PROCEEDINGS VOLUME 4174
MICROMACHINING AND MICROFABRICATION | 18-21 SEPTEMBER 2000
Micromachining and Microfabrication Process Technology VI
MICROMACHINING AND MICROFABRICATION
18-21 September 2000
Santa Clara, CA, United States
Liga/Plating/Molding
Proc. SPIE 4174, Localized electrochemical deposition: the growth behavior of nickel microcolumns, 0000 (25 August 2000); doi: 10.1117/12.396421
Proc. SPIE 4174, Large-area MEMS fabrication with thick SU-8 photoresist applied to an x-ray image sensor array, 0000 (25 August 2000); doi: 10.1117/12.396431
Proc. SPIE 4174, Producing LIGA-competitive microcomponents, 0000 (25 August 2000); doi: 10.1117/12.396444
Proc. SPIE 4174, Microfabrication of a metal fuel injector nozzle array, 0000 (25 August 2000); doi: 10.1117/12.396453
Proc. SPIE 4174, Acoustic agitation for enhanced development of LIGA PMMA resists, 0000 (25 August 2000); doi: 10.1117/12.396462
High-Aspect Ratio
Proc. SPIE 4174, High-aspect-ratio microstructure fabrication using SU-8 resist, 0000 (25 August 2000); doi: 10.1117/12.396472
Proc. SPIE 4174, Loading effects in deep silicon etching, 0000 (25 August 2000); doi: 10.1117/12.396475
Proc. SPIE 4174, HARM processing techniques for MEMS and MOEMS devices using bonded SOI substrates and DRIE, 0000 (25 August 2000); doi: 10.1117/12.396476
Proc. SPIE 4174, Characterization of deep Si etch profiles formed by atmospheric downstream plasma, 0000 (25 August 2000); doi: 10.1117/12.396477
Proc. SPIE 4174, Overcritical damped laterally moving microstructures by ADRIE using SOI-substrates for automotive applications, 0000 (25 August 2000); doi: 10.1117/12.396422
Bulk and Surface Micromachining
Proc. SPIE 4174, Comparison between wet HF etching and vapor HF etching for sacrificial oxide removal, 0000 (25 August 2000); doi: 10.1117/12.396423
Proc. SPIE 4174, Development of TMAH anisotropic etching manufacturing process for MEMS, 0000 (25 August 2000); doi: 10.1117/12.396424
Proc. SPIE 4174, Low-temperature piezoelectric aluminum nitride thin film, 0000 (25 August 2000); doi: 10.1117/12.396425
Poster Session
Proc. SPIE 4174, Fabrication of surface-micromachined thermally driven micropump by anhydrous HF gas-phase etching with 2-propanol, 0000 (25 August 2000); doi: 10.1117/12.396426
Bulk and Surface Micromachining
Proc. SPIE 4174, Silicon surface micromachining of a deep vacuum cavity structure and its application to a microflow sensor, 0000 (25 August 2000); doi: 10.1117/12.396427
Proc. SPIE 4174, Thick porous silicon sacrificial layer formation using implanted mask technology, 0000 (25 August 2000); doi: 10.1117/12.396428
Access Means to MEMS Technology: CAD and Foundries
Proc. SPIE 4174, Flexible machining system to produce micro-prototypes, 0000 (25 August 2000); doi: 10.1117/12.396429
Proc. SPIE 4174, SOI micromachining technologies for MEMS, 0000 (25 August 2000); doi: 10.1117/12.396430
Proc. SPIE 4174, Design rules for non-Manhattan shapes, 0000 (25 August 2000); doi: 10.1117/12.396432
Proc. SPIE 4174, Toward determining cost, quality, and turn-around time of MEMS devices fabricated in a distributed prototyping environment, 0000 (25 August 2000); doi: 10.1117/12.396436
Proc. SPIE 4174, General MEMS process physics simulation and its applications, 0000 (25 August 2000); doi: 10.1117/12.396437
Proc. SPIE 4174, New EUROPRACTICE microsystem design and foundry services, 0000 (25 August 2000); doi: 10.1117/12.396438
Laser Processing
Proc. SPIE 4174, Laser microwelding in electronics: limitations and solutions for a further miniaturization, 0000 (25 August 2000); doi: 10.1117/12.396439
Proc. SPIE 4174, Production of silicon diaphragms by precision grinding, 0000 (25 August 2000); doi: 10.1117/12.396440
Proc. SPIE 4174, Flexible processing of large scale LCD panels using scanner-deflected UV-laser radiation, 0000 (25 August 2000); doi: 10.1117/12.396441
Proc. SPIE 4174, Release etch modeling analysis and the use of laser scanning microscopy for etch time prediction of micromachined structures, 0000 (25 August 2000); doi: 10.1117/12.396442
Proc. SPIE 4174, Repair of stiction-failed surface-micromachined polycrystalline silicon cantilevers using pulsed lasers, 0000 (25 August 2000); doi: 10.1117/12.396443
MEMS Film Deposition Processes and Devices
