PROCEEDINGS VOLUME 3875
SYMPOSIUM ON MICROMACHINING AND MICROFABRICATION | 20-22 SEPTEMBER 1999
Materials and Device Characterization in Micromachining II
SYMPOSIUM ON MICROMACHINING AND MICROFABRICATION
20-22 September 1999
Santa Clara, CA, United States
Measurement Techniques I
Proc. SPIE 3875, Fabrication of a full metal AFM probe and its applications for Si and InP device analysis, 0000 (3 September 1999); doi: 10.1117/12.360457
Proc. SPIE 3875, Design and simulation of thermal actuators for STM applications in a standard CMOS process, 0000 (3 September 1999); doi: 10.1117/12.360467
Proc. SPIE 3875, Characterization of nanostructures micromachined with focused ion beams (FIBs), 0000 (3 September 1999); doi: 10.1117/12.360478
Measurement Techniques II
Proc. SPIE 3875, Optical full-field technique for measuring deflection and strain on micromechanical components, 0000 (3 September 1999); doi: 10.1117/12.360479
Proc. SPIE 3875, Interferometric measurement for improved understanding of boundary effects in micromachined beams, 0000 (3 September 1999); doi: 10.1117/12.360480
Proc. SPIE 3875, Characterization of glass on electronics in MEMS, 0000 (3 September 1999); doi: 10.1117/12.360481
Materials Characterization I
Proc. SPIE 3875, Impact testing of silicon-micromachined beams, 0000 (3 September 1999); doi: 10.1117/12.360482
Proc. SPIE 3875, Thick polysilicon processing for MEMS transducer fabrication, 0000 (3 September 1999); doi: 10.1117/12.360458
Proc. SPIE 3875, Small-area in-situ MEMS test structure to measure fracture strength by electrostatic probing, 0000 (3 September 1999); doi: 10.1117/12.360459
Proc. SPIE 3875, Microfabrication of single-crystal silicon multiple torsional oscillators, 0000 (3 September 1999); doi: 10.1117/12.360460
Materials Characterization II
Proc. SPIE 3875, Powder metallurgic giant magnetostrictive material and its applications in microactuators and microsensors, 0000 (3 September 1999); doi: 10.1117/12.360461
Proc. SPIE 3875, Mathematical model for optimizing a laser-induced photopolymerization process, 0000 (3 September 1999); doi: 10.1117/12.360462
Proc. SPIE 3875, Modifications of DLC films for MEMS applications, 0000 (3 September 1999); doi: 10.1117/12.360463
Proc. SPIE 3875, New dimensions of micromachining with 157-nm laser light, 0000 (3 September 1999); doi: 10.1117/12.360464
High-Aspect-Ratio Processing
Proc. SPIE 3875, Method for planarizing rigid graphite for use as an x-ray mask substrate, 0000 (3 September 1999); doi: 10.1117/12.360465
Proc. SPIE 3875, Deformation and stress in PMMA during hard x-ray exposure for deep lithography, 0000 (3 September 1999); doi: 10.1117/12.360466
Proc. SPIE 3875, Micro cycloid-gear system fabricated by multiexposure LIGA technique, 0000 (3 September 1999); doi: 10.1117/12.360468
Device Characterization
Proc. SPIE 3875, Reliability of silicon nitride as structural material in MEMS, 0000 (3 September 1999); doi: 10.1117/12.360469
Proc. SPIE 3875, Relationship between internal stress and deformation of diaphragm at elevated temperatures using SEM, 0000 (3 September 1999); doi: 10.1117/12.360470
Proc. SPIE 3875, Tunneling tip engine for microsensors applications, 0000 (3 September 1999); doi: 10.1117/12.360471
Posters
Proc. SPIE 3875, Fabrication of x-ray phase masks for sub-70-nm imaging, 0000 (3 September 1999); doi: 10.1117/12.360472
Proc. SPIE 3875, Some aspects on the mechanical analysis of microshutters, 0000 (3 September 1999); doi: 10.1117/12.360473
Proc. SPIE 3875, Characterization of micromachined structures: comparison of measurement and theory, 0000 (3 September 1999); doi: 10.1117/12.360474
Proc. SPIE 3875, Resistance of dichromated gelatin as photoresist, 0000 (3 September 1999); doi: 10.1117/12.360475
Proc. SPIE 3875, Novel approach for the 3D modeling of electrical conduction phenomena in highly anisotropic materials, 0000 (3 September 1999); doi: 10.1117/12.360476
Proc. SPIE 3875, Prototyping for high-aspect-ratio MEMS by high-energy x-ray lithography using boron-carbide-based masks, 0000 (3 September 1999); doi: 10.1117/12.360477
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