PROCEEDINGS VOLUME 4274
PHOTONICS WEST 2001 - LASE | 20-26 JANUARY 2001
Laser Applications in Microelectronic and Optoelectronic Manufacturing VI
PHOTONICS WEST 2001 - LASE
20-26 January 2001
San Jose, CA, United States
Lasers and Techniques I
Proc. SPIE 4274, Laser manipulation of the size and shape of supported metal nanoparticles, 0000 (29 June 2001); doi: 10.1117/12.432498
Proc. SPIE 4274, Laser diode (LD) imaging and photopolymers for LD imaging, 0000 (29 June 2001); doi: 10.1117/12.432514
Proc. SPIE 4274, Microcomponents manufacturing for precise devices by copper vapor laser, 0000 (29 June 2001); doi: 10.1117/12.432525
Proc. SPIE 4274, Diamond-based deep-UV sensors for lithography applications, 0000 (29 June 2001); doi: 10.1117/12.432534
Lasers and Techniques II
Proc. SPIE 4274, Surface modification of aluminum alloy 2024-T3 via femtosecond pulse laser irradiation, 0000 (29 June 2001); doi: 10.1117/12.432551
Proc. SPIE 4274, Microscale bending using pulsed and cw laser, 0000 (29 June 2001); doi: 10.1117/12.432552
Ultrafast Laser Processing
Proc. SPIE 4274, Dynamics and mechanism of discrete etching of organic materials by femtosecond laser excitation, 0000 (29 June 2001); doi: 10.1117/12.432499
Proc. SPIE 4274, Structuring silicon with femtosecond lasers, 0000 (29 June 2001); doi: 10.1117/12.432500
Proc. SPIE 4274, Time-resolved study of femtosecond microfabrication in silica glass, 0000 (29 June 2001); doi: 10.1117/12.432501
Proc. SPIE 4274, Submicron structuring of solid targets with femtosecond laser pulses, 0000 (29 June 2001); doi: 10.1117/12.432502
157-nm Laser Processing
Proc. SPIE 4274, Short-pulse and short-wavelength ablation of semiconductor materials, 0000 (29 June 2001); doi: 10.1117/12.432503
Proc. SPIE 4274, 157-nm laser-induced modification of fused-silica glasses, 0000 (29 June 2001); doi: 10.1117/12.432504
Proc. SPIE 4274, GaN etching by simultaneous irradiation of KrF excimer laser and F2 laser, 0000 (29 June 2001); doi: 10.1117/12.432505
Proc. SPIE 4274, Multiwavelength excitation process of fused-silica by combination of F2 and KrF excimer lasers, 0000 (29 June 2001); doi: 10.1117/12.432506
Fundamental Processes
Proc. SPIE 4274, UV-FEL photoelectron emission microscopy of the dynamics of nanostructures on silicon surfaces, 0000 (29 June 2001); doi: 10.1117/12.432507
Proc. SPIE 4274, Transfer of orbital angular momentum to metal particles confined using optical tweezers, 0000 (29 June 2001); doi: 10.1117/12.432508
Proc. SPIE 4274, Prototype laser-activated bimetallic thermal resist for microfabrication, 0000 (29 June 2001); doi: 10.1117/12.432509
Pulsed-Laser Deposition
Proc. SPIE 4274, Transparent conducting indium tin oxide thin film grown on flexible substrate by pulsed-laser deposition for organic light-emitting devices, 0000 (29 June 2001); doi: 10.1117/12.432510
Proc. SPIE 4274, Ejection of particles placed on a thin film by laser-induced forward transfer, 0000 (29 June 2001); doi: 10.1117/12.432511
Pulsed-Laser Ablation
Proc. SPIE 4274, Synthesis of silicon nanoparticles and impurity doping by laser ablation, 0000 (29 June 2001); doi: 10.1117/12.432512
Proc. SPIE 4274, Laser ablation of solid nitrogen films at a cryogenic temperature, 0000 (29 June 2001); doi: 10.1117/12.432513
Proc. SPIE 4274, Thermal mechanisms of subnanosecond ablation, 0000 (29 June 2001); doi: 10.1117/12.432515
Proc. SPIE 4274, Propagation of short-pulsed laser radiation and stages of ablative deep-channel formation, 0000 (29 June 2001); doi: 10.1117/12.432516
Proc. SPIE 4274, Plume formation and optical breakdown on KrF excimer laser-irradiated silica glass, 0000 (29 June 2001); doi: 10.1117/12.432517
Thin Film Processing
Proc. SPIE 4274, Characterization of polyperinaphthalenic organic semiconductor thin films prepared by excimer laser ablation and application to anode electrodes for ultrathin rechargeable Li ion batteries, 0000 (29 June 2001); doi: 10.1117/12.432518
Proc. SPIE 4274, Laser micromachining: new techniques and developments for display applications, 0000 (29 June 2001); doi: 10.1117/12.432519
Pulsed-Laser Deposition
Proc. SPIE 4274, High-intensity laser processing of thin films, 0000 (29 June 2001); doi: 10.1117/12.432520
