PROCEEDINGS VOLUME 2691
PHOTONICS WEST '96 | 27 JANUARY - 2 FEBRUARY 1996
Optoelectronic Packaging
PHOTONICS WEST '96
27 January - 2 February 1996
San Jose, CA, United States
Guided Wave Interconnects
Proc. SPIE 2691, Recent developments in polymer waveguide technology and applications for data link and optical interconnect systems, 0000 (29 March 1996); doi: 10.1117/12.236908
Proc. SPIE 2691, Three-dimensional packaging of very large scale integrated optics (VLSIO) for high-complexity optical systems, 0000 (29 March 1996); doi: 10.1117/12.236921
Proc. SPIE 2691, MCM board level optical interconnects using passive polymer waveguides with hybrid optical and electrical multichip module packaging, 0000 (29 March 1996); doi: 10.1117/12.236922
Proc. SPIE 2691, Coupling of VCSEL array into multimode polymer waveguides, 0000 (29 March 1996); doi: 10.1117/12.236923
Advanced Packaging and Alignment Methods I
Proc. SPIE 2691, Applications of circuit transfer technology to displays and optoelectronic devices, 0000 (29 March 1996); doi: 10.1117/12.236924
Proc. SPIE 2691, Monolithic integration of refractive lenses with vertical-cavity lasers and detectors for optical interconnections, 0000 (29 March 1996); doi: 10.1117/12.236925
Proc. SPIE 2691, Fluxless Sn-Ag solder ball formation for flip-chip application, 0000 (29 March 1996); doi: 10.1117/12.236926
Proc. SPIE 2691, MACII optical connectors for printed circuit board input/output, 0000 (29 March 1996); doi: 10.1117/12.236927
Packaging for Optical Switching Applications
Proc. SPIE 2691, Recent progress on silica-based optical switches and free-space optical switches, 0000 (29 March 1996); doi: 10.1117/12.236909
Proc. SPIE 2691, Optomechanical design of a robust free-space optical switching system, 0000 (29 March 1996); doi: 10.1117/12.236910
Proc. SPIE 2691, Alignment tolerancing of free-space MCM-to-MCM optical interconnects, 0000 (29 March 1996); doi: 10.1117/12.236911
Advanced Packaging and Alignment Methods II
Proc. SPIE 2691, rf optoelectronic transmitter and receiver arrays on silicon wafer boards, 0000 (29 March 1996); doi: 10.1117/12.236912
Proc. SPIE 2691, Micromachined silicon structures for single-mode passive alignment, 0000 (29 March 1996); doi: 10.1117/12.236913
Proc. SPIE 2691, Single-mode array optoelectronic packaging based on actively aligned planar optical waveguides, 0000 (29 March 1996); doi: 10.1117/12.236914
Proc. SPIE 2691, Diffraction loss and optical crosstalk in hybrid receiver for free-space optical interconnections, 0000 (29 March 1996); doi: 10.1117/12.236915
Proc. SPIE 2691, Universal detachable optical connector for military and commercial aerospace fiber optic modules, 0000 (29 March 1996); doi: 10.1117/12.236916
Reliability and Thermal Issues
Proc. SPIE 2691, Thermal considerations of free-space optical interconnects using VCSEL-based smart pixel arrays, 0000 (29 March 1996); doi: 10.1117/12.236917
Proc. SPIE 2691, Thermal shift in the exciton absorption maxima as a function of the chip package design, 0000 (29 March 1996); doi: 10.1117/12.236918
Proc. SPIE 2691, Thermal resistance of etched-pillar vertical-cavity surface-emitting laser diodes, 0000 (29 March 1996); doi: 10.1117/12.236919
Proc. SPIE 2691, Modeling VCSEL characteristics using device and package models, 0000 (29 March 1996); doi: 10.1117/12.236920
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