PROCEEDINGS VOLUME 3512
MICROMACHINING AND MICROFABRICATION | 20-24 SEPTEMBER 1998
Materials and Device Characterization in Micromachining
MICROMACHINING AND MICROFABRICATION
20-24 September 1998
Santa Clara, CA, United States
Characterization by Scanning Probe Microscopy
Proc. SPIE 3512, Near-contact mode: a novel AFM operation mode for nondestructive ultrahigh lateral-resolution topography measurement in air, 0000 (1 September 1998); doi: 10.1117/12.324048
Proc. SPIE 3512, Effects of semiconductor surface band pinning on scanning electrostatic force microscopy, 0000 (1 September 1998); doi: 10.1117/12.324059
Proc. SPIE 3512, Mechanical properties of thin polysilicon films by means of probe microscopy, 0000 (1 September 1998); doi: 10.1117/12.324072
Proc. SPIE 3512, Micromachined aperture probe for combined atomic force and near-field scanning optical microscopy (AFM/NSOM), 0000 (1 September 1998); doi: 10.1117/12.324079
Proc. SPIE 3512, Probe-type microforce sensor for microactuators, 0000 (1 September 1998); doi: 10.1117/12.324088
Proc. SPIE 3512, Fabrication and use of metal tip and tip-on-tip probes for AFM-based device analysis, 0000 (1 September 1998); doi: 10.1117/12.324089
Materials Characterization I
Proc. SPIE 3512, Surface texturing and chemical treatment methods for reducing high adhesion forces at micromachine interfaces, 0000 (1 September 1998); doi: 10.1117/12.324090
Proc. SPIE 3512, Stress measurement in MEMS using Raman spectroscopy, 0000 (1 September 1998); doi: 10.1117/12.324091
Proc. SPIE 3512, Tensile properties of LIGA nickel, 0000 (1 September 1998); doi: 10.1117/12.324092
Proc. SPIE 3512, Development of TiNi shape memory alloy film deposited by sputtering from separate Ti and Ni targets, 0000 (1 September 1998); doi: 10.1117/12.324049
Proc. SPIE 3512, Silicon nitride deposited by electron cyclotron resonance plasma-enhanced chemical vapor deposititon for micromachining applications, 0000 (1 September 1998); doi: 10.1117/12.324050
Materials Characterization II
Proc. SPIE 3512, Electroplated and screen-printed magnetic materials applicable to micromachined magnetic devices, 0000 (1 September 1998); doi: 10.1117/12.324051
Proc. SPIE 3512, Three-dimensional microfabrication using two-photon polymerization, 0000 (1 September 1998); doi: 10.1117/12.324052
Proc. SPIE 3512, High-aspect-ratio x-ray lithography for magnetic head fabrication, 0000 (1 September 1998); doi: 10.1117/12.324053
Proc. SPIE 3512, Properties of polycrystalline diamond as x-ray mask, 0000 (1 September 1998); doi: 10.1117/12.324054
Proc. SPIE 3512, Mathematical model for optimization of laser photoablated microstructures, 0000 (1 September 1998); doi: 10.1117/12.324055
Testing and Reliability I
Proc. SPIE 3512, Failure analysis of surface-micromachined microengines, 0000 (1 September 1998); doi: 10.1117/12.324056
Proc. SPIE 3512, Noncontact microtorque measurement for motors in MEMS, 0000 (1 September 1998); doi: 10.1117/12.324057
Proc. SPIE 3512, New diaphragm structure based on SiNx/SOG for flow sensor, 0000 (1 September 1998); doi: 10.1117/12.324058
Proc. SPIE 3512, Linkage design effect on the reliability of surface-micromachined microengines driving a load, 0000 (1 September 1998); doi: 10.1117/12.324060
Testing and Reliability II
Proc. SPIE 3512, Dynamic high-g loading of MEMS sensors: ground and flight testing, 0000 (1 September 1998); doi: 10.1117/12.324064
Proc. SPIE 3512, Microtribiology and self-lubrication microsystems, 0000 (1 September 1998); doi: 10.1117/12.324065
