PROCEEDINGS VOLUME 3893
ASIA PACIFIC SYMPOSIUM ON MICROELECTRONICS AND MEMS | 27-29 OCTOBER 1999
Design, Characterization, and Packaging for MEMS and Microelectronics
ASIA PACIFIC SYMPOSIUM ON MICROELECTRONICS AND MEMS
27-29 October 1999
Gold Coast, Australia
Packaging and Assembly
Proc. SPIE 3893, Analytical study on a MEMS microcooling system for cooling flip chips, 0000 (8 October 1999); doi: 10.1117/12.368420
Proc. SPIE 3893, Tool and method for the theremal transient evaluation of packages, 0000 (8 October 1999); doi: 10.1117/12.368429
Proc. SPIE 3893, New flexible building technique for microsystems, 0000 (8 October 1999); doi: 10.1117/12.368439
Design Methodologies for MEMS
Proc. SPIE 3893, Optimization criteria of CMOS-compatible thermopile sensors, 0000 (8 October 1999); doi: 10.1117/12.368445
Proc. SPIE 3893, Magnetic analysis of a micromachined magnetic actuator using the finite element method, 0000 (8 October 1999); doi: 10.1117/12.368453
Proc. SPIE 3893, Model of an instrumented optoelectronic transmission system in HDL-A and VHDL-AMS, 0000 (8 October 1999); doi: 10.1117/12.368465
Proc. SPIE 3893, Modeling and simulation of a three-axis acceleration sensing system with a mixed signal simulator, 0000 (8 October 1999); doi: 10.1117/12.368466
Novel Devices
Proc. SPIE 3893, Development of power accumulation-type SiC MOSFET, 0000 (8 October 1999); doi: 10.1117/12.368421
Proc. SPIE 3893, Novel extension of neu-MOS techniques to neu-GaAs, 0000 (8 October 1999); doi: 10.1117/12.368422
Simulation
Proc. SPIE 3893, Algorithmic and practical questions of electrothermal circuit simulation, 0000 (8 October 1999); doi: 10.1117/12.368423
Proc. SPIE 3893, Noise analysis of MESFET gallium arsenide circuits, 0000 (8 October 1999); doi: 10.1117/12.368424
Proc. SPIE 3893, Simulation of circuits demonstrating stochastic resonance, 0000 (8 October 1999); doi: 10.1117/12.368425
Proc. SPIE 3893, Simulation and properties of randomly switched control systems, 0000 (8 October 1999); doi: 10.1117/12.368426
Test and Reliability Assessment
Proc. SPIE 3893, Automatic verification of asynchronous circuits using modified STG control graph, 0000 (8 October 1999); doi: 10.1117/12.368427
Proc. SPIE 3893, Noise measurement used for reliability screening of optoelectronic coupled devices (OCDs), 0000 (8 October 1999); doi: 10.1117/12.368428
MEMS Systems and Components I
Proc. SPIE 3893, Low-cost metal micropump for drug delivery, 0000 (8 October 1999); doi: 10.1117/12.368430
Proc. SPIE 3893, Development of a high-energy-resolution x-ray microcalorimeter using Ti/Au TES, 0000 (8 October 1999); doi: 10.1117/12.368431
Proc. SPIE 3893, Novel design of a MEMS-based tactile sensor, 0000 (8 October 1999); doi: 10.1117/12.368432
Proc. SPIE 3893, Programmable MEMS capacitor arrays, 0000 (8 October 1999); doi: 10.1117/12.368433
Novel Circuits
Proc. SPIE 3893, Asynchronous techniques for digital MESFET gallium arsenide circuits, 0000 (8 October 1999); doi: 10.1117/12.368434
Proc. SPIE 3893, Very high-speed differential optoelectronic algorithmic ADC using n-i(MQW)-n SEED technology, 0000 (8 October 1999); doi: 10.1117/12.368435
MEMS Systems and Components II
Proc. SPIE 3893, Micromirror device with tilt and piston motions, 0000 (8 October 1999); doi: 10.1117/12.368436
Proc. SPIE 3893, Design and performance evaluation of a silicon eye using micromirrors, 0000 (8 October 1999); doi: 10.1117/12.368437
