SYMPOSIUM ON DESIGN, TEST, INTEGRATION, AND PACKAGING OF MEMS/MOEMS
9-11 May 2000
Paris, France
Model Generation and Behavioral Simulation
Proc. SPIE 4019, Microactuated optical MEMS, 0000 (10 April 2000); doi: 10.1117/12.382261
Proc. SPIE 4019, CAD for integrated MEMS design, 0000 (10 April 2000); doi: 10.1117/12.382270
Proc. SPIE 4019, Automated generation of compact models for fluidic microsystems, 0000 (10 April 2000); doi: 10.1117/12.382281
Proc. SPIE 4019, THERMODEL: a tool for thermal model generation and application for MEMS packages, 0000 (10 April 2000); doi: 10.1117/12.382288
Proc. SPIE 4019, Efficient reduced order modeling for system simulation of micro-electro-mechanical systems (MEMS) from FEM models, 0000 (10 April 2000); doi: 10.1117/12.382297
Proc. SPIE 4019, Numerical spring models for behavioral simulation of MEMS inertial sensors, 0000 (10 April 2000); doi: 10.1117/12.382307
Proc. SPIE 4019, Design and optimization of passive components for optical interconnects, 0000 (10 April 2000); doi: 10.1117/12.382316
Assembly Technologies
Proc. SPIE 4019, Advanced flip chip technologies in rf, microwave, and MEMS applications, 0000 (10 April 2000); doi: 10.1117/12.382326
Proc. SPIE 4019, Residual thermomechanical stresses in ultrathin chip stack technology, 0000 (10 April 2000); doi: 10.1117/12.382329
Proc. SPIE 4019, New ultrathin 3D integration technique: technological and thermal investigations, 0000 (10 April 2000); doi: 10.1117/12.382262
Proc. SPIE 4019, Integration and packaging of MEMS relays, 0000 (10 April 2000); doi: 10.1117/12.382263
Design Methods and Optimization I
Proc. SPIE 4019, Increasing the dynamic range of a micromechanical moving-plate capacitor, 0000 (10 April 2000); doi: 10.1117/12.382264
Proc. SPIE 4019, Nonlinear analysis of beams under electrostatic loads, 0000 (10 April 2000); doi: 10.1117/12.382265
Proc. SPIE 4019, High-thermal-impedance beams for suspended MEMS, 0000 (10 April 2000); doi: 10.1117/12.382266
Proc. SPIE 4019, Development and application of a computer-supported method for design optimization of micro-optical systems, 0000 (10 April 2000); doi: 10.1117/12.382267
Devices and Components I
Proc. SPIE 4019, SCREAM micromachined high-aspect-ratio low-g microaccelerometer, 0000 (10 April 2000); doi: 10.1117/12.382268
Proc. SPIE 4019, Silicon micro-electro-mechanical systems for millimeter-wave applications, 0000 (10 April 2000); doi: 10.1117/12.382269
Proc. SPIE 4019, Design, fabrication, and packaging of closed-chamber PCR chips for DNA amplification, 0000 (10 April 2000); doi: 10.1117/12.382271
Model Generation and Behavioral Simulation
Proc. SPIE 4019, Compliant MEMS: design methods and applications, 0000 (10 April 2000); doi: 10.1117/12.382272
Design Methods and Optimization II
Proc. SPIE 4019, Acoustic and magnetic MEMS components for a hearing aid instrument, 0000 (10 April 2000); doi: 10.1117/12.382273
Proc. SPIE 4019, Mathematical modeling on the quadrature error of low-rate microgyroscope for aerospace applications, 0000 (10 April 2000); doi: 10.1117/12.382274
Proc. SPIE 4019, Design of an APS CMOS image sensor for space applications using standard CAD tools and CMOS technology, 0000 (10 April 2000); doi: 10.1117/12.382275
Proc. SPIE 4019, Electromagnetic analysis of the IR sensor focal plane arrays of micro-optics, 0000 (10 April 2000); doi: 10.1117/12.382276
Devices and Components II
Proc. SPIE 4019, Scanning micromechanical mirror for fine-pointing units of intersatellite optical links, 0000 (10 April 2000); doi: 10.1117/12.382277
Proc. SPIE 4019, Packaged bulk micromachined resonant force sensor for high-temperature applications, 0000 (10 April 2000); doi: 10.1117/12.382278
Proc. SPIE 4019, Design and fabrication of a novel thermally actuated vertical bimorph scanner for an integrated AFM, 0000 (10 April 2000); doi: 10.1117/12.382279
Proc. SPIE 4019, Micromachined CMOS magnetic field sensor with ferromagnetic actuation, 0000 (10 April 2000); doi: 10.1117/12.382280
Electronics for MEMS
Proc. SPIE 4019, Signal processing electronics for a capacitive microsensor, 0000 (10 April 2000); doi: 10.1117/12.382282
Proc. SPIE 4019, Modeling, design, and test of a monolithic integrated magnetic sensor in a digital CMOS technology using a switched current interface system, 0000 (10 April 2000); doi: 10.1117/12.382283
