PROCEEDINGS VOLUME 4275
PHOTONICS WEST 2001 - LASE | 20-26 JANUARY 2001
Metrology-based Control for Micro-Manufacturing
PHOTONICS WEST 2001 - LASE
20-26 January 2001
San Jose, CA, United States
Defect Analysis and Yield Learning
Proc. SPIE 4275, Challenges facing 3D information extraction by CD-SEM and scatterometry, 0000 (5 June 2001); doi: 10.1117/12.429349
Proc. SPIE 4275, Metrology-based control and profitability in the semiconductor industry, 0000 (5 June 2001); doi: 10.1117/12.429358
Proc. SPIE 4275, Realizing optimum yields on IC products fabricated in current and future process technologies, 0000 (5 June 2001); doi: 10.1117/12.429360
Proc. SPIE 4275, Integrated applications of inspection data in the semiconductor manufacturing environment, 0000 (5 June 2001); doi: 10.1117/12.429361
Proc. SPIE 4275, Field-test results of an image retrieval system for semiconductor yield learning, 0000 (5 June 2001); doi: 10.1117/12.429362
Surface Topology and Materials Characterization
Proc. SPIE 4275, Characterization of microstructures with in-line digital micro-holo-interferometry, 0000 (5 June 2001); doi: 10.1117/12.429363
Proc. SPIE 4275, 3D modeling from AFM measurements, 0000 (5 June 2001); doi: 10.1117/12.429364
Proc. SPIE 4275, Absolute shape control of microcomponents using digital holography and multiwavelength contouring, 0000 (5 June 2001); doi: 10.1117/12.429350
Proc. SPIE 4275, High-precision interferometric shape measurement of objects with areas of different reflectance, 0000 (5 June 2001); doi: 10.1117/12.429351
Laser Scattering, Optical, SEM, and X-Ray Microscopy
Proc. SPIE 4275, SEM defect review and classification for semiconductor device manufacturing, 0000 (5 June 2001); doi: 10.1117/12.429352
Proc. SPIE 4275, Advanced defect-detection methods for CMP process modules in semiconductor manufacturing, 0000 (5 June 2001); doi: 10.1117/12.429353
Proc. SPIE 4275, High-resolution noncontact thermal characterization of semiconductor devices, 0000 (5 June 2001); doi: 10.1117/12.429354
Proc. SPIE 4275, High-resolution IC inspection technique, 0000 (5 June 2001); doi: 10.1117/12.429355
Proc. SPIE 4275, Analytical first-order model of light scattering from submicron pyramidal pits, 0000 (5 June 2001); doi: 10.1117/12.429356
Proc. SPIE 4275, Desktop x-ray microtomography, 0000 (5 June 2001); doi: 10.1117/12.429357
Surface Topology and Materials Characterization
Proc. SPIE 4275, Depth-image-based surface measurement sensor, 0000 (5 June 2001); doi: 10.1117/12.429359
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