Proc. SPIE 4174, Novel process for deposition of aluminum onto sidewalls of silicon trenches, 0000 (25 August 2000); doi: 10.1117/12.396445
Proc. SPIE 4174, Process development and fabrication of application-specific microvalves, 0000 (25 August 2000); doi: 10.1117/12.396446
Proc. SPIE 4174, Formation of low-stress multilayered thick polysilicon films for fabrication of microsystems, 0000 (25 August 2000); doi: 10.1117/12.396447
Proc. SPIE 4174, Application of a silicon-enriched nitride diaphragm to a condenser microphone, 0000 (25 August 2000); doi: 10.1117/12.396448
Analysis/Characterization/Test
Proc. SPIE 4174, Dynamic actuation behavior of NiTi/Si diaphragm micropump, 0000 (25 August 2000); doi: 10.1117/12.396449
Proc. SPIE 4174, Experimental study of micro-EDM machining performances on silicon wafer, 0000 (25 August 2000); doi: 10.1117/12.396450
Proc. SPIE 4174, Control of internal stress in SMA/Si bimorph microactuators, 0000 (25 August 2000); doi: 10.1117/12.396451
Proc. SPIE 4174, Improvement of structural stability and IR-detecting characteristics of microbolometer, 0000 (25 August 2000); doi: 10.1117/12.396452
Packaging/Wafer Bonding
Proc. SPIE 4174, Micromachining technologies for capillary electrophoresis utilizing Pyrex glass etching and bonding, 0000 (25 August 2000); doi: 10.1117/12.396454
Proc. SPIE 4174, Novel low-temperature pressure-assisted bonding technology, 0000 (25 August 2000); doi: 10.1117/12.396455
Proc. SPIE 4174, Wafer-level chip size package with an air cavity above the active surface for micromechanical applications, 0000 (25 August 2000); doi: 10.1117/12.396456
Proc. SPIE 4174, Packaging for a rotational accelerometer: Is a standard plastic SOIC an industrial solution?, 0000 (25 August 2000); doi: 10.1117/12.396457
Novel MEMS Fabrication and Integration Processes
Proc. SPIE 4174, IC-compatible process for pattern transfer in deep wells for integration of RF components, 0000 (25 August 2000); doi: 10.1117/12.396458
Proc. SPIE 4174, Novel porous silicon formation without external contact, 0000 (25 August 2000); doi: 10.1117/12.396459
Proc. SPIE 4174, Single-crystal micromachining using multiple fusion-bonded layers, 0000 (25 August 2000); doi: 10.1117/12.396460
Proc. SPIE 4174, Manufacturing of microcomponents in a research institute under DIN EN ISO 9001, 0000 (25 August 2000); doi: 10.1117/12.396461
Proc. SPIE 4174, Development of polysilicon films for MEMS integration with submicrometer CMOS process, 0000 (25 August 2000); doi: 10.1117/12.396463
Proc. SPIE 4174, Development of a low-stress silicon-rich silicon nitride film for micromachined sensor applications, 0000 (25 August 2000); doi: 10.1117/12.396464
Poster Session
Proc. SPIE 4174, Patterning of diamond films by RIE and its MEMS applications, 0000 (25 August 2000); doi: 10.1117/12.396465
Proc. SPIE 4174, Precise mask alignment design to crystal orientation of (100) silicon wafer using wet anisotropic etching, 0000 (25 August 2000); doi: 10.1117/12.396466
Proc. SPIE 4174, Powder blasting as a three-dimensional microstucturing technology for MEMS applications, 0000 (25 August 2000); doi: 10.1117/12.396467
Proc. SPIE 4174, Elimination of wafer edge die yield loss for accelerometers, 0000 (25 August 2000); doi: 10.1117/12.396468
Proc. SPIE 4174, Bulk micromachining of SOI wafers using double-sided lithography and anisotropic wet etching, 0000 (25 August 2000); doi: 10.1117/12.396469
Proc. SPIE 4174, Fabrication of horn-shaped antenna array using SU-8 and application to the bolometer, 0000 (25 August 2000); doi: 10.1117/12.396470
Proc. SPIE 4174, Design and fabrication of a micromechanical inverter, 0000 (25 August 2000); doi: 10.1117/12.396471
Liga/Plating/Molding
Proc. SPIE 4174, Anisotropically etched Si molds for fabricating fine optical components, 0000 (25 August 2000); doi: 10.1117/12.396473
Poster Session
Proc. SPIE 4174, Heat- and oxygen-RIE-resistant polysiloxane resist with three-dimensional structure for high-aspect-ratio microfabrication, 0000 (25 August 2000); doi: 10.1117/12.396474
Liga/Plating/Molding
Proc. SPIE 4174, MEMS/MOEMS for lightwave networks: Can little machines make it big?, 0000 (25 August 2000); doi: 10.1117/12.396433
Proc. SPIE 4174, Bulk micromachining for sensors and actuators, 0000 (25 August 2000); doi: 10.1117/12.396434