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Methodology for real-time feedback variable selection for manufacturing process control: theoretical and simulation results
Chemical rate model for the surface pyrolysis of tetrakis(dimethylamido)titanium to form titanium nitride films
Influence of floating gate tungsten polycide deposition technique on EEPROM electrical characteristics
Isotropic nitride etching for thin nitride barrier self-aligned contact (TNBSAC) in an inductively coupled plasma chemical etcher
Application of backside fiber optic system for in-situ CMP endpoint detection on shallow-trench isolation wafers
SOPRA SE3000: a new tool for high-accuracy characterization of multilayer structures on very small spot size
Equipment challenges for a total material system change: enabling device manufacturing at 130 nm and below