PROCEEDINGS VOLUME 3224
MICROMACHINING AND MICROFABRICATION | 29-30 SEPTEMBER 1997
Micromachined Devices and Components III
IN THIS VOLUME

0 Sessions, 41 Papers, 0 Presentations
Packaging  (4)
Posters  (11)
MICROMACHINING AND MICROFABRICATION
29-30 September 1997
Austin, TX, United States
Reliability and Materials
Proc. SPIE 3224, IC microtransducers: new components with old materials?, 0000 (5 September 1997); doi: 10.1117/12.284502
Proc. SPIE 3224, First reliability test of a surface-micromachined microengine using SHiMMeR, 0000 (5 September 1997); doi: 10.1117/12.284512
Proc. SPIE 3224, Routes to failure in rotating MEMS devices experiencing sliding friction, 0000 (5 September 1997); doi: 10.1117/12.284523
Proc. SPIE 3224, Friction and wear in surface-micromachined tribological test devices, 0000 (5 September 1997); doi: 10.1117/12.284533
Optical Devices
Proc. SPIE 3224, Fabrication process for 256x256 bolometer-type uncooled infrared detector, 0000 (5 September 1997); doi: 10.1117/12.284539
Proc. SPIE 3224, Microbinary element for optical wavelet transform, 0000 (5 September 1997); doi: 10.1117/12.284540
Gyroscopes and Accelerometers
Proc. SPIE 3224, Silicon micromachined vibrating gyroscopes, 0000 (5 September 1997); doi: 10.1117/12.284541
Proc. SPIE 3224, Airbag accelerometer with a simple switched-capacitor readout ASIC, 0000 (5 September 1997); doi: 10.1117/12.284542
Proc. SPIE 3224, Design of a sigma-delta converter-based automotive sensor, 0000 (5 September 1997); doi: 10.1117/12.284503
Actuators and Acoustic Devices
Proc. SPIE 3224, Microfabrication of acoustic-wave devices, 0000 (5 September 1997); doi: 10.1117/12.284504
Proc. SPIE 3224, Contactless actuation of giant magnetostriction thin-film alloy bimorphs for two-dimensional scanning application, 0000 (5 September 1997); doi: 10.1117/12.284505
Proc. SPIE 3224, Electrostatic comb drive for vertical actuation, 0000 (5 September 1997); doi: 10.1117/12.284506
Proc. SPIE 3224, Advanced micromechanisms in a multilevel polysilicon technology, 0000 (5 September 1997); doi: 10.1117/12.284507
Proc. SPIE 3224, Optical measurement of micromachine engine performance, 0000 (5 September 1997); doi: 10.1117/12.284508
Packaging
Proc. SPIE 3224, Microsystem packaging in 3D, 0000 (5 September 1997); doi: 10.1117/12.284509
Proc. SPIE 3224, Low-cost reliable transfer mold sensor packaging concept, 0000 (5 September 1997); doi: 10.1117/12.284510
Proc. SPIE 3224, 3D packaging of a microfluidic system with sensory applications, 0000 (5 September 1997); doi: 10.1117/12.284511
Proc. SPIE 3224, Extension of high-density interconnect multichip module technology for MEMS packaging, 0000 (5 September 1997); doi: 10.1117/12.284513
Fluid Systems
Proc. SPIE 3224, Micromachining technology for thermal ink-jet products, 0000 (5 September 1997); doi: 10.1117/12.284514
Proc. SPIE 3224, Microfluidic flow control using selective hydrophobic patterning, 0000 (5 September 1997); doi: 10.1117/12.284515
Proc. SPIE 3224, Microfluidic plastic interconnects for multibioanalysis chip modules, 0000 (5 September 1997); doi: 10.1117/12.284516
Sensors and Applications
Proc. SPIE 3224, MEMS applications in space exploration, 0000 (5 September 1997); doi: 10.1117/12.284517
Proc. SPIE 3224, Bulk-micromachined pressure sensor based on epi-poly techniques, 0000 (5 September 1997); doi: 10.1117/12.284518
Proc. SPIE 3224, Vibration signature analysis sensors for predictive diagnostics, 0000 (5 September 1997); doi: 10.1117/12.301968
Modeling and CAD
Proc. SPIE 3224, MEMS CAD and foundries: where are we going?, 0000 (5 September 1997); doi: 10.1117/12.284520
Proc. SPIE 3224, Improved meshing technique and its application in the analysis of large and complex MEMS systems, 0000 (5 September 1997); doi: 10.1117/12.284521
Proc. SPIE 3224, Computer modeling techniques applied to pneumatically driven micropumps, 0000 (5 September 1997); doi: 10.1117/12.284522
Biochemical Sensors
Proc. SPIE 3224, Stabilization of activity and repeated usage of biomaterial during integration with transducers and analysis of irreversible inhibitors, 0000 (5 September 1997); doi: 10.1117/12.284524
Proc. SPIE 3224, Excimer laser micromachining system for the production of bioparticle electromanipulation devices, 0000 (5 September 1997); doi: 10.1117/12.284525
Posters
Proc. SPIE 3224, SPICE modeling of polysilicon thermal actuators, 0000 (5 September 1997); doi: 10.1117/12.284526
Proc. SPIE 3224, Pressure sensors based on the metal-semiconductor mesa structures, 0000 (5 September 1997); doi: 10.1117/12.284527
Proc. SPIE 3224, Design and performance of a double hot arm polysilicon thermal actuator, 0000 (5 September 1997); doi: 10.1117/12.284528
Proc. SPIE 3224, Integrated thermal sensor using optical channel waveguide, 0000 (5 September 1997); doi: 10.1117/12.284529
Proc. SPIE 3224, Micromachined accelerometer with a movable-gate-transistor sensing element, 0000 (5 September 1997); doi: 10.1117/12.284530
Proc. SPIE 3224, Compensating methods of corner undercutting in silicon micromachining, 0000 (5 September 1997); doi: 10.1117/12.284531
Proc. SPIE 3224, Characteristic analysis of basic mechanisms with large deflective elastic hinges for three-dimensional micromechanisms, 0000 (5 September 1997); doi: 10.1117/12.284532
Proc. SPIE 3224, Tensile testing of thin-film microstructures, 0000 (5 September 1997); doi: 10.1117/12.284534
Proc. SPIE 3224, Three-dimensional silicon microcomponents manufactured by microelectrodischarge machining, 0000 (5 September 1997); doi: 10.1117/12.284535
Biochemical Sensors
Proc. SPIE 3224, Laser micromachined and laminated microchannel components for chemical sensors and heat transfer applications, 0000 (5 September 1997); doi: 10.1117/12.284536
Posters
Proc. SPIE 3224, Electrothermal modeling of a microbridge gas sensor, 0000 (5 September 1997); doi: 10.1117/12.284537
Proc. SPIE 3224, Thermally excited inchworm actuators and stepwise micromotors: analysis and fabrication, 0000 (5 September 1997); doi: 10.1117/12.284538
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