PROCEEDINGS VOLUME 4229
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND ASSEMBLY | NOV 27 - DEC 2 2000
Microelectronic Yield, Reliability, and Advanced Packaging
INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS AND ASSEMBLY
Nov 27 - Dec 2 2000
Singapore, Singapore
Reliability of Advanced Processing
Proc. SPIE 4229, Electromigration failure modes and Blech effect in single-inlaid Cu interconnects, 0000 (23 October 2000); doi: 10.1117/12.404869
Proc. SPIE 4229, Resistance degradation in early stage of electromigration of Al(Cu) metal lines, 0000 (23 October 2000); doi: 10.1117/12.404878
Proc. SPIE 4229, Dependence of EM performance on linewidth for Cu dual-inlaid structures, 0000 (23 October 2000); doi: 10.1117/12.404883
Proc. SPIE 4229, Novel algorithm for hot-carrier lifetime projection on thick gate PMOSFETs fabricated by 0.18-um CMOS technology, 0000 (23 October 2000); doi: 10.1117/12.404884
Proc. SPIE 4229, Finite element analysis and experiments of ultrafine-pitch wire bonding, 0000 (23 October 2000); doi: 10.1117/12.404885
Proc. SPIE 4229, Use of Rbd to distinguish different failure modes, 0000 (23 October 2000); doi: 10.1117/12.404886
Yield, Defect, and Reliability Analysis
Proc. SPIE 4229, Novel resource optimization approach for yield learning, 0000 (23 October 2000); doi: 10.1117/12.404887
Proc. SPIE 4229, Comprehensive methodology for integrated circuit in-line defect classification, 0000 (23 October 2000); doi: 10.1117/12.404860
Proc. SPIE 4229, Projecting wafer probe yields for products fabricated in new technologies, 0000 (23 October 2000); doi: 10.1117/12.404861
Proc. SPIE 4229, Yield implications of wafer edge engineering, 0000 (23 October 2000); doi: 10.1117/12.404862
Proc. SPIE 4229, Comprehensive study of indium-implantation-induced damages in 0.25-um MOSFETs, 0000 (23 October 2000); doi: 10.1117/12.404863
Proc. SPIE 4229, Fast yield learning using e-beam wafer inspection, 0000 (23 October 2000); doi: 10.1117/12.404864
Proc. SPIE 4229, Analysis of serious bit-line failure on 0.19-um 64M DRAM with STI technology, 0000 (23 October 2000); doi: 10.1117/12.404865
Proc. SPIE 4229, Effect of annealing after metal etch on analog device and its impact on yield performance, 0000 (23 October 2000); doi: 10.1117/12.404866
Advanced Package Reliability and Device Failure Analysis
Proc. SPIE 4229, Reliability data analysis software development, 0000 (23 October 2000); doi: 10.1117/12.404867
Proc. SPIE 4229, Test and reliability analysis of PBGA assemblies under random vibration, 0000 (23 October 2000); doi: 10.1117/12.404868
Proc. SPIE 4229, FEA evaluation on solder joint reliability of CCGA, 0000 (23 October 2000); doi: 10.1117/12.404870
Proc. SPIE 4229, Measurement of thermal deformation of IC packages using the AFM scanning moire technique, 0000 (23 October 2000); doi: 10.1117/12.404871
Proc. SPIE 4229, Burn-in strategy based on Weibull failures, 0000 (23 October 2000); doi: 10.1117/12.404872
Proc. SPIE 4229, New quality control parameter in wafer fabrication for wire-bonding integrity, 0000 (23 October 2000); doi: 10.1117/12.404873
Proc. SPIE 4229, Estimation of the area of voids in deep-submicron aluminium interconnects using resistance-noise measurements, 0000 (23 October 2000); doi: 10.1117/12.404874
Proc. SPIE 4229, Chemical imaging of microvias in flip chip pin grid array packages using time-of-flight secondary ion mass spectroscopy, 0000 (23 October 2000); doi: 10.1117/12.404875
Proc. SPIE 4229, CVD Cu/IMP Cu/TaN/SiO2/Si structures, 0000 (23 October 2000); doi: 10.1117/12.404876
Advanced Packaging
Proc. SPIE 4229, Low-cost wafer level packaging process, 0000 (23 October 2000); doi: 10.1117/12.404877
Proc. SPIE 4229, Fracture mechanics approach for flip chip BGA design, 0000 (23 October 2000); doi: 10.1117/12.404879
Proc. SPIE 4229, Thermal characterization of tape BGA package by modeling, 0000 (23 October 2000); doi: 10.1117/12.404880
Proc. SPIE 4229, Crosstalk in packaging array-based optical interconnects and processors, 0000 (23 October 2000); doi: 10.1117/12.404881
Proc. SPIE 4229, System-level I/O power modeling, 0000 (23 October 2000); doi: 10.1117/12.404882
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