Proc. SPIE 3893, Motion detection using color templates, 0000 (8 October 1999); doi: 10.1117/12.368438
Characterization
Proc. SPIE 3893, High-temperature testing of nickel wire bonds for SiC devices, 0000 (8 October 1999); doi: 10.1117/12.368440
Proc. SPIE 3893, Laser-beam-induced current technique as a quantitative tool for HgCdTe photodiode characterization, 0000 (8 October 1999); doi: 10.1117/12.368441
Poster Session
Proc. SPIE 3893, Fully parallel fuzzy logic processor architecture: exceeding one billion rules per second, 0000 (8 October 1999); doi: 10.1117/12.368442
Proc. SPIE 3893, Toward high-torque electrostatic tubular motors, 0000 (8 October 1999); doi: 10.1117/12.368443
Proc. SPIE 3893, Mechanical stress in polysilicon layers and evaluation by a new procedure, 0000 (8 October 1999); doi: 10.1117/12.368444
Proc. SPIE 3893, Modular exponential accelerator chip based on precomputations for RSA cryptography application, 0000 (8 October 1999); doi: 10.1117/12.368446
Proc. SPIE 3893, Optimizing the simulation of bipolar transistor packages using sliding mode techniques, 0000 (8 October 1999); doi: 10.1117/12.368447
Proc. SPIE 3893, Modeling HEMT intermodulation distortion characteristics, 0000 (8 October 1999); doi: 10.1117/12.368448
Proc. SPIE 3893, Design and simulation of a micromirror array for a projection TV, 0000 (8 October 1999); doi: 10.1117/12.368449
Proc. SPIE 3893, Mechanical characterization of magnetostrictively actuated microresonators, 0000 (8 October 1999); doi: 10.1117/12.368450
Proc. SPIE 3893, Area, time, power optimization for radix-2 redundant CORDIC rotation engines, 0000 (8 October 1999); doi: 10.1117/12.368451
Proc. SPIE 3893, Modeling malfunctions of the circuits arising from external influence, 0000 (8 October 1999); doi: 10.1117/12.368452
Proc. SPIE 3893, Hydrophilic and hydrophobic phenomena on silicon substrate for MEMS, 0000 (8 October 1999); doi: 10.1117/12.368454
Proc. SPIE 3893, Designing online self-testing control units with guaranteed fault coverage, 0000 (8 October 1999); doi: 10.1117/12.368456
Proc. SPIE 3893, Anomalous drain current-voltage characteristics in AlGaN/GaN MODFETs at low temperatures, 0000 (8 October 1999); doi: 10.1117/12.368457
Proc. SPIE 3893, Integrated millimeter-wave antenna for early warning detection, 0000 (8 October 1999); doi: 10.1117/12.368458
Proc. SPIE 3893, Sandwich-type structure for economical MEMS and MOEMS assembly, 0000 (8 October 1999); doi: 10.1117/12.368459
Proc. SPIE 3893, Development of low-temperature wafer level vacuum packaging for microsensors, 0000 (8 October 1999); doi: 10.1117/12.368460
Proc. SPIE 3893, Fabrication of fine metal microstructures packaged in the bonded glass substrates, 0000 (8 October 1999); doi: 10.1117/12.368461
Proc. SPIE 3893, Modeling of electrohydrodynamically enhanced pool boiling heat transfer using helical coil electrodes, 0000 (8 October 1999); doi: 10.1117/12.368462
Proc. SPIE 3893, X-Y nanopositioners using high-density arrays of mechanical oscillators, 0000 (8 October 1999); doi: 10.1117/12.368463
Packaging and Assembly
Proc. SPIE 3893, Application domains for synchrotron radiation sources of various energies, 0000 (8 October 1999); doi: 10.1117/12.368455
Proc. SPIE 3893, Nanometer x-ray lithography, 0000 (8 October 1999); doi: 10.1117/12.368464
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