PROCEEDINGS VOLUME 3631
OPTOELECTRONICS '99 - INTEGRATED OPTOELECTRONIC DEVICES | 23-29 JANUARY 1999
Optoelectronic Integrated Circuits and Packaging III
OPTOELECTRONICS '99 - INTEGRATED OPTOELECTRONIC DEVICES
23-29 January 1999
San Jose, CA, United States
Optoelectronics Applications and Infrastructure
Proc. SPIE 3631, Large-area high-throughput high-resolution lithography systems for optoelectronics and microelectronics, 0000 (30 April 1999); doi: 10.1117/12.348304
Proc. SPIE 3631, Optical interconnects for high-speed data links, 0000 (30 April 1999); doi: 10.1117/12.348313
Proc. SPIE 3631, 500-Mb/s 32-channel CMOS VCSEL driver with built-in self-test and clock generation circuitry, 0000 (30 April 1999); doi: 10.1117/12.348320
Free-Space Optoelectronic Devices
Proc. SPIE 3631, Recent progress on PLC hybrid integration, 0000 (30 April 1999); doi: 10.1117/12.348321
Proc. SPIE 3631, Optical transposition transform interconnects using a free-space and fiber hybrid module, 0000 (30 April 1999); doi: 10.1117/12.348322
Proc. SPIE 3631, Electrical crosstalk analysis in OEIC modules, 0000 (30 April 1999); doi: 10.1117/12.348323
Proc. SPIE 3631, Multiple quantum well self electro-optic effect devices for optoelectronic smart pixels, 0000 (30 April 1999); doi: 10.1117/12.348324
Optoelectronic Waveguide Devices
Proc. SPIE 3631, Low-cost planar optical couplers for large-core POF-based interconnects, 0000 (30 April 1999); doi: 10.1117/12.348296
Proc. SPIE 3631, High-speed switching characteristics of integrated optoelectronic crossbar switch, 0000 (30 April 1999); doi: 10.1117/12.348297
Proc. SPIE 3631, Preparation of SiO2 on an InP substrate by a sol-gel technique for integrated optics, 0000 (30 April 1999); doi: 10.1117/12.348298
Proc. SPIE 3631, Nonlinear optic polymer core conductive-polymer-clad optoelectronic device, 0000 (30 April 1999); doi: 10.1117/12.348299
Optoelectronic Lasers and Detectors
Proc. SPIE 3631, Widely tunable hybrid semiconductor lasers, 0000 (30 April 1999); doi: 10.1117/12.348300
Proc. SPIE 3631, Waveguide heterojunction phototransistors for the analog fiber optic link and signal processing applications, 0000 (30 April 1999); doi: 10.1117/12.348301
Proc. SPIE 3631, Simulation of integrated silicon-based Ge/Si quantum well and superlattice infrared photodetectors, 0000 (30 April 1999); doi: 10.1117/12.348302
Proc. SPIE 3631, Characteristics of monolithically integrated InGaAs active pixel imager array, 0000 (30 April 1999); doi: 10.1117/12.348303
Optoelectronic Device Modeling
Proc. SPIE 3631, Modeling and synthesis of silica-glass waveguide networks using FD-BPM simulations, 0000 (30 April 1999); doi: 10.1117/12.348305
Micro-Optical Systems
Proc. SPIE 3631, Packaging for 3D optoelectronic stacked processors, 0000 (30 April 1999); doi: 10.1117/12.348306
Proc. SPIE 3631, Integration techniques of micro-optical components for miniaturized optomechanical switches, 0000 (30 April 1999); doi: 10.1117/12.348307
Proc. SPIE 3631, Packaging of lenslet array on micromirrors, 0000 (30 April 1999); doi: 10.1117/12.348308
Proc. SPIE 3631, Main characteristics of a miniaturized multipurpose infrared spectrometer, 0000 (30 April 1999); doi: 10.1117/12.348309
Proc. SPIE 3631, Laser interferometer using thin film photodetector, 0000 (30 April 1999); doi: 10.1117/12.348310
Packaging for Interconnects and Telecommunications
Proc. SPIE 3631, ASOC silicon integrated optics technology, 0000 (30 April 1999); doi: 10.1117/12.348311
Proc. SPIE 3631, Integration of high power laser diodes with microoptical components in a compact pumping source for visible fiber laser, 0000 (30 April 1999); doi: 10.1117/12.348312
Proc. SPIE 3631, Design of CMOS ICs for flip-chip integration with optoelectronic device arrays, 0000 (30 April 1999); doi: 10.1117/12.348314
Proc. SPIE 3631, Passive polymer optical waveguides for interconnecting lightwave components, 0000 (30 April 1999); doi: 10.1117/12.348315
Component Integration
Proc. SPIE 3631, Micro integration of VCSELs, detectors, and optics, 0000 (30 April 1999); doi: 10.1117/12.348316
Proc. SPIE 3631, Manufacturing cost analysis of integrated photonic packages, 0000 (30 April 1999); doi: 10.1117/12.348317
Proc. SPIE 3631, Integration of silicon bench micro-optics, 0000 (30 April 1999); doi: 10.1117/12.348318
Proc. SPIE 3631, Wafer scale integration of micro-optic and optoelectronic elements by polymer UV reaction molding, 0000 (30 April 1999); doi: 10.1117/12.348319
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