PROCEEDINGS VOLUME 3680
DESIGN, TEST, AND MICROFABRICATION OF MEMS/MOEMS | 30 MARCH - 1 APRIL 1999
Design, Test, and Microfabrication of MEMS and MOEMS
DESIGN, TEST, AND MICROFABRICATION OF MEMS/MOEMS
30 March - 1 April 1999
Paris, France
Test and Optimization
Proc. SPIE 3680, MEMS resonator synthesis for testability, 0000 (10 March 1999); doi: 10.1117/12.341153
Proc. SPIE 3680, Fault simulation of MEMS using HDLs, 0000 (10 March 1999); doi: 10.1117/12.341215
Proc. SPIE 3680, Testing philosophy behind the micro analysis system, 0000 (10 March 1999); doi: 10.1117/12.341224
Proc. SPIE 3680, MEMS optimization incorporating genetic algorithms, 0000 (10 March 1999); doi: 10.1117/12.341234
Proc. SPIE 3680, Automatic evaluation of a sensor's geometrical parameters, 0000 (10 March 1999); doi: 10.1117/12.341244
Emerging CAD Methods
Proc. SPIE 3680, Coupling of length scales and atomistic simulation of MEMS resonators, 0000 (10 March 1999); doi: 10.1117/12.341254
Proc. SPIE 3680, Extraction of compact models for MEMS/MOEMS package-device codesign, 0000 (10 March 1999); doi: 10.1117/12.341265
Proc. SPIE 3680, Effects of capacitors, resistors, and residual charges on the static and dynamic performance of electrostatically actuated devices, 0000 (10 March 1999); doi: 10.1117/12.341276
Proc. SPIE 3680, Optimization of cantilever probes for atomic force microscopy, 0000 (10 March 1999); doi: 10.1117/12.341154
CAD Systems I
Proc. SPIE 3680, Correct-by-construction approach to MEMS design and analysis, 0000 (10 March 1999); doi: 10.1117/12.341174
Proc. SPIE 3680, Computational simulation of microfluidics, electrokinetics, and particle transport in biological MEMS devices, 0000 (10 March 1999); doi: 10.1117/12.341184
Proc. SPIE 3680, Advanced integrated solution for MEMS design, 0000 (10 March 1999); doi: 10.1117/12.341194
Proc. SPIE 3680, Integrated CAD tools for top-down design of MEMS/MOEMS systems, 0000 (10 March 1999); doi: 10.1117/12.341200
Proc. SPIE 3680, General contact and hysteresis analysis of multidielectric MEMS devices under thermal and electrostatic actuation, 0000 (10 March 1999); doi: 10.1117/12.341201
Design
Proc. SPIE 3680, Simulation of nonideal behavior in integrated piezoresistive silicon pressure sensors, 0000 (10 March 1999); doi: 10.1117/12.341202
Proc. SPIE 3680, Fabrication of a smart monolithic 2D quartz microscanner, 0000 (10 March 1999); doi: 10.1117/12.341203
Proc. SPIE 3680, Design of a pigtailed tunable filter for optical fiber transmissions at 1.3 to 1.55 um, 0000 (10 March 1999); doi: 10.1117/12.341204
Proc. SPIE 3680, Modeling and optimization of microcoils for telemetric transmission at frequencies up to 20 MHz, 0000 (10 March 1999); doi: 10.1117/12.341205
Proc. SPIE 3680, Evaporating two-phase flow mechanism in microchannels, 0000 (10 March 1999); doi: 10.1117/12.341206
CAD Systems II
Proc. SPIE 3680, Modeling and simulating optical MEMS using Chatoyant, 0000 (10 March 1999); doi: 10.1117/12.341207
Proc. SPIE 3680, Interoperation of heterogeneous CAD tools in Ptolemy II, 0000 (10 March 1999); doi: 10.1117/12.341208
Proc. SPIE 3680, Structured CAD methodology for integrated MEMS and IC design, 0000 (10 March 1999); doi: 10.1117/12.341209
Proc. SPIE 3680, Computational design of membrane pumps with active/passive valves for microfluidic MEMS, 0000 (10 March 1999); doi: 10.1117/12.341210
Proc. SPIE 3680, SUNRED: a new field solving approach, 0000 (10 March 1999); doi: 10.1117/12.341211
Infrastructure
Proc. SPIE 3680, Computer-aided design tools for economical MEMS fabrication processes, 0000 (10 March 1999); doi: 10.1117/12.341212
Proc. SPIE 3680, Providing technology infrastructure for MEMS, 0000 (10 March 1999); doi: 10.1117/12.341213
Proc. SPIE 3680, Integrated simulator for MEMS using FEM implementation in AHDL and frontal solver for large sparse systems of equations, 0000 (10 March 1999); doi: 10.1117/12.341214
Proc. SPIE 3680, Internet MEMS design tools based on component technology, 0000 (10 March 1999); doi: 10.1117/12.341216
Poster Papers
