PROCEEDINGS VOLUME 2879
MICROMACHINING AND MICROFABRICATION '96 | 14-15 OCTOBER 1996
Micromachining and Microfabrication Process Technology II
IN THIS VOLUME

0 Sessions, 40 Papers, 0 Presentations
MICROMACHINING AND MICROFABRICATION '96
14-15 October 1996
Austin, TX, United States
Etching Technology
Proc. SPIE 2879, Micromachining inertial instruments, 0000 (23 September 1996); doi: 10.1117/12.251201
Proc. SPIE 2879, Dry etching and micromachining of precision silicon components, 0000 (23 September 1996); doi: 10.1117/12.251212
Proc. SPIE 2879, Dry etching and boron diffusion of heavily doped high-aspect ratio Si trenches, 0000 (23 September 1996); doi: 10.1117/12.251222
Proc. SPIE 2879, Fabrication of piezoresistive-sensed AFM cantilever probe with integrated tip, 0000 (23 September 1996); doi: 10.1117/12.251232
Proc. SPIE 2879, Influence of gas composition and the mask materials on the etch profile of dry-etched structures in silicon, 0000 (23 September 1996); doi: 10.1117/12.251236
Micromachining Processes I
Proc. SPIE 2879, Chemical-mechanical polishing: enhancing the manufacturability of MEMS, 0000 (23 September 1996); doi: 10.1117/12.251237
Proc. SPIE 2879, Characterization of membrane curvature in micromachined silicon accelerometers and gyroscopes using optical interferometry, 0000 (23 September 1996); doi: 10.1117/12.251238
Proc. SPIE 2879, Characterization of residual stress in metallic films on silicon with micromechanical devices, 0000 (23 September 1996); doi: 10.1117/12.251239
Proc. SPIE 2879, Bipolar compatible epitaxial poly for surface-micromachined smart sensors, 0000 (23 September 1996); doi: 10.1117/12.251240
Proc. SPIE 2879, Polysilicon microswitch for planar antenna phase shifters, 0000 (23 September 1996); doi: 10.1117/12.251202
LIGA and Deep-Resist
Proc. SPIE 2879, Micromolding: a powerful tool for large-scale production of precise microstructures, 0000 (23 September 1996); doi: 10.1117/12.251203
Proc. SPIE 2879, Fabrication of LIGA mold inserts using a modified procedure, 0000 (23 September 1996); doi: 10.1117/12.251204
Proc. SPIE 2879, Influence of resist-baking on the pattern quality of thick photoresists, 0000 (23 September 1996); doi: 10.1117/12.251205
Proc. SPIE 2879, Chemically amplified deep UV resists for micromachining, 0000 (23 September 1996); doi: 10.1117/12.251206
Proc. SPIE 2879, Simple technology for fabricating micromechanical 3D structures using electroplating without photoresist mold, 0000 (23 September 1996); doi: 10.1117/12.251207
Micromachining Processes II
Proc. SPIE 2879, Silicon micromachining technologies: future needs and challenges, 0000 (23 September 1996); doi: 10.1117/12.251208
Proc. SPIE 2879, Silicon-micromachined poppet valve with an octagonal diaphragm, 0000 (23 September 1996); doi: 10.1117/12.251209
Proc. SPIE 2879, Supercritical carbon dioxide solvent extraction from surface-micromachined micromechanical structures, 0000 (23 September 1996); doi: 10.1117/12.251210
Proc. SPIE 2879, Fully self-aligned nickel wobble micromotors fabricated at low temperature, 0000 (23 September 1996); doi: 10.1117/12.251211
Proc. SPIE 2879, Aluminum passivation in saturated TMAHW solutions for IC-compatible microstructures and device isolation, 0000 (23 September 1996); doi: 10.1117/12.251213
Micromachining Processes III
Proc. SPIE 2879, Invar electrodeposition for MEMS application, 0000 (23 September 1996); doi: 10.1117/12.251214
Proc. SPIE 2879, Selective SiO2-xFx growth with liquid-phase deposition for MEMS technology, 0000 (23 September 1996); doi: 10.1117/12.251215
Proc. SPIE 2879, Test structures for nondestructive in-situ control of the anodic bonding quality, 0000 (23 September 1996); doi: 10.1117/12.251216
MEMS Technology
Proc. SPIE 2879, Fabrication and performance of MARS optical modulators for fiber-to-the-home systems, 0000 (23 September 1996); doi: 10.1117/12.251217
Proc. SPIE 2879, Characterization of the embedded micromechanical device approach to the monolithic integration of MEMS with CMOS, 0000 (23 September 1996); doi: 10.1117/12.251218
Proc. SPIE 2879, Collective fabrication of gallium-arsenide-based microsystems, 0000 (23 September 1996); doi: 10.1117/12.251219
Proc. SPIE 2879, Approach for semicustom integrated-sensor system manufacturing in a commercial CMOS technology, 0000 (23 September 1996); doi: 10.1117/12.251220
Proc. SPIE 2879, Microelectro discharge machining as a technology in micromachining, 0000 (23 September 1996); doi: 10.1117/12.251221
Etching Technology
Proc. SPIE 2879, Characterization and application of deep Si trench etching, 0000 (23 September 1996); doi: 10.1117/12.251223
Proc. SPIE 2879, Release-etch modeling for complex surface-micromachined structures, 0000 (23 September 1996); doi: 10.1117/12.251224
MEMS Technology
Proc. SPIE 2879, Application of porous Si micromachining technology in the calorimetric sensor, 0000 (23 September 1996); doi: 10.1117/12.251225
Micromachining Processes III
Proc. SPIE 2879, Electrodeposition of 3D microstructures without molds, 0000 (23 September 1996); doi: 10.1117/12.251226
Proc. SPIE 2879, Assembly and interconnection technology for micromechanical structures using anisotropic conductive film, 0000 (23 September 1996); doi: 10.1117/12.251227
Proc. SPIE 2879, Eutectic bonds on wafer scale by thin film multilayers, 0000 (23 September 1996); doi: 10.1117/12.251228
Proc. SPIE 2879, Angular alignment for wafer bonding, 0000 (23 September 1996); doi: 10.1117/12.251229
MEMS Technology
Proc. SPIE 2879, Development of metal-forming machine for fabricating micromechanical components, 0000 (23 September 1996); doi: 10.1117/12.251230
Proc. SPIE 2879, Micromachine scanning tunneling microscope for nanoscale characterization and fabrication, 0000 (23 September 1996); doi: 10.1117/12.251231
Plenary Papers
Proc. SPIE 2879, Application of micromachining technology to optical devices and systems, 0000 (23 September 1996); doi: 10.1117/12.251233
Proc. SPIE 2879, Commercializing MEMS--too fast or too slow?, 0000 (23 September 1996); doi: 10.1117/12.251234
Etching Technology
Proc. SPIE 2879, High-etch-rate anisotropic deep silicon plasma etching for the fabrication of microsensors, 0000 (23 September 1996); doi: 10.1117/12.251235
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