PROCEEDINGS VOLUME 4180
MICROMACHINING AND MICROFABRICATION | 18-21 SEPTEMBER 2000
MEMS Reliability for Critical Applications
IN THIS VOLUME

0 Sessions, 16 Papers, 0 Presentations
MICROMACHINING AND MICROFABRICATION
18-21 September 2000
Santa Clara, CA, United States
MEMS Failure Analysis
Proc. SPIE 4180, Electrostatic discharge/electrical overstress susceptibility in MEMS: a new failure mode, 0000 (10 August 2000); doi: 10.1117/12.395703
Proc. SPIE 4180, Fracture tests of etched components using a focused ion beam machine, 0000 (10 August 2000); doi: 10.1117/12.395707
Proc. SPIE 4180, Failure analysis of tungsten-coated polysilicon micromachined microengines, 0000 (10 August 2000); doi: 10.1117/12.395708
MEMS Process and Packaging Reliability
Proc. SPIE 4180, Ultrasonic actuation for MEMS dormancy-related stiction reduction, 0000 (10 August 2000); doi: 10.1117/12.395709
Proc. SPIE 4180, Effects of temperature on surface adhesion in MEMS structures, 0000 (10 August 2000); doi: 10.1117/12.395710
Proc. SPIE 4180, Characterization of Kovar-Pyrex anodically bonded samples: a new packaging approach for MEMS devices, 0000 (10 August 2000); doi: 10.1117/12.395711
Surface Micromachined MEMS Reliability
Proc. SPIE 4180, Mechanical reliability of surface-micromachined self-assembling two-axis MEMS tilting mirrors, 0000 (10 August 2000); doi: 10.1117/12.395696
Proc. SPIE 4180, Electrical and environmental reliability characterization of surface-micromachined MEMS polysilicon test structures, 0000 (10 August 2000); doi: 10.1117/12.395697
Proc. SPIE 4180, Micro nano technology visualization (MNTV) of micromachined MEMS polysilicon structures, 0000 (10 August 2000); doi: 10.1117/12.395698
MEMS Qualification
Proc. SPIE 4180, Mechanical effects of fatigue and charge on CMOS MEMS, 0000 (10 August 2000); doi: 10.1117/12.395699
Proc. SPIE 4180, Anodic oxidation and reliability of MEMS polysilicon electrodes at high relative humidity and high voltages, 0000 (10 August 2000); doi: 10.1117/12.395700
Proc. SPIE 4180, Effect of storage life and drive signals on the reliability of the Sandia Microengine, 0000 (10 August 2000); doi: 10.1117/12.395701
Proc. SPIE 4180, Diagnosis of microcrack initiation and estimation fracture toughness for micromachined silicon comb device with prenotch actuated by electrostatic force, 0000 (10 August 2000); doi: 10.1117/12.395702
MEMS Failure Analysis
Proc. SPIE 4180, MEMS/MOEMS for lightwave networks: Can little machines make it big?, 0000 (10 August 2000); doi: 10.1117/12.395704
Proc. SPIE 4180, Bulk micromachining for sensors and actuators, 0000 (10 August 2000); doi: 10.1117/12.395705
Proc. SPIE 4180, Microsystems for diverse applications using recently developed microfabrication techniques, 0000 (10 August 2000); doi: 10.1117/12.395706
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