Proc. SPIE 4019, 1-GHz CMOS VCO design for wireless application using MEMS technology, 0000 (10 April 2000); doi: 10.1117/12.382284
MOEMS Packaging
Proc. SPIE 4019, Photovoltaic miniarrays assembled using multichip module technology (MCM), 0000 (10 April 2000); doi: 10.1117/12.382285
Model Generation and Behavioral Simulation
Proc. SPIE 4019, Coupling of length scales in MEMS modeling: the atomic limit of finite elements, 0000 (10 April 2000); doi: 10.1117/12.382286
CAD Systems
Proc. SPIE 4019, Moving from analysis to design: a MEMS CAD tool evolution, 0000 (10 April 2000); doi: 10.1117/12.382287
Proc. SPIE 4019, CFD-Micromesh: a fast geometric modeling and mesh generation tool for 3D microsystem simulations, 0000 (10 April 2000); doi: 10.1117/12.382289
Proc. SPIE 4019, Robust and versatile software system for optimal design of MEMS structures, 0000 (10 April 2000); doi: 10.1117/12.382290
Proc. SPIE 4019, Mixed-technology system-level simulation, 0000 (10 April 2000); doi: 10.1117/12.382291
Proc. SPIE 4019, Standardization for microsystem technology, 0000 (10 April 2000); doi: 10.1117/12.382292
Integrated Process and Manufacturing
Proc. SPIE 4019, Scheduling MEMS manufacturing, 0000 (10 April 2000); doi: 10.1117/12.382293
Proc. SPIE 4019, Preliminary results at the ultradeep x-ray lithography beamline at CAMD, 0000 (10 April 2000); doi: 10.1117/12.382294
Proc. SPIE 4019, Rapid fabrication of microcomponents, 0000 (10 April 2000); doi: 10.1117/12.382295
Model Generation and Behavioral Simulation
Proc. SPIE 4019, Challenges and opportunities in deployment of MEMS for in-vivo monitoring of cardiovascular systems, 0000 (10 April 2000); doi: 10.1117/12.382296
Testing and Failure Analysis
Proc. SPIE 4019, High-level fault modeling in surface-micromachined MEMS, 0000 (10 April 2000); doi: 10.1117/12.382298
Proc. SPIE 4019, MEMS physical analysis in order to complete experimental results return, 0000 (10 April 2000); doi: 10.1117/12.382299
Proc. SPIE 4019, MEMS IC test probe utilizing fritting contacts, 0000 (10 April 2000); doi: 10.1117/12.382300
Proc. SPIE 4019, Test structures for CMOS-compatible silicon pressure sensor reliability characterization, 0000 (10 April 2000); doi: 10.1117/12.382301
Reliability and Characterization
Proc. SPIE 4019, Influence of materials selection and quality on ink jet nozzles fabricated by micro-electrodischarge machining, 0000 (10 April 2000); doi: 10.1117/12.382302
Proc. SPIE 4019, Effects of dc and ac bias on the dynamic performance of microresonators, 0000 (10 April 2000); doi: 10.1117/12.382303
Proc. SPIE 4019, Si-based microphone testing methodology and noise reduction, 0000 (10 April 2000); doi: 10.1117/12.382304
Proc. SPIE 4019, New types of silicon torsion microspring and their characterization, 0000 (10 April 2000); doi: 10.1117/12.382305
Proc. SPIE 4019, Failure of polymer-metal interfaces under hygrothermal loading, 0000 (10 April 2000); doi: 10.1117/12.382306
Posters on CAD, Design and Test
Proc. SPIE 4019, International frequency sensor association (IFSA): goals and activities, 0000 (10 April 2000); doi: 10.1117/12.382308
Proc. SPIE 4019, Analysis of electromechanical parameters of electrostatic microrelay with a movable elastic cantilever electrode, 0000 (10 April 2000); doi: 10.1117/12.382309
Proc. SPIE 4019, Dynamic checking improves MEMS design methodology, 0000 (10 April 2000); doi: 10.1117/12.382310
Proc. SPIE 4019, Computational framework for modeling one-dimensional subgrid components and phenomena in multidimensional microsystems, 0000 (10 April 2000); doi: 10.1117/12.382311
Proc. SPIE 4019, New methodology of work with concurrent engineering in electronic design, 0000 (10 April 2000); doi: 10.1117/12.382312
Proc. SPIE 4019, Modeling and design of multiple buried junctions detectors for color systems development, 0000 (10 April 2000); doi: 10.1117/12.382313
Proc. SPIE 4019, Evaluation of the orientation of thermal deformation in the surface-micromachined membrane of gas microsensors, 0000 (10 April 2000); doi: 10.1117/12.382314
Posters on Microfabrication, Integration and Packaging
Proc. SPIE 4019, High-aspect-ratio electroformed Ni-Co microstructures with improved mold adhesion using a LIGA-like process and a Novolak sublayer, 0000 (10 April 2000); doi: 10.1117/12.382315