PROCEEDINGS VOLUME 3589
NONDESTRUCTIVE EVALUATION TECHNIQUES FOR AGING INFRASTRUCTURES AND MANUFACTURING | 3-5 MARCH 1999
Process Control and Sensors for Manufacturing II
IN THIS VOLUME

0 Sessions, 20 Papers, 0 Presentations
Sensors  (4)
NONDESTRUCTIVE EVALUATION TECHNIQUES FOR AGING INFRASTRUCTURES AND MANUFACTURING
3-5 March 1999
Newport Beach, CA, United States
Sensors
Proc. SPIE 3589, Integrated waveguide/thermocouple sensor for liquid properties, 0000 (4 February 1999); doi: 10.1117/12.339958
Proc. SPIE 3589, Drastically simplified holographic methods well suited for in-situ monitoring and process control in a practical industrial environment, 0000 (4 February 1999); doi: 10.1117/12.339965
Proc. SPIE 3589, Homodyne detection of ultrasonic surface displacements using two-wave mixing in photorefractive polymers, 0000 (4 February 1999); doi: 10.1117/12.339966
Proc. SPIE 3589, Noncontact characterization of static paper materials using a photorefractive interferometer, 0000 (4 February 1999); doi: 10.1117/12.339967
Process Monitoring I
Proc. SPIE 3589, Laser-EMAT system for ultrasonic weld inspection, 0000 (4 February 1999); doi: 10.1117/12.339968
Proc. SPIE 3589, Noncontact ultrasonic liquid-level measurement of drink cans, 0000 (4 February 1999); doi: 10.1117/12.339969
Proc. SPIE 3589, In-situ microwave characterization of planar/nonplanar specimens, 0000 (4 February 1999); doi: 10.1117/12.339950
Proc. SPIE 3589, In-situ noncontact nondestructive point-to-point microwave inspection system, 0000 (4 February 1999); doi: 10.1117/12.339951
Process Monitoring II
Proc. SPIE 3589, Noncontact real-time measurement of surface roughness inside cylinders, 0000 (4 February 1999); doi: 10.1117/12.339952
Proc. SPIE 3589, Industrial monitoring and controlling system for an integrated single-chip computer with a linear CCD image sensor, 0000 (4 February 1999); doi: 10.1117/12.339953
Proc. SPIE 3589, Open architecture framework for distributed real-time fault diagnosing, 0000 (4 February 1999); doi: 10.1117/12.339954
Process Monitoring III
Proc. SPIE 3589, Fiber optic sensor for composite cure monitoring, 0000 (4 February 1999); doi: 10.1117/12.339955
Proc. SPIE 3589, Feedback control of the vacuum-assisted resin transfer molding (VARTM) process, 0000 (4 February 1999); doi: 10.1117/12.339956
Proc. SPIE 3589, Fiber optic Raman backscatter temperature monitoring in composites, 0000 (4 February 1999); doi: 10.1117/12.339957
Proc. SPIE 3589, Pitch catch ultrasonic bond sensor for the in-situ tow placement consolidation of thermoplastic laminates, 0000 (4 February 1999); doi: 10.1117/12.339959
Proc. SPIE 3589, Intrinsic fiber optic Sagnac ultrasound sensor for process monitoring in composite structures, 0000 (4 February 1999); doi: 10.1117/12.339960
Proc. SPIE 3589, On-machine characterization of moving paper using a photo-emf laser ultrasonics method, 0000 (4 February 1999); doi: 10.1117/12.339961
Proc. SPIE 3589, Acoustic emission monitoring of fiber breakage during TMC consolidation, 0000 (4 February 1999); doi: 10.1117/12.339962
Process Monitoring II
Proc. SPIE 3589, Effects of drilling conditions, drill material, and point angle on acoustic emission and exit hole delamination in drilling advanced fiber-reinforced composites, 0000 (4 February 1999); doi: 10.1117/12.339963
Proc. SPIE 3589, Monitoring drilling of advanced composites, drill wear, and exit hole delamination using wave-based acoustic emission, 0000 (4 February 1999); doi: 10.1117/12.339964
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