PROCEEDINGS VOLUME 3511
MICROMACHINING AND MICROFABRICATION | 20-24 SEPTEMBER 1998
Micromachining and Microfabrication Process Technology IV
IN THIS VOLUME

0 Sessions, 45 Papers, 0 Presentations
Direct Write  (7)
Plating  (5)
MICROMACHINING AND MICROFABRICATION
20-24 September 1998
Santa Clara, CA, United States
Direct Write
Proc. SPIE 3511, Converting MEMS technology into profits, 0000 (31 August 1998); doi: 10.1117/12.324287
Proc. SPIE 3511, Microstructures fabricated by laser-induced polymerization, 0000 (31 August 1998); doi: 10.1117/12.324298
Proc. SPIE 3511, NC-controlled production of smooth 3D surfaces in brittle materials with 193-nm excimer laser, 0000 (31 August 1998); doi: 10.1117/12.324312
Proc. SPIE 3511, Fabrication of binary microlens array by excimer laser micromachining, 0000 (31 August 1998); doi: 10.1117/12.324323
New Processes
Proc. SPIE 3511, Fabrication of ordered nanostructure based on anodic porous alumina, 0000 (31 August 1998); doi: 10.1117/12.324328
Proc. SPIE 3511, Galvanic etching of silicon, 0000 (31 August 1998); doi: 10.1117/12.324329
Proc. SPIE 3511, Diffusion-induced dislocations in highly boron-doped silicon layers used for bulk micromachining applications, 0000 (31 August 1998); doi: 10.1117/12.324330
Proc. SPIE 3511, Advanced silicon trench etching in MEMS applications, 0000 (31 August 1998); doi: 10.1117/12.324331
Antistiction and Assembly
Proc. SPIE 3511, Antistiction coatings for surface micromachines, 0000 (31 August 1998); doi: 10.1117/12.324288
Proc. SPIE 3511, Thin Teflon-like films for MEMS: film properties and reliability studies, 0000 (31 August 1998); doi: 10.1117/12.324289
Proc. SPIE 3511, High-yield assembly of hinged 3D optical MEMS devices using magnetic actuation, 0000 (31 August 1998); doi: 10.1117/12.324290
Proc. SPIE 3511, Automatic microassembly of radar sensors for automotive applications, 0000 (31 August 1998); doi: 10.1117/12.324291
Proc. SPIE 3511, Silicon surface micromachining by anhydrous HF gas-phase etching with methanol, 0000 (31 August 1998); doi: 10.1117/12.324292
New Technolgies
Proc. SPIE 3511, Silicon microlenses for IR image sensors, 0000 (31 August 1998); doi: 10.1117/12.324293
Proc. SPIE 3511, Combining the best of bulk and surface micromachining using Si (111) substrates, 0000 (31 August 1998); doi: 10.1117/12.324294
Proc. SPIE 3511, Fabrication of polycrystalline diamond film resonators, 0000 (31 August 1998); doi: 10.1117/12.324295
Proc. SPIE 3511, Growth and characterization of shape memory alloy thin films for micropositioning and microactuation, 0000 (31 August 1998); doi: 10.1117/12.324296
Proc. SPIE 3511, Novel fabrication of comb actuator using RIE of polysilicon and (110) Si anisotropic bulk etching in KOH, 0000 (31 August 1998); doi: 10.1117/12.324297
Plating
Proc. SPIE 3511, Advances in LIGA-based post mold fabrication, 0000 (31 August 1998); doi: 10.1117/12.324299
Proc. SPIE 3511, Fabrication of miniaturized biotechnical devices, 0000 (31 August 1998); doi: 10.1117/12.324303
Proc. SPIE 3511, Uniform and simultaneous fabrication of high-precision and high-density orifice, channel, and reservoirs for ink-jet printheads, 0000 (31 August 1998); doi: 10.1117/12.324304
Proc. SPIE 3511, Fabrication of freestanding microstructures using UV lithography and double-electroplating technique, 0000 (31 August 1998); doi: 10.1117/12.324305
Proc. SPIE 3511, Novel and high-yield fabrication of electroplated 3D microcoils for MEMS and microelectronics, 0000 (31 August 1998); doi: 10.1117/12.324306
High-Aspect-Ratio Silicon
Proc. SPIE 3511, High-aspect-ratio single-crystal Si microelectromechanical systems, 0000 (31 August 1998); doi: 10.1117/12.324307
Proc. SPIE 3511, Selective deep-Si-trench etching with dimensional control, 0000 (31 August 1998); doi: 10.1117/12.324308
Proc. SPIE 3511, Microfabricated silicon gas chromatographic microchannels: fabrication and performance, 0000 (31 August 1998); doi: 10.1117/12.324309
Proc. SPIE 3511, Microfabrication of membrane-based devices by HARSE and combined HARSE/wet etching, 0000 (31 August 1998); doi: 10.1117/12.324310
Proc. SPIE 3511, CMOS compatibiltity of high-aspect-ratio micromachining (HARM) in bonded silicon-on-insulator (BSOI), 0000 (31 August 1998); doi: 10.1117/12.324311
Poster Session
Proc. SPIE 3511, Design criteria of buckling microbridges, 0000 (31 August 1998); doi: 10.1117/12.324313
Proc. SPIE 3511, Planarization and trench filling on severe surface topography with thick photoresist for MEMS, 0000 (31 August 1998); doi: 10.1117/12.324314
Proc. SPIE 3511, Optical properties of micromachined polysilicon reflective surfaces with etching holes, 0000 (31 August 1998); doi: 10.1117/12.324315
Proc. SPIE 3511, Control and modeling of stress in multistacked polysilicon films considering oxidation effect, 0000 (31 August 1998); doi: 10.1117/12.324316
Proc. SPIE 3511, MEMS assembly apparatus with a suction glass needle, 0000 (31 August 1998); doi: 10.1117/12.324317
Proc. SPIE 3511, Development of a microforming system using mold technology and cutting technology, 0000 (31 August 1998); doi: 10.1117/12.324318
Proc. SPIE 3511, Anisotropic etching of (111)-oriented silicon and applications, 0000 (31 August 1998); doi: 10.1117/12.324319
Proc. SPIE 3511, PMMA microstructure as KrF excimer-laser LIGA material, 0000 (31 August 1998); doi: 10.1117/12.324320
Proc. SPIE 3511, Composite cantilever beam-mass structure gyroscope by a novel etching technology, 0000 (31 August 1998); doi: 10.1117/12.324321
Proc. SPIE 3511, High-aspect-ratio fine-line metallization, 0000 (31 August 1998); doi: 10.1117/12.324322
Proc. SPIE 3511, Transport limitations in electrodeposition for LIGA microdevice fabrication, 0000 (31 August 1998); doi: 10.1117/12.324324
Proc. SPIE 3511, Microarray collimators for x rays and neutrons, 0000 (31 August 1998); doi: 10.1117/12.324325
Proc. SPIE 3511, Photographic method for the fabrication of surface-relief diffractive optical elements, 0000 (31 August 1998); doi: 10.1117/12.324326
Proc. SPIE 3511, Square microchannel arrays for focusing neutrons and x rays, 0000 (31 August 1998); doi: 10.1117/12.324327
Direct Write
Proc. SPIE 3511, Microassembly technologies for MEMS, 0000 (31 August 1998); doi: 10.1117/12.324300
Proc. SPIE 3511, Finding markets for microstructures, 0000 (31 August 1998); doi: 10.1117/12.324301
Proc. SPIE 3511, Micromachining technologies for miniaturized communication devices, 0000 (31 August 1998); doi: 10.1117/12.324302
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