PROCEEDINGS VOLUME 3046
SMART STRUCTURES AND MATERIALS '97 | 3-6 MARCH 1997
Smart Structures and Materials 1997: Smart Electronics and MEMS
SMART STRUCTURES AND MATERIALS '97
3-6 March 1997
San Diego, CA, United States
Microsensors and Microactuators
Proc. SPIE 3046, Micromachined pressure sensors: review and recent developments, 0000 (19 June 1997); doi: 10.1117/12.276606
Proc. SPIE 3046, Microfabricated ice-detection sensor, 0000 (19 June 1997); doi: 10.1117/12.276618
Proc. SPIE 3046, High-G MEMS integrated accelerometer, 0000 (19 June 1997); doi: 10.1117/12.276628
Micromachining and Fabrication
Proc. SPIE 3046, Microactuator fabricated by powder particle assemblage using microprobe technology, 0000 (19 June 1997); doi: 10.1117/12.276629
Proc. SPIE 3046, Fabrication of IC-compatible capacitive sensors by polymer processing, 0000 (19 June 1997); doi: 10.1117/12.276630
Smart Skin Antenna I
Proc. SPIE 3046, Microstrip antennas for wireless communication in smart structures and active damping, 0000 (19 June 1997); doi: 10.1117/12.276631
Proc. SPIE 3046, Design and development of smart skin conformal antenna with MEMS structural sensors and actuators, 0000 (19 June 1997); doi: 10.1117/12.276632
Proc. SPIE 3046, Design and testing of an active polyvinylidene fluoride aperture antenna, 0000 (19 June 1997); doi: 10.1117/12.276597
Microcomponents and Devices
Proc. SPIE 3046, High-performance low-cost electronics for switched-capacitance devices, 0000 (19 June 1997); doi: 10.1117/12.276598
Proc. SPIE 3046, Clock multiplier with a range up to 370 MHz for video/display signal processing, 0000 (19 June 1997); doi: 10.1117/12.276599
Proc. SPIE 3046, Gray-scale deformable grating spatial light modulator for high-speed optical processing, 0000 (19 June 1997); doi: 10.1117/12.276600
Proc. SPIE 3046, Forging solid state microactuators through the merging of smart material and microelectromechanical systems, 0000 (19 June 1997); doi: 10.1117/12.276601
Proc. SPIE 3046, Application of a plastic diaphragm for a silicon micropump, 0000 (19 June 1997); doi: 10.1117/12.276602
Keynote Address
Proc. SPIE 3046, Application of PZT thin films in microelectromechanical systems, 0000 (19 June 1997); doi: 10.1117/12.276603
Smart Skin Antenna II
Proc. SPIE 3046, Structural finite-element modeling strategies for conformal load-bearing antenna structure (CLAS) (Air Force contract F33615-C-93-3200), 0000 (19 June 1997); doi: 10.1117/12.276604
Proc. SPIE 3046, Prototype testing and evaluation of a structurally integrated conformal antenna installation in the vertical tail of a military aircraft, 0000 (19 June 1997); doi: 10.1117/12.276605
Proc. SPIE 3046, Conformal load-bearing antenna structures (CLAS): initiative for multiple military and commercial applications, 0000 (19 June 1997); doi: 10.1117/12.276607
IDT Microsensors
Proc. SPIE 3046, Surface acoustic wave microsensors and applications, 0000 (19 June 1997); doi: 10.1117/12.276609
Proc. SPIE 3046, IDT, SAW, and MEMS sensors for measuring deflection, acceleration, and ice detection of aircraft, 0000 (19 June 1997); doi: 10.1117/12.276610
Proc. SPIE 3046, Wireless remotely readable microaccelerometer, 0000 (19 June 1997); doi: 10.1117/12.276611
MEMS and Electronics Integration
Proc. SPIE 3046, Integration of LIGA structures with CMOS circuitary, 0000 (19 June 1997); doi: 10.1117/12.276612
Proc. SPIE 3046, Critical issues for the application of integrated MEMS/CMOS technologies to inertial measurement units, 0000 (19 June 1997); doi: 10.1117/12.276613
Proc. SPIE 3046, Integrated force array: interface to external systems, 0000 (19 June 1997); doi: 10.1117/12.276614
Proc. SPIE 3046, ASIC chips and their integration to smart devices, 0000 (19 June 1997); doi: 10.1117/12.276615
Proc. SPIE 3046, Overview of micromachined platforms for thermal sensing and gas detection, 0000 (19 June 1997); doi: 10.1117/12.276616
Smart Electronics and Controllers
Proc. SPIE 3046, Low-cost MCM-D fabrication and assembly from MIDAS: the multichip module interconnect designer's access service, 0000 (19 June 1997); doi: 10.1117/12.276617
Proc. SPIE 3046, Compact lossless synthetic network drive/controllers for active devices technologies, 0000 (19 June 1997); doi: 10.1117/12.276619
Proc. SPIE 3046, Design and implementation of digital controllers for smart structures using field-programmable gate arrays, 0000 (19 June 1997); doi: 10.1117/12.276620
Proc. SPIE 3046, Measurement and calibration of dynamic performance of piezoelectric micromotor, 0000 (19 June 1997); doi: 10.1117/12.276621
Poster Session
Proc. SPIE 3046, Resonant frequencies of an elliptical microstrip antenna, 0000 (19 June 1997); doi: 10.1117/12.276622
Proc. SPIE 3046, Direct bonding between spacer and field emitter array using an electron-beam-evaporated interlayer, 0000 (19 June 1997); doi: 10.1117/12.276623
Proc. SPIE 3046, Anodic bonding technique for silicon-to-ITO coated glass bonding, 0000 (19 June 1997); doi: 10.1117/12.276624
Proc. SPIE 3046, Modified low-temperture direct bonding method for vacuum microelectronics application, 0000 (19 June 1997); doi: 10.1117/12.276625
Microcomponents and Devices
Proc. SPIE 3046, TiNi shape-memory alloy actuated micropump with fluid isolation, 0000 (19 June 1997); doi: 10.1117/12.276626
Smart Electronics and Controllers
Proc. SPIE 3046, Low-cost patterning and etching systems for production of microelectronic modules, 0000 (19 June 1997); doi: 10.1117/12.276627
Plenary Paper
Proc. SPIE 3046, Smarter Vehicles, 0000 (19 June 1997); doi: 10.1117/12.276608
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