10.1117/12.221287
Proc. SPIE 2639, Study on mechanical characteristics of PZT thin film for sensors and actuators, 0000 (19 September 1995); doi: 10.1117/12.221288
Bulk Silicon Micromachining Technology
Proc. SPIE 2639, Tunneling tip protection for a bulk micromachined accelerometer, 0000 (19 September 1995); doi: 10.1117/12.221289
Micromachining Processes
Proc. SPIE 2639, Deposition of thick zinc oxide films with a high resistivity, 0000 (19 September 1995); doi: 10.1117/12.221290
MEMS Technology
Proc. SPIE 2639, Mechanical loss measurements of vacuum-operated, single-crystal silicon microresonators, 0000 (19 September 1995); doi: 10.1117/12.221291
LIGA
Proc. SPIE 2639, Characterization of electroformed nickel microstructures, 0000 (19 September 1995); doi: 10.1117/12.221293
Micromachining Processes
Proc. SPIE 2639, Novel high-power Nd:YLF laser for CVD-diamond micromachining, 0000 (19 September 1995); doi: 10.1117/12.221294
MEMS Technology
Proc. SPIE 2639, Infrastructure considerations for the emerging MEMS markets, 0000 (19 September 1995); doi: 10.1117/12.221295
Etching Technologies
Proc. SPIE 2639, Etching technology and applications for through-the-wafer silicon etching, 0000 (19 September 1995); doi: 10.1117/12.221296
MEMS Technology
Proc. SPIE 2639, Out-of-plane microstructures using stress engineering of thin films, 0000 (19 September 1995); doi: 10.1117/12.221297
Plenary Papers
Proc. SPIE 2639, Projection displays and MEMS: timely convergence for a bright future, 0000 (19 September 1995); doi: 10.1117/12.221267
Proc. SPIE 2639, Recent trends in silicon micromachining technology, 0000 (19 September 1995); doi: 10.1117/12.221268
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