Proc. SPIE 3512, A hinged-pad test structure for sliding friction measurement in micromachining, 0000 (1 September 1998); doi: 10.1117/12.324066
Process Characterization I
Proc. SPIE 3512, Pattern transfer accuracy in deep x-ray lithography: calculation and experimental results, 0000 (1 September 1998); doi: 10.1117/12.324067
Proc. SPIE 3512, PMMA development studies using various synchrotron sources and exposure conditions, 0000 (1 September 1998); doi: 10.1117/12.324068
Proc. SPIE 3512, Transparent masks for aligned deep x-ray lithography/LIGA: low-cost high-performance alternative using glass membranes, 0000 (1 September 1998); doi: 10.1117/12.324069
Proc. SPIE 3512, Mask prototyping for ultradeep x-ray lithography: preliminary studies for mask blanks and high-aspect-ratio absorber patterns, 0000 (1 September 1998); doi: 10.1117/12.324070
Proc. SPIE 3512, Injection molding using high-aspect-ratio microstructure mold inserts produced by LIGA technique, 0000 (1 September 1998); doi: 10.1117/12.324071
Process Characterization II
Proc. SPIE 3512, Characterization of ultrathick photoresists for MEMS applications using a 1X stepper, 0000 (1 September 1998); doi: 10.1117/12.324073
Proc. SPIE 3512, Novel two-step baking process for high-aspect-ratio photolithography with conventional positive thick photoresist, 0000 (1 September 1998); doi: 10.1117/12.324074
Poster Session
Proc. SPIE 3512, Calibration of optical 3D-measuring instruments, 0000 (1 September 1998); doi: 10.1117/12.324075
Proc. SPIE 3512, Microfabrication of high-aspect-ratio Bi-Te alloy microposts and applications in microsized cooling probes, 0000 (1 September 1998); doi: 10.1117/12.324076
Proc. SPIE 3512, Ni-Al2O3 and Ni-Al composite high-aspect-ratio microstructures, 0000 (1 September 1998); doi: 10.1117/12.324077
Proc. SPIE 3512, STM tips for in-situ scanning tunneling microscopy in aqueous solutions prepared using electrophoretic deposition of paint, 0000 (1 September 1998); doi: 10.1117/12.324078
Proc. SPIE 3512, Multilevel microstructure fabrication using single-step 3D photolithography and single-step electroplating, 0000 (1 September 1998); doi: 10.1117/12.324080
Proc. SPIE 3512, Novel technique to measure thermal conductivity of thin film membranes, 0000 (1 September 1998); doi: 10.1117/12.324081
Proc. SPIE 3512, Rapid prototyping using excimer laser microfabrication system, 0000 (1 September 1998); doi: 10.1117/12.324082
Proc. SPIE 3512, Reshaping as a 3D fabrication technique, 0000 (1 September 1998); doi: 10.1117/12.324083
Proc. SPIE 3512, Modern VUV and x-ray micro-optics: LIGA-fabricated and micromachined devices, 0000 (1 September 1998); doi: 10.1117/12.324084
Proc. SPIE 3512, SPICE Level 3 and BSIM3v3.1 characterization of monolithic integrated CMOS-MEMS devices, 0000 (1 September 1998); doi: 10.1117/12.324085
Papers Presented at the 1997 Conference
Proc. SPIE 3512, Adhesion between PMMA mask layer and silicon wafer in KOH aqueous solution, 0000 (1 September 1998); doi: 10.1117/12.324086
Proc. SPIE 3512, Strategy to determine the constant of elasticity for static micromechanical structures with given shape, 0000 (1 September 1998); doi: 10.1117/12.324087
Characterization by Scanning Probe Microscopy
Proc. SPIE 3512, Microassembly technologies for MEMS, 0000 (1 September 1998); doi: 10.1117/12.324061
Proc. SPIE 3512, Finding markets for microstructures, 0000 (1 September 1998); doi: 10.1117/12.324062
Proc. SPIE 3512, Micromachining technologies for miniaturized communication devices, 0000 (1 September 1998); doi: 10.1117/12.324063
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