PROCEEDINGS VOLUME 3743
MICROELECTRONIC MANUFACTURING TECHNOLOGIES | 19-21 MAY 1999
In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing
MICROELECTRONIC MANUFACTURING TECHNOLOGIES
19-21 May 1999
Edinburgh, United Kingdom
Lithography Control
Proc. SPIE 3743, High-accuracy characterization of antireflective coatings and photoresists by spectroscopic ellipsometry: a new tool for 300-mm-wafer technology, 0000 (27 April 1999); doi: 10.1117/12.346910
Proc. SPIE 3743, Physically based model for predicting volume shrinkage in chemically amplified resists, 0000 (27 April 1999); doi: 10.1117/12.346920
Proc. SPIE 3743, Application and cost analysis of scatterometry for integrated metrology, 0000 (27 April 1999); doi: 10.1117/12.346929
Proc. SPIE 3743, Optical scatterometry with neural network model for nondestructive measurement of submicron features, 0000 (27 April 1999); doi: 10.1117/12.346934
Proc. SPIE 3743, Modeling of optical scatterometry with finite-number-of-periods gratings, 0000 (27 April 1999); doi: 10.1117/12.346935
Proc. SPIE 3743, Characterization of 3D resist patterns by means of optical scatterometry, 0000 (27 April 1999); doi: 10.1117/12.346936
Proc. SPIE 3743, Electron beam column for in-line applications featuring enhanced imaging of high-aspect-ratio structures by selective detection of on-axis secondary electrons, 0000 (27 April 1999); doi: 10.1117/12.346937
Control of Chemical Mechanical Polishing
Proc. SPIE 3743, Impact of built-in film thickness measurement in CMP process, 0000 (27 April 1999); doi: 10.1117/12.346938
Proc. SPIE 3743, CMP process development based on rapid automatic defect classification, 0000 (27 April 1999); doi: 10.1117/12.346901
Proc. SPIE 3743, Analysis of in-situ vibration monitoring for end-point detection of CMP planarization processes, 0000 (27 April 1999); doi: 10.1117/12.346902
Proc. SPIE 3743, Utilization of optical metrology as an in-line characterization technique for process performance improvement and yield enhancement of dielectric and metal CMP in IC manufacturing, 0000 (27 April 1999); doi: 10.1117/12.346903
Proc. SPIE 3743, Prediction of tungsten CMP pad life using blanket removal rate data and endpoint data obtained from process temperature and carrier motor current measurements, 0000 (27 April 1999); doi: 10.1117/12.346904
Process Monitoring and Measurement Techniques
Proc. SPIE 3743, Strategy and tools for yield enhancement, 0000 (27 April 1999); doi: 10.1117/12.346905
Proc. SPIE 3743, Advanced holography for microelectronic manufacturing: novel methods well fitted for real time in the line checks performed in the industrial environment, 0000 (27 April 1999); doi: 10.1117/12.346906
Proc. SPIE 3743, High-accuracy development monitoring technology, 0000 (27 April 1999); doi: 10.1117/12.346907
Proc. SPIE 3743, Quantitative Makyoh topography, 0000 (27 April 1999); doi: 10.1117/12.346908
Proc. SPIE 3743, Use and function of TXRF (total reflection x-ray fluorescence) for routine in fab metallic monitoring, 0000 (27 April 1999); doi: 10.1117/12.346909
Proc. SPIE 3743, Cryogenic microcalorimeters and tunnel junctions for high-resolution energy dispersive x-ray spectrometry, 0000 (27 April 1999); doi: 10.1117/12.346911
Proc. SPIE 3743, Compact and simple ESPI devices for testing of materials and components in microelectronic manufacturing, 0000 (27 April 1999); doi: 10.1117/12.346912
Proc. SPIE 3743, Real-time plasma etch control by means of physical plasma parameters with SEERS, 0000 (27 April 1999); doi: 10.1117/12.346913
Proc. SPIE 3743, Theoretical and practical aspects of remote temperature measurement in semiconductor manufacturing, 0000 (27 April 1999); doi: 10.1117/12.346914
Proc. SPIE 3743, Some optoelectronic properties controlled by an electric field in the glasses coated by thin oxide films, 0000 (27 April 1999); doi: 10.1117/12.346915
Process and Device Characterization Techniques
Proc. SPIE 3743, Ring-type ESD damage caused by electrostatic chuck of ion implanter, 0000 (27 April 1999); doi: 10.1117/12.346916
Proc. SPIE 3743, Role of stem as a high-resolution failure analysis tool for semiconductor manufacturing technologies, 0000 (27 April 1999); doi: 10.1117/12.346917
Proc. SPIE 3743, Effects of PECVD W-N diffusion barrier on thermal stress and electrical properties of Cu/W-N/SiOF multilevel interconnect, 0000 (27 April 1999); doi: 10.1117/12.346918
Proc. SPIE 3743, Rapid and cost-effective technology development using TCAD: a case study, 0000 (27 April 1999); doi: 10.1117/12.346919
Proc. SPIE 3743, Oxide degradation and charging damage by dry etch processing, 0000 (27 April 1999); doi: 10.1117/12.346921
Proc. SPIE 3743, Investigation and application of the buried-layer van der Pauw and bar resistors, 0000 (27 April 1999); doi: 10.1117/12.346922
Particle and Defect Detection
Proc. SPIE 3743, Kill ratio calculation for in-line yield prediction, 0000 (27 April 1999); doi: 10.1117/12.346923
Proc. SPIE 3743, Yield improvement program using in-situ particle monitoring for particle reduction on a Semitool Magnum based on process control and process optimization, 0000 (27 April 1999); doi: 10.1117/12.346924
Proc. SPIE 3743, FIB voltage-contrast localization and analysis of contact via chains, 0000 (27 April 1999); doi: 10.1117/12.346925
Yield Management
Proc. SPIE 3743, Floorplanning of memory ICs: routing complexity vs. yield, 0000 (27 April 1999); doi: 10.1117/12.346926
Proc. SPIE 3743, Fast and efficient yield entitlement for 0.3-um technology production ramp-up, 0000 (27 April 1999); doi: 10.1117/12.346927
Proc. SPIE 3743, Layout-based manufacturability assessment and yield prediction methodology, 0000 (27 April 1999); doi: 10.1117/12.346928
Proc. SPIE 3743, Comparative assessment of yield learning tools using information theory, 0000 (27 April 1999); doi: 10.1117/12.346930
Proc. SPIE 3743, Technique of analog integrated circuit yield analysis, 0000 (27 April 1999); doi: 10.1117/12.346931
Proc. SPIE 3743, Improvement in diffusion barrier properties of PECVD W-N thin film by low-energy BF2+ implantation, 0000 (27 April 1999); doi: 10.1117/12.346932
Proc. SPIE 3743, Method for yield prediction using a SEM-ADC, 0000 (27 April 1999); doi: 10.1117/12.346933
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