Thin Film Processing
Proc. SPIE 4274, Production of solar cells with Om contact areas by laser processing, 0000 (29 June 2001); doi: 10.1117/12.432521
Laser Microengineering in MEMS
Proc. SPIE 4274, Laser fabrication and assembly processes for MEMS, 0000 (29 June 2001); doi: 10.1117/12.432522
Proc. SPIE 4274, Polymer microsystems by excimer laser ablation: from rapid prototyping to large-number fabrication, 0000 (29 June 2001); doi: 10.1117/12.432523
Proc. SPIE 4274, Laser direct writing of microbatteries for integrated power electronics, 0000 (29 June 2001); doi: 10.1117/12.432524
Proc. SPIE 4274, Tungsten microcone arrays grown by nanosecond pulsed Nd: YAG laser irradiation, 0000 (29 June 2001); doi: 10.1117/12.432526
Proc. SPIE 4274, Laser micromachining of mold inserts for replication techniques: state of the art and applications, 0000 (29 June 2001); doi: 10.1117/12.432527
Proc. SPIE 4274, Laser-light delivery microtools based on laser technology: design, fabrication, and applications, 0000 (29 June 2001); doi: 10.1117/12.432528
Proc. SPIE 4274, Microstereolithography and its application to biochemical IC chip, 0000 (29 June 2001); doi: 10.1117/12.432529
Laser Microengineering in Electronics
Proc. SPIE 4274, Laser-assisted fabrication of electronic circuits using the ADDIMID process, 0000 (29 June 2001); doi: 10.1117/12.432530
Proc. SPIE 4274, Novel laser trimming technique for microelectronics, 0000 (29 June 2001); doi: 10.1117/12.432531
Proc. SPIE 4274, Manufacture of a conformal multilayer rf antenna substrate using excimer mask imaging technology and a 6-axis robot, 0000 (29 June 2001); doi: 10.1117/12.432532
Proc. SPIE 4274, Laser direct writing of copper on polyimide, FR4, and Al203 substrates from solid-metalorganic film, 0000 (29 June 2001); doi: 10.1117/12.432533
Laser Microengineering in Optoelectronics
Proc. SPIE 4274, Laser processing of components for polymer mircofluidic and optoelectronic products, 0000 (29 June 2001); doi: 10.1117/12.432535
Proc. SPIE 4274, Laser polishing of GaN, 0000 (29 June 2001); doi: 10.1117/12.432536
Proc. SPIE 4274, Debris-reduced laser machining of polymeric waveguides for optoelectronic applications, 0000 (29 June 2001); doi: 10.1117/12.432537
Proc. SPIE 4274, Multilevel diffractive optical element manufacture by excimer laser ablation and halftone masks, 0000 (29 June 2001); doi: 10.1117/12.432538
Poster Session
Proc. SPIE 4274, Preparation of CO2 lasers of the Macken type: thin gold film rings array catalyst inside the discharge capillary, 0000 (29 June 2001); doi: 10.1117/12.432539
Proc. SPIE 4274, Beam-shaping application in laser heat processing, 0000 (29 June 2001); doi: 10.1117/12.432540
Laser Microengineering in Optoelectronics
Proc. SPIE 4274, Comparison of microstructuring irradiated by 193-nm and 308-nm lasers, 0000 (29 June 2001); doi: 10.1117/12.432541
Poster Session
Proc. SPIE 4274, Comparison of tin oxide chemical sensors prepared by PLD and laser-assisted CVD methods, 0000 (29 June 2001); doi: 10.1117/12.432542
Proc. SPIE 4274, Fabrication of 3D interconnected network of microchannels inside silica by femtosecond irradiation and etching, 0000 (29 June 2001); doi: 10.1117/12.432543
Proc. SPIE 4274, ITO thin film fabrication assisted by the infrared free-electron laser, 0000 (29 June 2001); doi: 10.1117/12.432544
Proc. SPIE 4274, Capacitive discharge excilamps with short duration of radiation pulse, 0000 (29 June 2001); doi: 10.1117/12.432545
Lasers and Techniques I
Proc. SPIE 4274, Ablation and cleaning of wafer surface by excimer laser, 0000 (29 June 2001); doi: 10.1117/12.432546
157-nm Laser Processing
Proc. SPIE 4274, F2 lasers: high-resolution optical processing system for shaping photonic components, 0000 (29 June 2001); doi: 10.1117/12.432547
Proc. SPIE 4274, High-resolution 157-nm laser micromachining of polymers, 0000 (29 June 2001); doi: 10.1117/12.432548
Poster Session
Proc. SPIE 4274, Laser-drilled microhole profiles in fiber-reinforced composites, 0000 (29 June 2001); doi: 10.1117/12.432549
Lasers and Techniques II
Proc. SPIE 4274, PLD of hard ceramic coatings, 0000 (29 June 2001); doi: 10.1117/12.432550
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