Joint Invited Papers
Proc. SPIE 4408, Micromachined rf switches, 0000 (5 April 2001); doi: 10.1117/12.425336
Proc. SPIE 4408, Ultrahigh capacity MEMS-based optical cross-connects (Abstract Only), 0000 (5 April 2001); doi: 10.1117/12.425346
Design of MEMS Components
Proc. SPIE 4408, Low-voltage vibratory microgyroscope with ASIC control, 0000 (5 April 2001); doi: 10.1117/12.425357
Proc. SPIE 4408, Design of a new in-plane microactuator for airflow control applications, 0000 (5 April 2001); doi: 10.1117/12.425366
Proc. SPIE 4408, Micromechanical dc-dc converter, 0000 (5 April 2001); doi: 10.1117/12.425376
Proc. SPIE 4408, Tunable rf MEMS resonators and filters, 0000 (5 April 2001); doi: 10.1117/12.425386
Manufacturing of Components for Communication Applications I
Proc. SPIE 4408, Optical fiber switch using a draw-bridge mirror for large array of interconnects, 0000 (5 April 2001); doi: 10.1117/12.425397
Proc. SPIE 4408, Insertion losses in micromachined free-space optical cross-connects due to fiber misalignments, 0000 (5 April 2001); doi: 10.1117/12.425399
Proc. SPIE 4408, Light-induced parametric amplification in MEMS oscillators, 0000 (5 April 2001); doi: 10.1117/12.425400
Proc. SPIE 4408, Design and test of new high-Q microresonators fabricated by UV-LIGA, 0000 (5 April 2001); doi: 10.1117/12.425337
Design and Characterization of MEMS Components
Proc. SPIE 4408, Design and characterization of an optical VLSI processor for real-time centroid detection, 0000 (5 April 2001); doi: 10.1117/12.425338
Proc. SPIE 4408, Thermal-induced stress in dielectric membranes suitable for micromechanized gas sensors, 0000 (5 April 2001); doi: 10.1117/12.425339
Proc. SPIE 4408, Design and coupled-effect simulations of CMOS micro gas sensors built on SOI thin membranes, 0000 (5 April 2001); doi: 10.1117/12.425340
Proc. SPIE 4408, Self-testable CMOS thermopile-based infrared imager, 0000 (5 April 2001); doi: 10.1117/12.425341
Integrated Process and Manufacturing
Proc. SPIE 4408, Development of a micromolding process, 0000 (5 April 2001); doi: 10.1117/12.425342
Proc. SPIE 4408, Replication of refractive micro-optomechanical components made with deep lithography with protons, 0000 (5 April 2001); doi: 10.1117/12.425343
Proc. SPIE 4408, Fabrication of an electrostatic microactuator with curled p+ silicon cantilevers, 0000 (5 April 2001); doi: 10.1117/12.425344
Proc. SPIE 4408, Stiction-controlled locking system for three-dimensional self-assembled microstructures: theory and experimental validation, 0000 (5 April 2001); doi: 10.1117/12.425345
Proc. SPIE 4408, Test of hot electron emission for the micro mass spectrometer, 0000 (5 April 2001); doi: 10.1117/12.425347
Joint Invited Papers
Proc. SPIE 4408, Low-cost MOEM interconnect modules for Tb/s.cm2 aggregate bandwidth to silicon chips, 0000 (5 April 2001); doi: 10.1117/12.425348
Methods and Tools for the Design of MOEMS
Proc. SPIE 4408, Dynamic simulation of optical MEM switches, 0000 (5 April 2001); doi: 10.1117/12.425349
Proc. SPIE 4408, Integrating optical wave simulation into microsystems CAD tools, 0000 (5 April 2001); doi: 10.1117/12.425350
Proc. SPIE 4408, Top-down design flow for MOEMS, 0000 (5 April 2001); doi: 10.1117/12.425351
Proc. SPIE 4408, Modeling and simulation under SPICe of optoelectronic systems including BDJ detector, 0000 (5 April 2001); doi: 10.1117/12.425352
Characterization and Reliability
Proc. SPIE 4408, Determining the most likely site and mode of thermomechanical failure in multimaterial systems, 0000 (5 April 2001); doi: 10.1117/12.425353
Proc. SPIE 4408, Concepts, characterization, and modeling of MEMS microswitches with gold contacts in MUMPs, 0000 (5 April 2001); doi: 10.1117/12.425354
Proc. SPIE 4408, Reliability of self-assembled 3D microstructures: snap-through modeling and experimental validation, 0000 (5 April 2001); doi: 10.1117/12.425355
Proc. SPIE 4408, Development of a workstation for optical testing and modification of IMEMS on a wafer, 0000 (5 April 2001); doi: 10.1117/12.425356
Testing and Failure Analysis
Proc. SPIE 4408, Finite element analysis to support component level fault modeling for MEMS, 0000 (5 April 2001); doi: 10.1117/12.425358
