PROCEEDINGS VOLUME 3184
ISMA '97 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND ASSEMBLY | 23-26 JUNE 1997
Microelectronic Packaging and Laser Processing
ISMA '97 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND ASSEMBLY
23-26 June 1997
Singapore, Singapore
MCM and BGA Packaging
Proc. SPIE 3184, Developments of optimum flip-chip bonding process, 0000 (18 August 1997); doi: 10.1117/12.280566
Proc. SPIE 3184, Low-cost flexible ball-grid-array multichip module technology, 0000 (18 August 1997); doi: 10.1117/12.280574
Proc. SPIE 3184, Processing mechanics for flip-chip assembly, 0000 (18 August 1997); doi: 10.1117/12.280580
Packaging Materials and Reliability
Proc. SPIE 3184, Reliability study of microelectronic packaging assemblies by a multiaxial submicron fatigue tester, 0000 (18 August 1997); doi: 10.1117/12.280581
Proc. SPIE 3184, Optimizing thermal performance-cost trade-off, 0000 (18 August 1997); doi: 10.1117/12.280582
Proc. SPIE 3184, Controlled thickness and dielectric constant titanium-doped SiO2 thin films on silicon by sol gel process, 0000 (18 August 1997); doi: 10.1117/12.280583
Proc. SPIE 3184, Preparation, structure, and properties of aluminium nitride (AIN) reinforced polymer composites: alternative substrate materials for microelectronic packaging, 0000 (18 August 1997); doi: 10.1117/12.280556
Proc. SPIE 3184, Development of the IBIC (ion-beam-induced charge) technique for IC failure analysis, 0000 (18 August 1997); doi: 10.1117/12.280557
Clocks and Optical Interconnects
Proc. SPIE 3184, Electrical performance analysis of IC package for the high-end memory device, 0000 (18 August 1997); doi: 10.1117/12.280558
Proc. SPIE 3184, Compression-molded three-dimensional tapered polymeric waveguides for low-loss optoelectronic packaging, 0000 (18 August 1997); doi: 10.1117/12.280559
Proc. SPIE 3184, Hybrid bidirectional optical backplane with multiple bus lines, 0000 (18 August 1997); doi: 10.1117/12.280560
Proc. SPIE 3184, Electroluminescent and photosensitive films prepared by DTC-CVD method, 0000 (18 August 1997); doi: 10.1117/12.280561
Interconnects: Reversible, Wafer Level, and Chip Level
Proc. SPIE 3184, Reversible low-temperature direct bonds for fabrication of three-dimensional microelectronic structures, 0000 (18 August 1997); doi: 10.1117/12.280562
Proc. SPIE 3184, Low-temperature direct bonding using pressure and temperature, 0000 (18 August 1997); doi: 10.1117/12.280563
Proc. SPIE 3184, Comparison of experimental and theoretical curvature considerations for direct wafer bonding, 0000 (18 August 1997); doi: 10.1117/12.280565
Laser Surface Treatment
Proc. SPIE 3184, Optimization of 200-W excimer laser for TFT annealing, 0000 (18 August 1997); doi: 10.1117/12.280567
Proc. SPIE 3184, Audible acoustic wave real-time monitoring in laser processing of microelectronic materials, 0000 (18 August 1997); doi: 10.1117/12.280568
Proc. SPIE 3184, Cleaning force in laser cleaning of silicon substrates, 0000 (18 August 1997); doi: 10.1117/12.280569
Proc. SPIE 3184, Excimer laser irradiation on NiP surface, 0000 (18 August 1997); doi: 10.1117/12.280570
Laser Micromachining
Proc. SPIE 3184, Excimer laser patterning of thick and thin films for high-density packaging, 0000 (18 August 1997); doi: 10.1117/12.280571
Proc. SPIE 3184, Scribing of ITO coatings using a Q-switched Nd:YAG laser, 0000 (18 August 1997); doi: 10.1117/12.280572
Proc. SPIE 3184, Excimer laser in industrial material processing, 0000 (18 August 1997); doi: 10.1117/12.280573
Laser Processes and Modeling
Proc. SPIE 3184, Excimer laser drilling of polymers, 0000 (18 August 1997); doi: 10.1117/12.280575
Proc. SPIE 3184, Numerical prediction of etched profile in pyrolytic laser etching, 0000 (18 August 1997); doi: 10.1117/12.280576
Proc. SPIE 3184, Influence of laser deposition conditions on optical properties of silicon composite films, 0000 (18 August 1997); doi: 10.1117/12.280577
Proc. SPIE 3184, Field electron emission from highly graphitic diamond films, 0000 (18 August 1997); doi: 10.1117/12.280578
Packaging Materials and Reliability
Proc. SPIE 3184, Nonpost mold cure compound, 0000 (18 August 1997); doi: 10.1117/12.289503
MCM and BGA Packaging
Proc. SPIE 3184, Hydrogen ion cut technology combined with low-temperature direct bonding, 0000 (18 August 1997); doi: 10.1117/12.280579
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