PROCEEDINGS VOLUME 2880
MICROMACHINING AND MICROFABRICATION '96 | 14-15 OCTOBER 1996
Microlithography and Metrology in Micromachining II
MICROMACHINING AND MICROFABRICATION '96
14-15 October 1996
Austin, TX, United States
Basic Test Structures and Test Methods
Proc. SPIE 2880, Review on the importance of measurement technique in micromachine technology, 0000 (13 September 1996); doi: 10.1117/12.250942
Proc. SPIE 2880, Material property measurements of micromechanical polysilicon beams, 0000 (13 September 1996); doi: 10.1117/12.250952
Proc. SPIE 2880, Analysis of fixed-fixed beam test structures, 0000 (13 September 1996); doi: 10.1117/12.250961
Proc. SPIE 2880, Measurements of fracture strength and Young's modulus of surface-micromachined polysilicon, 0000 (13 September 1996); doi: 10.1117/12.250967
Proc. SPIE 2880, uS-THERMANAL: an efficient thermal simulation tool for microsystem elements and MCM's, 0000 (13 September 1996); doi: 10.1117/12.250968
Advanced Test Structures and Test Methods
Proc. SPIE 2880, New test structures and techniques for measurement of mechanical properties of MEMS materials, 0000 (13 September 1996); doi: 10.1117/12.250969
Proc. SPIE 2880, Investigation on the frequency response characteristics of an instrument for laser vibrometry and laser displacementmetry, 0000 (13 September 1996); doi: 10.1117/12.250970
Proc. SPIE 2880, Microstructures designed for shock robustness, 0000 (13 September 1996); doi: 10.1117/12.250971
Proc. SPIE 2880, Mechanical characterization of shape memory micromaterials, 0000 (13 September 1996); doi: 10.1117/12.250972
Proc. SPIE 2880, Davies bar as the reference for impact acceleration metrology, 0000 (13 September 1996); doi: 10.1117/12.250943
Dimensional Metrology, Mask Making, and Imaging
Proc. SPIE 2880, Fabrication of composite x-ray masks by micromilling, 0000 (13 September 1996); doi: 10.1117/12.250944
Proc. SPIE 2880, New certified length scale for microfabrication metrology, 0000 (13 September 1996); doi: 10.1117/12.250945
Proc. SPIE 2880, Critical dimension metrology for MEMS processes using electrical techniques, 0000 (13 September 1996); doi: 10.1117/12.250946
Deep X-Ray Lithography
Proc. SPIE 2880, Multiexposure capability development for deep x-ray lithography for MEMS, 0000 (13 September 1996); doi: 10.1117/12.250947
Proc. SPIE 2880, Beamline and exposure station for deep x-ray lithography at the advanced photon source, 0000 (13 September 1996); doi: 10.1117/12.250948
Proc. SPIE 2880, Cyanoacrylate bonding of thick resists for LIGA, 0000 (13 September 1996); doi: 10.1117/12.250949
Proc. SPIE 2880, Temperature rise in thick PMMA resists during x-ray exposure, 0000 (13 September 1996); doi: 10.1117/12.250950
Proc. SPIE 2880, LIGA-based family of tips for scanning probe applications, 0000 (13 September 1996); doi: 10.1117/12.250951
Design and Fabrication
Proc. SPIE 2880, Dimensional variation and roughness of LIGA fabricated microstructures, 0000 (13 September 1996); doi: 10.1117/12.250953
Proc. SPIE 2880, Design, fabrication, and testing of polysilicon microheaters in silicon, 0000 (13 September 1996); doi: 10.1117/12.250954
Proc. SPIE 2880, Multilevel 3D patterning of stacked PMMA sheets for x-ray microlithography, 0000 (13 September 1996); doi: 10.1117/12.250955
Proc. SPIE 2880, Microsystem design framework based on tool adaptations and library developments, 0000 (13 September 1996); doi: 10.1117/12.250956
Poster Session
Proc. SPIE 2880, Fabrication of microstructures by ion beam micromachining, 0000 (13 September 1996); doi: 10.1117/12.250957
Proc. SPIE 2880, Lateral force microscopy using cantilevers with integrated Wheatstone bridge piezoresistive deflection sensor, 0000 (13 September 1996); doi: 10.1117/12.250958
Proc. SPIE 2880, Cantilever with integrated Wheatstone bridge piezoresistive deflection sensor: analysis of force interaction measurement sensitivity, 0000 (13 September 1996); doi: 10.1117/12.250959
Proc. SPIE 2880, Measurements of stress-strain diagrams of thin films by a developed tensile machine, 0000 (13 September 1996); doi: 10.1117/12.250960
Proc. SPIE 2880, Transient thermal analysis of micromachined silicon bridge, 0000 (13 September 1996); doi: 10.1117/12.250962
Proc. SPIE 2880, Fabrication of mm-wave undulator/linear accelerator cavities using deep x-ray lithography, 0000 (13 September 1996); doi: 10.1117/12.250963
Design and Fabrication
Proc. SPIE 2880, New array lens optical system for large-area micromachining lithography, 0000 (13 September 1996); doi: 10.1117/12.250964
Plenary Papers
Proc. SPIE 2880, Application of micromachining technology to optical devices and systems, 0000 (13 September 1996); doi: 10.1117/12.250965
Proc. SPIE 2880, Commercializing MEMS--too fast or too slow?, 0000 (13 September 1996); doi: 10.1117/12.250966
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