PROCEEDINGS VOLUME 4407
MICROELECTRONIC AND MEMS TECHNOLOGIES | 30 MAY - 1 JUNE 2001
MEMS Design, Fabrication, Characterization, and Packaging
MICROELECTRONIC AND MEMS TECHNOLOGIES
30 May - 1 June 2001
Edinburgh, United Kingdom
Modeling and Design
Proc. SPIE 4407, MEMS and mil/aero: technology push and market pull, 0000 (30 April 2001); doi: 10.1117/12.425286
Proc. SPIE 4407, Model library and tool support for MEMS simulation, 0000 (30 April 2001); doi: 10.1117/12.425295
Proc. SPIE 4407, Suspended substrate stripline structures evaluation for millimeter-wave circuits application, 0000 (30 April 2001); doi: 10.1117/12.425305
Proc. SPIE 4407, Experimental investigation, modeling, and simulations for MEMS-based gas sensor used for monitoring process chambers in semiconductor manufacturing, 0000 (30 April 2001); doi: 10.1117/12.425321
Proc. SPIE 4407, Component-based assistants for MEMS design tools, 0000 (30 April 2001); doi: 10.1117/12.425330
Proc. SPIE 4407, Design of a micro-Wankel rotary engine for MEMS fabrication, 0000 (30 April 2001); doi: 10.1117/12.425333
Proc. SPIE 4407, SPICE modeling of liquid capacitance in micromachined silicon capillaries, 0000 (30 April 2001); doi: 10.1117/12.425334
Proc. SPIE 4407, Electromechanical analysis of microelectromechanical structures and dynamic simulations of laterally vibratory microgyroscope, 0000 (30 April 2001); doi: 10.1117/12.425335
Processes and Fabrication Technologies I
Proc. SPIE 4407, Characterization and optimization of deep dry etching for MEMS applications, 0000 (30 April 2001); doi: 10.1117/12.425287
Proc. SPIE 4407, Comparison of Bosch and cryogenic processes for patterning high-aspect-ratio features in silicon, 0000 (30 April 2001); doi: 10.1117/12.425288
Proc. SPIE 4407, Fabrication of silicon sidewall profiles for fluidic applications using modified advanced silicon etching, 0000 (30 April 2001); doi: 10.1117/12.425289
Proc. SPIE 4407, Nd:YAG laser micromachining of SiC precision structures for MEMS, 0000 (30 April 2001); doi: 10.1117/12.425290
Proc. SPIE 4407, Profile control of SU-8 photoresist using different radiation sources, 0000 (30 April 2001); doi: 10.1117/12.425291
Proc. SPIE 4407, Computational synthesis of lithographic mask layouts for silicon microcomponents, 0000 (30 April 2001); doi: 10.1117/12.425292
Proc. SPIE 4407, Advances in silicon-to-glass bonding with laser, 0000 (30 April 2001); doi: 10.1117/12.425293
Proc. SPIE 4407, Fine-grained polysilicon films with built-in tensile strain, 0000 (30 April 2001); doi: 10.1117/12.425294
Proc. SPIE 4407, Micro stereo lithography for fabrication of 3D polymeric and ceramic MEMS, 0000 (30 April 2001); doi: 10.1117/12.425296
Characterization, Packaging, and Interconnection
Proc. SPIE 4407, Novel equipment for friction force measurement on MEMS and microcomponents, 0000 (30 April 2001); doi: 10.1117/12.425297
Proc. SPIE 4407, Bio/chemical microsystem designed for wafer scale testing, 0000 (30 April 2001); doi: 10.1117/12.425298
Proc. SPIE 4407, Breakdown voltage behavior of electrostatic microactuators, 0000 (30 April 2001); doi: 10.1117/12.425299
Proc. SPIE 4407, 3D-CSP: an innovative packaging method based on RMPD, 0000 (30 April 2001); doi: 10.1117/12.425300
Proc. SPIE 4407, Method of localized and low-temperature wafer bonding for microsystem packaging, 0000 (30 April 2001); doi: 10.1117/12.425301
Optical MEMS
Proc. SPIE 4407, MEMS hybridization: bridging the free-space gap, 0000 (30 April 2001); doi: 10.1117/12.425302
Proc. SPIE 4407, Investigation of improved designs for rotational micromirrors using multiuser MEMS processes, 0000 (30 April 2001); doi: 10.1117/12.425303
