OPTOELECTRONICS AND HIGH-POWER LASERS AND APPLICATIONS
24-30 January 1998
San Jose, CA, United States
Fundamental Processes and Diagnostics of Laser Ablation
Proc. SPIE 3274, Nanosecond UV laser pulse interactions with dielectric single crystals, 0000 (3 June 1998); doi: 10.1117/12.309491
Proc. SPIE 3274, Femtosecond lasers and their implications for materials processing, 0000 (3 June 1998); doi: 10.1117/12.309498
Poster Session
Proc. SPIE 3274, New theoretical model describing laser hole-drilling processes for organic polymers and fiber-reinforced composites under low fluence, 0000 (3 June 1998); doi: 10.1117/12.309506
Fundamental Processes and Diagnostics of Laser Ablation
Proc. SPIE 3274, Diode-laser-based in-situ atomic absorption spectroscopy for deposition rate control, 0000 (3 June 1998); doi: 10.1117/12.309512
Proc. SPIE 3274, Nonlinear photon-stimulated desorption from an oxidized tungsten surface, 0000 (3 June 1998); doi: 10.1117/12.309519
Poster Session
Proc. SPIE 3274, Diagnostic techniques for excimer beams used in a-Si annealing for flat panel displays, 0000 (3 June 1998); doi: 10.1117/12.309527
Novel Methods and New Tools for Laser Microfabrication
Proc. SPIE 3274, Processing ceramics by laser radiation, 0000 (3 June 1998); doi: 10.1117/12.309492
Proc. SPIE 3274, Precise microfabrication of wide-bandgap materials by VUV-UV multiwavelength ablation, 0000 (3 June 1998); doi: 10.1117/12.309493
Proc. SPIE 3274, High-average-power Ce:LiCaF laser at 1-KHz repetition rate tunable from 280 nm to 315 nm, 0000 (3 June 1998); doi: 10.1117/12.309494
Laser Cleaning and Defect Correction
Proc. SPIE 3274, Laser cleaning of silicon surfaces, 0000 (3 June 1998); doi: 10.1117/12.309495
Proc. SPIE 3274, Laser applications to IC defect correction, 0000 (3 June 1998); doi: 10.1117/12.309496
Proc. SPIE 3274, Laser removal of foreign materials from semiconductor wafers, 0000 (3 June 1998); doi: 10.1117/12.309497
Proc. SPIE 3274, Transition from laboratory to manufacturing for a dry laser-assisted cleaning technology, 0000 (3 June 1998); doi: 10.1117/12.309499
Poster Session
Proc. SPIE 3274, Application of KrCI excilamp for cleaning GaAs surfaces using atomic hydrogen, 0000 (3 June 1998); doi: 10.1117/12.309500
Photon-Induced Modification and Etching
Proc. SPIE 3274, Light-induced dry etching of semiconductors in the vacuum ultraviolet, 0000 (3 June 1998); doi: 10.1117/12.309501
Proc. SPIE 3274, Low-fluence laser-assisted chemical etching of InP: an XPS study, 0000 (3 June 1998); doi: 10.1117/12.309502
Proc. SPIE 3274, Photochemical surface modification of polyurethane films with biomaterial by excimer laser processing, 0000 (3 June 1998); doi: 10.1117/12.309503
Proc. SPIE 3274, Laser-assisted microscale deformation of stainless steels and ceramics, 0000 (3 June 1998); doi: 10.1117/12.309504
Proc. SPIE 3274, Energy coupling to materials ablated by intensive pulsed 1-um radiation: plasma shielding and surface-modification effects, 0000 (3 June 1998); doi: 10.1117/12.309505
Innovative Approaches Toward Cost-Effective Solutions in Microfabrication
Proc. SPIE 3274, Desktop manufacturing using diode lasers, 0000 (3 June 1998); doi: 10.1117/12.309507
Proc. SPIE 3274, Review of laser micromachining in contract manufacturing, 0000 (3 June 1998); doi: 10.1117/12.309508
Proc. SPIE 3274, Increased production using excimer lasers through enhanced beam utilization factors, 0000 (3 June 1998); doi: 10.1117/12.309509
Laser Prototyping and Atom-Scale Engineering
Proc. SPIE 3274, Manufacture of miniature bioparticle electromanipulators by excimer laser ablation, 0000 (3 June 1998); doi: 10.1117/12.309510
Innovative Approaches Toward Cost-Effective Solutions in Microfabrication
Proc. SPIE 3274, Applications of sealed CO2 lasers for the microelectronics industry, 0000 (3 June 1998); doi: 10.1117/12.309511
Laser Micromachining
Proc. SPIE 3274, Laser micromachining of chemically altered polymers, 0000 (3 June 1998); doi: 10.1117/12.309513
Proc. SPIE 3274, Machining and modeling of high-quality reliefs in steel with pulsed-CO2-laser radiation, 0000 (3 June 1998); doi: 10.1117/12.309514
Laser Projection and Ablation Lithography
Proc. SPIE 3274, Photolithography at wavelengths below 200 nm, 0000 (3 June 1998); doi: 10.1117/12.309515
Proc. SPIE 3274, Materials study for technically relevant devices fabricated by excimer ablation lithography, 0000 (3 June 1998); doi: 10.1117/12.309516
Proc. SPIE 3274, Pattern precision of excimer ablation lithography (EAL), 0000 (3 June 1998); doi: 10.1117/12.309517
Novel Methods of Pulsed-Laser Deposition
Proc. SPIE 3274, New developments of pulsed-laser deposition process, 0000 (3 June 1998); doi: 10.1117/12.309518
Proc. SPIE 3274, Matrix-assisted pulsed-laser evaporation (MAPLE) of functionalized polymers: applications with chemical sensors, 0000 (3 June 1998); doi: 10.1117/12.309520
Proc. SPIE 3274, Properties of liquid crystal thin films grown by pulsed-laser deposition, 0000 (3 June 1998); doi: 10.1117/12.309521
Pulsed-Laser Deposition
Proc. SPIE 3274, Structure/property relationships in pulsed-laser-deposited ferroelectric thin films for frequency-agile microwave electronics, 0000 (3 June 1998); doi: 10.1117/12.309522
Proc. SPIE 3274, Pulsed-laser deposition of YBa2Cu307-La0.67Sr0.33MnO3 thin film multilayers for spin injection devices, 0000 (3 June 1998); doi: 10.1117/12.309523
Proc. SPIE 3274, Organic molecular beam deposition combined with laser-induced chemical reactions, 0000 (3 June 1998); doi: 10.1117/12.309524
Poster Session
Proc. SPIE 3274, X-ray measurement of tungsten films grown in a nonflowing laser-induced CVD process, 0000 (3 June 1998); doi: 10.1117/12.309525
Novel Methods and New Tools for Laser Microfabrication
Proc. SPIE 3274, Laser writing of quantum well intermixed GaInAsP/InP microstructures, 0000 (3 June 1998); doi: 10.1117/12.309526
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