PROCEEDINGS VOLUME 3996
16TH EUROPEAN CONFERENCE ON MASK TECHNOLOGY FOR INTEGRATED CIRCUITS AND MICROCOMPONENTS | 15-16 NOVEMBER 1999
16th European Conference on Mask Technology for Integrated Circuits and Microcomponents
16TH EUROPEAN CONFERENCE ON MASK TECHNOLOGY FOR INTEGRATED CIRCUITS AND MICROCOMPONENTS
15-16 November 1999
Munich, Germany
Defect Printability and Mask Error Function
Proc. SPIE 3996, Mask error enhancement factor, 0000 (3 February 2000); doi: 10.1117/12.377094
Proc. SPIE 3996, Defect printability and repair of alternating phase-shift masks, 0000 (3 February 2000); doi: 10.1117/12.377104
Proc. SPIE 3996, Advanced CD error detection with CD SEM disposition, 0000 (3 February 2000); doi: 10.1117/12.377115
Mask Defect, Inspection, and Repair I
Proc. SPIE 3996, Implementing reticle blank inspection in a production environment, 0000 (3 February 2000); doi: 10.1117/12.377116
Proc. SPIE 3996, Improving reticle yields with after develop inspection (ADI), 0000 (3 February 2000); doi: 10.1117/12.377117
Proc. SPIE 3996, Formation and detection of subpellicle defects by exposure to DUV system illumination, 0000 (3 February 2000); doi: 10.1117/12.377118
Mask Defect, Inspection, and Repair II
Proc. SPIE 3996, Reticle programmed defect size measurement using low-voltage SEM and pattern recognition techniques, 0000 (3 February 2000); doi: 10.1117/12.377119
Next-Generation Lithography/IPL
Proc. SPIE 3996, Ion projection lithography: progress in mask and tool technology, 0000 (3 February 2000); doi: 10.1117/12.377120
Proc. SPIE 3996, Optimization of the e-beam sensitive bilayer CARL process for stencil mask making, 0000 (3 February 2000); doi: 10.1117/12.377121
Poster Session
Proc. SPIE 3996, Laser cleaning of silicon membrane stencil masks, 0000 (3 February 2000); doi: 10.1117/12.377095
Proc. SPIE 3996, Improvements of the membrane bulging method for stress determination of silicon open stencil masks for ion projection lithography, 0000 (3 February 2000); doi: 10.1117/12.377096
Proc. SPIE 3996, Layout postprocessing in ion projection lithography (IPL), 0000 (3 February 2000); doi: 10.1117/12.377097
Proc. SPIE 3996, Development of embedded attenuated phase-shifting mask (EAPSM) blanks for ArF lithography, 0000 (3 February 2000); doi: 10.1117/12.377098
Proc. SPIE 3996, CAR blanks feasibility study results, 0000 (3 February 2000); doi: 10.1117/12.377099
Proc. SPIE 3996, Cluster tool for photomask inspection and qualification at 150-nm design rules and beyond, 0000 (3 February 2000); doi: 10.1117/12.377100
Proc. SPIE 3996, Mask quality (control) evaluation using the Virtual Stepper System (VSS), 0000 (3 February 2000); doi: 10.1117/12.377101
Mask Metrology and Measurement
Proc. SPIE 3996, Reticle imaging and metrology using a CD-SEM at IMEC, 0000 (3 February 2000); doi: 10.1117/12.377102
Proc. SPIE 3996, Major improvements in mask CD metrology: enhanced performance on attenuated phase-shift masks, corner rounding measurements, and improved measurement automation, 0000 (3 February 2000); doi: 10.1117/12.377103
Proc. SPIE 3996, Optical proximity effects in submicron photomask CD metrology, 0000 (3 February 2000); doi: 10.1117/12.377105
Mask Patterning and Data Preparation I
Proc. SPIE 3996, Optimization of ZEP7000 writing and development conditions, 0000 (3 February 2000); doi: 10.1117/12.377106
Proc. SPIE 3996, Advanced writing strategies for high-end mask making, 0000 (3 February 2000); doi: 10.1117/12.377107
Proc. SPIE 3996, Innovative approach for concurrent CD-uniformity monitoring and reticle inspection, 0000 (3 February 2000); doi: 10.1117/12.377108
Mask Patterning and Data Preparation II
Proc. SPIE 3996, Improvements to mask inspectability by use of pattern proximity correction, 0000 (3 February 2000); doi: 10.1117/12.377109
Proc. SPIE 3996, Lithography and CD performance of advanced MEBES mask pattern generators, 0000 (3 February 2000); doi: 10.1117/12.377110
Advanced Mask and Lithography Technologies I
Proc. SPIE 3996, Modified fused silica for 157-nm mask substrates, 0000 (3 February 2000); doi: 10.1117/12.377111
Advanced Mask and Lithography Technologies II
Proc. SPIE 3996, Performance study on thin resist for advanced reticle fabrication, 0000 (3 February 2000); doi: 10.1117/12.377112
Proc. SPIE 3996, High-precision mask fabrication for deep-x-ray lithography, 0000 (3 February 2000); doi: 10.1117/12.377113
Proc. SPIE 3996, Mask fabrication by nanoimprint lithography using antisticking layers, 0000 (3 February 2000); doi: 10.1117/12.377114
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