Proc. SPIE 4407, Wafer scale packaging for a MEMS video scanner, 0000 (30 April 2001); doi: 10.1117/12.425304
Proc. SPIE 4407, New actuation structure for the deformation of continuous mirrors for adaptive optics, 0000 (30 April 2001); doi: 10.1117/12.425306
RF and Wireless MEMS
Proc. SPIE 4407, Silicon MEM technology for millimeter-wave applications, 0000 (30 April 2001); doi: 10.1117/12.425307
Proc. SPIE 4407, Infrastructure needs for RF MEMS production, 0000 (30 April 2001); doi: 10.1117/12.425308
Proc. SPIE 4407, Low-cost in-line phase shifter (IPS) using electrostatic MEMS for large antenna arrays, 0000 (30 April 2001); doi: 10.1117/12.425309
Proc. SPIE 4407, Wireless surface acoustic wave and MEMS-based microsensors, 0000 (30 April 2001); doi: 10.1117/12.425310
Proc. SPIE 4407, MEMS technologies for rf communications, 0000 (30 April 2001); doi: 10.1117/12.425311
Bio/Chemical/Other MEMS and Actuators
Proc. SPIE 4407, Electrothermal modeling of silicon PCR chips, 0000 (30 April 2001); doi: 10.1117/12.425312
Proc. SPIE 4407, Microfabrication and application of reservoir pins for liquid transfer in biotechnology, 0000 (30 April 2001); doi: 10.1117/12.425313
Proc. SPIE 4407, Fabrication of microshutter arrays for space application, 0000 (30 April 2001); doi: 10.1117/12.425314
Proc. SPIE 4407, Novel fabrication process for 3D meander-shaped microcoils in SU-8 dielectric and their application to linear micromotors, 0000 (30 April 2001); doi: 10.1117/12.425315
Proc. SPIE 4407, Design and performance of a polysilicon surface micromachined microengine realized with arrays of asymmetrical electrothermal microactuators, 0000 (30 April 2001); doi: 10.1117/12.425316
Poster Session
Proc. SPIE 4407, Operation cycle modeling for electrostatic-type microrelay, 0000 (30 April 2001); doi: 10.1117/12.425317
Proc. SPIE 4407, Modeling and simulation of a silicon microdiaphragm piezoresistive pressure sensor using finite element analysis (FEA) tools, 0000 (30 April 2001); doi: 10.1117/12.425318
Proc. SPIE 4407, High-level simulation of an electrostatic micromotor, 0000 (30 April 2001); doi: 10.1117/12.425319
Proc. SPIE 4407, Integrated microsystems in standard CMOS technology with applications in the field of chemical sensors, 0000 (30 April 2001); doi: 10.1117/12.425320
Proc. SPIE 4407, High-volume production cost savings methods in MEMS fabrication, 0000 (30 April 2001); doi: 10.1117/12.425322
Proc. SPIE 4407, Coplanar waveguides on SOI and OPS substrates, 0000 (30 April 2001); doi: 10.1117/12.425323
Proc. SPIE 4407, Novel silicon bulk micromachining process for submillimeter rectangular waveguide fabrication, 0000 (30 April 2001); doi: 10.1117/12.425324
Proc. SPIE 4407, Development of a laser micromachining toolbox and its application to the production of 3D microstructures, 0000 (30 April 2001); doi: 10.1117/12.425325
Proc. SPIE 4407, Micro-CT for nondestructive 3D reconstruction of MEMS and sensors, 0000 (30 April 2001); doi: 10.1117/12.425326
Proc. SPIE 4407, Heterogeneous substrates for high-temperature and optical applications, 0000 (30 April 2001); doi: 10.1117/12.425327
Proc. SPIE 4407, Self-parking fiber and self-latching vertical mirror for fiber optical switch array, 0000 (30 April 2001); doi: 10.1117/12.425328
Proc. SPIE 4407, Transport in a deformable microchannel flow, 0000 (30 April 2001); doi: 10.1117/12.425329
Proc. SPIE 4407, Microwave frequency acoustic resonators implemented on monolithic Si/AIN substrates, 0000 (30 April 2001); doi: 10.1117/12.425331
Proc. SPIE 4407, Vertical hall sensor of high sensitivity and excellent confinement fabricated on the (110) silicon substrate, 0000 (30 April 2001); doi: 10.1117/12.425332
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