Packaging and Assembly
Proc. SPIE 4408, Packaging of optical MEMS devices, 0000 (5 April 2001); doi: 10.1117/12.425359
Proc. SPIE 4408, Compact dynamic thermal multiport models of packages for MEMS-package cosimulation, 0000 (5 April 2001); doi: 10.1117/12.425360
Proc. SPIE 4408, Flat micro heat pipe arrays for cooling and thermal management at the package level, 0000 (5 April 2001); doi: 10.1117/12.425361
Joint Invited Papers
Proc. SPIE 4408, Challenges of packaging MEMS components for the all-optical networks of the future, 0000 (5 April 2001); doi: 10.1117/12.425362
Proc. SPIE 4408, MEMS torsion: mirrors, nanoprobes, and failure (Abstract Only), 0000 (5 April 2001); doi: 10.1117/12.425363
Design Flows
Proc. SPIE 4408, MEMS synthesis and optimization, 0000 (5 April 2001); doi: 10.1117/12.425364
Proc. SPIE 4408, MEMSMaster: a new approach to prototype MEMS, 0000 (5 April 2001); doi: 10.1117/12.425365
Proc. SPIE 4408, Application-specific design methodology for microsystems, 0000 (5 April 2001); doi: 10.1117/12.425367
Manufacturing of Components for Communication Applications II
Proc. SPIE 4408, Two-plane-parallel fixed electrodes micromachined tunable oscillator, 0000 (5 April 2001); doi: 10.1117/12.425368
Proc. SPIE 4408, Thermal and mechanical evaluation of micromachined planar spiral inductors, 0000 (5 April 2001); doi: 10.1117/12.425369
Proc. SPIE 4408, Miniature pressure acquisition microsystem for wireless in-vivo measurements, 0000 (5 April 2001); doi: 10.1117/12.425370
Proc. SPIE 4408, Telemetry silicon pressure sensor of LC resonance type, 0000 (5 April 2001); doi: 10.1117/12.425371
Joint Invited Papers
Proc. SPIE 4408, Statistical design and analysis of computer experiments for the generation of parsimonious metamodels, 0000 (5 April 2001); doi: 10.1117/12.425372
Analysis Tools and Methods
Proc. SPIE 4408, Design methods for microelectromechanical bandpass filters, 0000 (5 April 2001); doi: 10.1117/12.425373
Proc. SPIE 4408, Behavioral modeling of rf VCO circuit with MEMS LC resonator, 0000 (5 April 2001); doi: 10.1117/12.425374
Proc. SPIE 4408, New approach for 3D full-wave electromagnetic analysis, 0000 (5 April 2001); doi: 10.1117/12.425375
Proc. SPIE 4408, Meshing approach in nonlinear FEM analysis of microstructures under electrostatic loads, 0000 (5 April 2001); doi: 10.1117/12.425377
Proc. SPIE 4408, Effects of squeezed film damping on dynamic finite element analyses of MEMS, 0000 (5 April 2001); doi: 10.1117/12.425378
Devices and Components
Proc. SPIE 4408, Electromechanical stability of capacitive transducers, 0000 (5 April 2001); doi: 10.1117/12.425379
Proc. SPIE 4408, Large-area polymer replication for microfluidic devices, 0000 (5 April 2001); doi: 10.1117/12.425380
Proc. SPIE 4408, RibCon: micromolded easy-assembly multifiber connector for single- and multimode applications, 0000 (5 April 2001); doi: 10.1117/12.425381
Poster Papers: CAD, Design and Test
Proc. SPIE 4408, Enhanced optimization algorithms for the development of microsystems, 0000 (5 April 2001); doi: 10.1117/12.425382
Proc. SPIE 4408, Modular concept for the design of application-specific integrated telemetric systems, 0000 (5 April 2001); doi: 10.1117/12.425383
Proc. SPIE 4408, Simulations-based design for a large-displacement electrostatically actuated microrelay, 0000 (5 April 2001); doi: 10.1117/12.425384
Proc. SPIE 4408, Numerical approach for the frequency-shifting analysis of electrostatic micromechanical actuator, 0000 (5 April 2001); doi: 10.1117/12.425385
Proc. SPIE 4408, Optical modeling of the analytical chamber of an IR gas sensor, 0000 (5 April 2001); doi: 10.1117/12.425387
Design Flows
Proc. SPIE 4408, Design and modeling of a silicon resonant pressure sensor, 0000 (5 April 2001); doi: 10.1117/12.425388
Posters on Microfabrication, Integration and Packaging
Proc. SPIE 4408, Development of microelectromechanical varactors, 0000 (5 April 2001); doi: 10.1117/12.425389
Proc. SPIE 4408, Preparation and characterization of excimer-laser-ablation-derived lead zirconate titanate thin films for microactuators, 0000 (5 April 2001); doi: 10.1117/12.425390