PROCEEDINGS VOLUME 3514
MICROMACHINING AND MICROFABRICATION | 20-24 SEPTEMBER 1998
Micromachined Devices and Components IV
MICROMACHINING AND MICROFABRICATION
20-24 September 1998
Santa Clara, CA, United States
Keynote Session
Proc. SPIE 3514, Micro-electro-optical devices in a five-level polysilicon surface-micromachining technology, 0000 (8 September 1998); doi: 10.1117/12.323889
Bonding and Packaging
Proc. SPIE 3514, Wafer bonding with an adhesive coating, 0000 (8 September 1998); doi: 10.1117/12.323903
Proc. SPIE 3514, Simultaneous fabrication of dielectric and electric joints by wafer bonding, 0000 (8 September 1998); doi: 10.1117/12.323914
Proc. SPIE 3514, Stress analysis for the optimization of a new plastic package for optical sensors, 0000 (8 September 1998); doi: 10.1117/12.323920
Proc. SPIE 3514, Vacuum maintenance in hermetically sealed MEMs packages, 0000 (8 September 1998); doi: 10.1117/12.323921
Chemical and Gas Sensors
Proc. SPIE 3514, Chemical imaging sensor for observation of microscopic pH distribution, 0000 (8 September 1998); doi: 10.1117/12.323922
Proc. SPIE 3514, Acoustic wave chemical microsensors in GaAs, 0000 (8 September 1998); doi: 10.1117/12.323923
Integration
Proc. SPIE 3514, Technological modules for on-chip integration of sensors with electronics, 0000 (8 September 1998); doi: 10.1117/12.323924
Proc. SPIE 3514, Thin film front protection of CMOS wafers against KOH, 0000 (8 September 1998); doi: 10.1117/12.323880
Actuators
Proc. SPIE 3514, MEMS actuators based on smart film materials, 0000 (8 September 1998); doi: 10.1117/12.323881
Proc. SPIE 3514, Three-dimensional active microcatheter combining shape memory alloy actuators and direct-drive tubular electrostatic micromotors, 0000 (8 September 1998); doi: 10.1117/12.323882
Proc. SPIE 3514, Performance of MEMS-based gas distribution and control systems for semiconductor processing, 0000 (8 September 1998); doi: 10.1117/12.323883
Proc. SPIE 3514, Characterization techniques for surface-micromachined devices, 0000 (8 September 1998); doi: 10.1117/12.323884
Proc. SPIE 3514, Micromachined scanning Fabry-Perot interferometer, 0000 (8 September 1998); doi: 10.1117/12.323885
Inertial Sensors
Proc. SPIE 3514, Micromachined angular rate sensor MARS-RR, 0000 (8 September 1998); doi: 10.1117/12.323886
Proc. SPIE 3514, Comparison between an optical and a capacitive transducer for a novel multiaxial bulk-micromachined accelerometer, 0000 (8 September 1998); doi: 10.1117/12.323887
Proc. SPIE 3514, Two-axis detection resonant accelerometer based on rigidity change, 0000 (8 September 1998); doi: 10.1117/12.323888
High-Frequency Devices
Proc. SPIE 3514, Micromachined high Q inductors for high-frequency applications, 0000 (8 September 1998); doi: 10.1117/12.323890
Proc. SPIE 3514, Wideband microwave switch by micromachining techniques, 0000 (8 September 1998); doi: 10.1117/12.323894
Resonators and Acoustic Devices
Proc. SPIE 3514, CMOS resonant sensors, 0000 (8 September 1998); doi: 10.1117/12.323895
Proc. SPIE 3514, Long-term stability of membrane transducers for proximity sensing, 0000 (8 September 1998); doi: 10.1117/12.323896
Proc. SPIE 3514, Microresonant devices for power conversion, 0000 (8 September 1998); doi: 10.1117/12.323897
Proc. SPIE 3514, Fish-bone-structured acoustic sensor toward silicon cochlear systems, 0000 (8 September 1998); doi: 10.1117/12.323898
Modeling and CAD
Proc. SPIE 3514, Integrated mixed-technology design environment to support micro-electro-mechanical systems development, 0000 (8 September 1998); doi: 10.1117/12.323899
Proc. SPIE 3514, Efficient process development for bulk silicon etching using cellular automata simulation techniques, 0000 (8 September 1998); doi: 10.1117/12.323900
Mechanical Sensors
Proc. SPIE 3514, Polysilicon for everything?, 0000 (8 September 1998); doi: 10.1117/12.323901
Proc. SPIE 3514, Solder-bonded micromachined capacitive pressure sensors, 0000 (8 September 1998); doi: 10.1117/12.323902
Proc. SPIE 3514, Self-aligned polysilicon MEMS-reduced mask count surface micromachining, 0000 (8 September 1998); doi: 10.1117/12.323904
Proc. SPIE 3514, Acoustic wavelet analysis using micro-electro-mechanical sensors, 0000 (8 September 1998); doi: 10.1117/12.323905
Proc. SPIE 3514, Micromachined inductive displacement sensor, 0000 (8 September 1998); doi: 10.1117/12.323906
Poster Session
Proc. SPIE 3514, Microprobes for highly localized cooling/heating applications, 0000 (8 September 1998); doi: 10.1117/12.323907
Proc. SPIE 3514, MEMS-based resonating xylophone bar magnetometers, 0000 (8 September 1998); doi: 10.1117/12.323908
Proc. SPIE 3514, Shear sensitive silicon piezoresistive tactile sensor prototype, 0000 (8 September 1998); doi: 10.1117/12.323909
Proc. SPIE 3514, Fabrication of micro torsional actuator using surface plus bulk micromachining processes, 0000 (8 September 1998); doi: 10.1117/12.323910
Proc. SPIE 3514, Piezoresistive effect: stable enough for high-accuracy sensor applications?, 0000 (8 September 1998); doi: 10.1117/12.323911
Proc. SPIE 3514, Fabrication of a stainless steel microchannel microcombustor using a lamination process, 0000 (8 September 1998); doi: 10.1117/12.323912
Proc. SPIE 3514, Fabrication of micromachined microwave couplers by CMOS process, 0000 (8 September 1998); doi: 10.1117/12.323913
Proc. SPIE 3514, Micromachined gas detector based on self-aligned ionization tips, 0000 (8 September 1998); doi: 10.1117/12.323915
Proc. SPIE 3514, Micromachined 2D array piezoelectrically actuated flextensional transducers: new designs, 0000 (8 September 1998); doi: 10.1117/12.323916
Proc. SPIE 3514, Hybrid microdosing system, 0000 (8 September 1998); doi: 10.1117/12.323917
Proc. SPIE 3514, First micromachined silicon load cell for loads up to 1000 kg, 0000 (8 September 1998); doi: 10.1117/12.323918
Proc. SPIE 3514, Characterization techniques for surface-micromachined devices, 0000 (8 September 1998); doi: 10.1117/12.323919
Plenary Papers
Proc. SPIE 3514, Microassembly technologies for MEMS, 0000 (8 September 1998); doi: 10.1117/12.323891
Proc. SPIE 3514, Finding markets for microstructures, 0000 (8 September 1998); doi: 10.1117/12.323892
Proc. SPIE 3514, Micromachining technologies for miniaturized communication devices, 0000 (8 September 1998); doi: 10.1117/12.323893
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