PROCEEDINGS VOLUME 3005
PHOTONICS WEST '97 | 8-14 FEBRUARY 1997
Optoelectronic Interconnects and Packaging IV
PHOTONICS WEST '97
8-14 February 1997
San Jose, CA, United States
Optoelectronic Packaging I
Proc. SPIE 3005, Optoelectronic backplane interconnect technology development (POINT), 0000 (4 April 1997); doi: 10.1117/12.271090
Proc. SPIE 3005, Low-cost integrated-optic fiber couplers, 0000 (4 April 1997); doi: 10.1117/12.271098
Proc. SPIE 3005, Use of polymer waveguides for optical interconnection in high-speed communication and signal processing systems, 0000 (4 April 1997); doi: 10.1117/12.271107
Proc. SPIE 3005, Thermal management of free space optical interconnects, 0000 (4 April 1997); doi: 10.1117/12.271108
Proc. SPIE 3005, Alignment-tolerant lasers and silicon waferboard integration, 0000 (4 April 1997); doi: 10.1117/12.271109
Optoelectronic Packaging II
Proc. SPIE 3005, Optical submount development for high-reliability/performance applications, 0000 (4 April 1997); doi: 10.1117/12.271110
Proc. SPIE 3005, Reliability of commercial optical interconnect systems, 0000 (4 April 1997); doi: 10.1117/12.271111
Proc. SPIE 3005, Automated method for fabrication of parallel multifiber cable assemblies with integral connector components, 0000 (4 April 1997); doi: 10.1117/12.271073
Proc. SPIE 3005, Integrated polymer waveguide mode size transformer with a vertical taper for improved fiber coupling, 0000 (4 April 1997); doi: 10.1117/12.271074
Proc. SPIE 3005, Effects of interface electronics on the performance of VCSEL-based optical interconnect systems, 0000 (4 April 1997); doi: 10.1117/12.271075
Proc. SPIE 3005, Optimization of diffractive optical interconnect elements for highperformance optoelectronic computing modules, 0000 (4 April 1997); doi: 10.1117/12.271076
Proc. SPIE 3005, Low-power multichip module and board-level links for data transfer, 0000 (4 April 1997); doi: 10.1117/12.271077
MCM and Backplane Optical Interconnects
Proc. SPIE 3005, Recent progress in short-distance optical interconnects, 0000 (4 April 1997); doi: 10.1117/12.271078
Proc. SPIE 3005, New processing approach for grafting optoelectronic devices and applications to multichip modules, 0000 (4 April 1997); doi: 10.1117/12.271079
Proc. SPIE 3005, Polymer waveguide-based high-speed clock signal distribution system, 0000 (4 April 1997); doi: 10.1117/12.271080
Proc. SPIE 3005, Unidirectional surface-normal waveguide grating couplers for wafer-scale MCM interconnect, 0000 (4 April 1997); doi: 10.1117/12.271081
Guided-wave Optoelectronic Interconnects I
Proc. SPIE 3005, Dispersion-enhanced wavelength division multiplexing, 0000 (4 April 1997); doi: 10.1117/12.271082
Proc. SPIE 3005, Ultra-low-loss polymeric waveguides for optical interconnection, 0000 (4 April 1997); doi: 10.1117/12.271083
Proc. SPIE 3005, Characterization of poly(phenylsilsequioxane) for planar integrated optical waveguide applications, 0000 (4 April 1997); doi: 10.1117/12.271084
Proc. SPIE 3005, Design of an electro-optic directional coupler with four sections poled in four perpendicular directions, 0000 (4 April 1997); doi: 10.1117/12.271085
Guided-wave Optoelectronic Interconnects II
Proc. SPIE 3005, Solid state polymerization reactions for passive and active guided-wave components, 0000 (4 April 1997); doi: 10.1117/12.271086
Proc. SPIE 3005, Parallel-optical interconnect development at HP Laboratories, 0000 (4 April 1997); doi: 10.1117/12.271087
Proc. SPIE 3005, Compression-molded three-dimensional tapered optical polymeric waveguides for optoelectronic packaging, 0000 (4 April 1997); doi: 10.1117/12.271088
Proc. SPIE 3005, Intraplane to interplane optical interconnects using LiNbO3-based electro-optically modulated switch array for high-density holographic memory, 0000 (4 April 1997); doi: 10.1117/12.271089
Proc. SPIE 3005, Equal fan-out optical interconnects using DuPont photopolymer films, 0000 (4 April 1997); doi: 10.1117/12.271091
Proc. SPIE 3005, Polyguide polymeric technology for optical interconnect circuits and components, 0000 (4 April 1997); doi: 10.1117/12.271092
Smart Pixel Array
Proc. SPIE 3005, Experimental performance of an ATM-based buffered hyperplane CMOS-SEED smart pixel array, 0000 (4 April 1997); doi: 10.1117/12.271093
Proc. SPIE 3005, Design and fabrication of passive optical polymer waveguide components for multimode parallel optical links, 0000 (4 April 1997); doi: 10.1117/12.271094
Proc. SPIE 3005, Demonstration of a massively parallel bidirectional crosspoint switch with optical control, 0000 (4 April 1997); doi: 10.1117/12.271095
Proc. SPIE 3005, Oxide-defined VCSEL-based smart pixels for the optical database filter, 0000 (4 April 1997); doi: 10.1117/12.271096
Transceiver Design and Demonstration
Proc. SPIE 3005, High-speed optical transceiver and routing switch using VCSEL-based integrated optoelectronics, 0000 (4 April 1997); doi: 10.1117/12.271097
Innovative Architectures
Proc. SPIE 3005, Versatile processor arrays based on segmented optical buses, 0000 (4 April 1997); doi: 10.1117/12.271099
Proc. SPIE 3005, Processor arrays with asynchronous TDM optical buses, 0000 (4 April 1997); doi: 10.1117/12.271100
Proc. SPIE 3005, Optoelectronic design of the simultaneous optical multiprocessor exchange bus (SOME-Bus), 0000 (4 April 1997); doi: 10.1117/12.271101
Transceiver Design and Demonstration
Proc. SPIE 3005, 850 nm proton-implanted 8 x 8 VCSEL array design and performance measurements, 0000 (4 April 1997); doi: 10.1117/12.271102
Proc. SPIE 3005, High-speed CMOS laser drivers, 0000 (4 April 1997); doi: 10.1117/12.271103
Proc. SPIE 3005, 64-Gbit/s GaAs integrated DANE receiver/laser driver, 0000 (4 April 1997); doi: 10.1117/12.271104
Proc. SPIE 3005, Wideband four-channel optical transmitter package using vertical cavity surface emitting laser arrays, 0000 (4 April 1997); doi: 10.1117/12.271105
Guided-wave Optoelectronic Interconnects II
Proc. SPIE 3005, Shrinkage correction of volume phase holograms for optical interconnects, 0000 (4 April 1997); doi: 10.1117/12.271106
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