PROCEEDINGS VOLUME 3223
MICROMACHINING AND MICROFABRICATION | 29-30 SEPTEMBER 1997
Micromachining and Microfabrication Process Technology III
IN THIS VOLUME

0 Sessions, 36 Papers, 0 Presentations
MICROMACHINING AND MICROFABRICATION
29-30 September 1997
Austin, TX, United States
Etching Technology
Proc. SPIE 3223, Microfabrication technologies for microsystems, 0000 (5 September 1997); doi: 10.1117/12.284466
Proc. SPIE 3223, SAMPLE (Sandia agile MEMS prototyping, layout tools, and education), 0000 (5 September 1997); doi: 10.1117/12.284476
Proc. SPIE 3223, IC-compatible fabrication of through-wafer conductive vias, 0000 (5 September 1997); doi: 10.1117/12.284487
Proc. SPIE 3223, Fabrication techniques and their application to produce novel micromachined structures and devices using excimer laser projection, 0000 (5 September 1997); doi: 10.1117/12.284497
Proc. SPIE 3223, Micromachining of metals and ceramics by nano- and picosecond laser radiation, 0000 (5 September 1997); doi: 10.1117/12.284498
MEMS Technology I
Proc. SPIE 3223, Precise micronanomachining for advanced sensors, 0000 (5 September 1997); doi: 10.1117/12.284499
Proc. SPIE 3223, Wide-bandwidth silicon nitride membrane microphones, 0000 (5 September 1997); doi: 10.1117/12.284500
Proc. SPIE 3223, Development of a silicon microprobe for NO detection, 0000 (5 September 1997); doi: 10.1117/12.284501
Proc. SPIE 3223, Wet chemical isotropic etching procedures of silicon: a possibility for the production of deep-structured microcomponents, 0000 (5 September 1997); doi: 10.1117/12.284467
LIGA and Related Technology
MEMS Materials
Proc. SPIE 3223, Optical applications of silicon micromachining technology, 0000 (5 September 1997); doi: 10.1117/12.284472
Proc. SPIE 3223, Comprehensive study of processing parameters influencing the stress and stress gradient of thick polysilicon layers, 0000 (5 September 1997); doi: 10.1117/12.284473
Proc. SPIE 3223, Optical interferometric characterization of membrane curvature in boron-doped Si microstructures, 0000 (5 September 1997); doi: 10.1117/12.284474
Proc. SPIE 3223, Strain effects in multilayers, 0000 (5 September 1997); doi: 10.1117/12.284475
Proc. SPIE 3223, Ion sputter deposition of shape memory alloy films for microactuators, 0000 (5 September 1997); doi: 10.1117/12.284477
MEMS Technology II
Proc. SPIE 3223, Microfabrication by through-mask electrochemical micromachining, 0000 (5 September 1997); doi: 10.1117/12.284478
Proc. SPIE 3223, Single-sided multilevel structure for silicon pressure transducers by masked-maskless etching technology, 0000 (5 September 1997); doi: 10.1117/12.284479
Proc. SPIE 3223, Macroporous silicon formation for micromachining, 0000 (5 September 1997); doi: 10.1117/12.284480
Proc. SPIE 3223, Focused ion-beam system for automated MEMS prototyping and processing, 0000 (5 September 1997); doi: 10.1117/12.284481
Proc. SPIE 3223, 10-um thin GaAs membrane manufactured by nonselective etching, 0000 (5 September 1997); doi: 10.1117/12.284482
MEMS Technology and Devices
Proc. SPIE 3223, Automotive applications for micromachining, 0000 (5 September 1997); doi: 10.1117/12.284483
Proc. SPIE 3223, Assembly of hybrid microsystems in a large-chamber scanning electron microscope by use of mechanical grippers, 0000 (5 September 1997); doi: 10.1117/12.284484
Proc. SPIE 3223, Material structure and processes required for the manufacture of micromechanical devices, 0000 (5 September 1997); doi: 10.1117/12.284485
Proc. SPIE 3223, Micromechanical structures and microelectronics for acceleration sensing, 0000 (5 September 1997); doi: 10.1117/12.284486
Proc. SPIE 3223, Influence of processes and selective bonding technology, 0000 (5 September 1997); doi: 10.1117/12.284488
Poster Session-Monday
Proc. SPIE 3223, Design of bulk micromachined suspensions, 0000 (5 September 1997); doi: 10.1117/12.284489
Proc. SPIE 3223, Anneal treatment studies of heavily boron-doped silicon, 0000 (5 September 1997); doi: 10.1117/12.284490
Proc. SPIE 3223, Yield enhancement in micromechanical sensor fabrication using statistical process control, 0000 (5 September 1997); doi: 10.1117/12.284491
Proc. SPIE 3223, Structure design and fabrication of symmetric force-balance micromachining capacitive accelerometer, 0000 (5 September 1997); doi: 10.1117/12.284492
Proc. SPIE 3223, Balance approach for mechanical properties test of microfabricated structures, 0000 (5 September 1997); doi: 10.1117/12.284493
MEMS Materials
Proc. SPIE 3223, Ultraprecision microelectroforming of metals and metal alloys, 0000 (5 September 1997); doi: 10.1117/12.284494
MEMS Technology and Devices
Proc. SPIE 3223, Laser-micromachined microchannel solvent separator, 0000 (5 September 1997); doi: 10.1117/12.284495
Poster Session-Monday
Proc. SPIE 3223, Micromachining technology development in SIOFM, 0000 (5 September 1997); doi: 10.1117/12.284496
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