Proc. SPIE 3680, CFD-ACE+: a CAD system for simulation and modeling of MEMS, 0000 (10 March 1999); doi: 10.1117/12.341217
Proc. SPIE 3680, Advanced 3D-CAD interface for micromachining with excimer lasers, 0000 (10 March 1999); doi: 10.1117/12.341218
Proc. SPIE 3680, SPICE models for simulating BDJ and BTJ detectors, 0000 (10 March 1999); doi: 10.1117/12.341219
Proc. SPIE 3680, Design and implementation of integrated BDJ detector in a standard CMOS technology, 0000 (10 March 1999); doi: 10.1117/12.341220
Proc. SPIE 3680, Mechanical-thermal simulation of surface-micromachined polysilicon hot plates, 0000 (10 March 1999); doi: 10.1117/12.341221
Proc. SPIE 3680, Numeric investigation of vibrating microcantilever using Matlab/Simulink, 0000 (10 March 1999); doi: 10.1117/12.341222
Proc. SPIE 3680, Lumped-parameter model for a micropump based on the magnetohydrodynamic (MHD) principle, 0000 (10 March 1999); doi: 10.1117/12.341223
Proc. SPIE 3680, Modeling of BDJ and BTJ structures for color detection, 0000 (10 March 1999); doi: 10.1117/12.341225
Proc. SPIE 3680, Fault modeling of electrostatic comb-drives for MEMS, 0000 (10 March 1999); doi: 10.1117/12.341226
Proc. SPIE 3680, Design of spatial light modulator microdevices: microslit arrays, 0000 (10 March 1999); doi: 10.1117/12.341227
Proc. SPIE 3680, From circuit to microsystems: using a transformer-equivalent circuit to study a piezoelectric actuator, 0000 (10 March 1999); doi: 10.1117/12.341228
Proc. SPIE 3680, Design and sensitivity optimization of vibration sensors for tool-state monitoring, 0000 (10 March 1999); doi: 10.1117/12.341229
Proc. SPIE 3680, Integrated multidisciplinary CAD/CAE environment for micro-electro-mechanical systems (MEMS), 0000 (10 March 1999); doi: 10.1117/12.341230
Proc. SPIE 3680, Hollow glass for insulating layers, 0000 (10 March 1999); doi: 10.1117/12.341231
Mechanical and Electrochemical Micromachining and Micromolding
Proc. SPIE 3680, Manufacturing of microstructures using ultraprecision machine tools, 0000 (10 March 1999); doi: 10.1117/12.341232
Proc. SPIE 3680, Innovative molding technologies for the fabrication of components for microsystems, 0000 (10 March 1999); doi: 10.1117/12.341233
Proc. SPIE 3680, Micromolding behavior of engineering plastics, 0000 (10 March 1999); doi: 10.1117/12.341235
Proc. SPIE 3680, Microfabrication technique for thick structure of metals and PZT, 0000 (10 March 1999); doi: 10.1117/12.341236
Proc. SPIE 3680, Nature and influence of surface layers and films on the chemical and electrochemical micromachining of NiTi shape memory alloys, 0000 (10 March 1999); doi: 10.1117/12.341237
Proc. SPIE 3680, Examples of MEMS technologies resulting in industrial transfers, 0000 (10 March 1999); doi: 10.1117/12.341238
LIGA
Proc. SPIE 3680, Optimum doses and mask thickness for synchrotron exposure of PMMA resists, 0000 (10 March 1999); doi: 10.1117/12.341239
Proc. SPIE 3680, X-ray transmission lenses by deep x-ray lithography and LIGA technique: first results and fundamental limits, 0000 (10 March 1999); doi: 10.1117/12.341240
Proc. SPIE 3680, New pattern on fabrication of fiber spinnerets by LIGA technology, 0000 (10 March 1999); doi: 10.1117/12.341241
Proc. SPIE 3680, Construction and manufacturing of a microgearhead with 1.9-mm outer diameter for universal application, 0000 (10 March 1999); doi: 10.1117/12.341242
3D Microfabrication
Proc. SPIE 3680, Precision machining using UV and ultrashort-pulse lasers, 0000 (10 March 1999); doi: 10.1117/12.341243
Proc. SPIE 3680, Production of novel 3D microstructures using excimer laser mask projection techniques, 0000 (10 March 1999); doi: 10.1117/12.341245
Proc. SPIE 3680, Microstereolithography using a dynamic mask generator and a noncoherent visible light source, 0000 (10 March 1999); doi: 10.1117/12.341246
Proc. SPIE 3680, Processing of complex microsystems: a micro mass spectrometer, 0000 (10 March 1999); doi: 10.1117/12.341247
Proc. SPIE 3680, Microfabrication of biofactory-on-a-chip devices using laser ablation technology, 0000 (10 March 1999); doi: 10.1117/12.341248