PROCEEDINGS VOLUME 4557
MICROMACHINING AND MICROFABRICATION | 21-25 OCTOBER 2001
Micromachining and Microfabrication Process Technology VII
MICROMACHINING AND MICROFABRICATION
21-25 October 2001
San Francisco, CA, United States
Bulk and Surface Micromachining
Proc. SPIE 4557, Etching rate control of mask material for XeF2 etching using UV exposure, 0000 (28 September 2001); doi: 10.1117/12.442931
Proc. SPIE 4557, Patterning of diamond microstructures by bulk and surface micromachining for MEMS devices, 0000 (28 September 2001); doi: 10.1117/12.442941
Proc. SPIE 4557, Fabrication of the refined MEMS-based compound grating (MCG) based on silicon micromachining, 0000 (28 September 2001); doi: 10.1117/12.442953
Proc. SPIE 4557, Toward the micromachined vibrating gyroscope using (111) silicon wafer process, 0000 (28 September 2001); doi: 10.1117/12.442961
Proc. SPIE 4557, Planarization of deep trenches, 0000 (28 September 2001); doi: 10.1117/12.442970
Liga/Plating/Molding/High-Aspect Ratio
Proc. SPIE 4557, Multilevel microstructures and mold inserts fabricated with planar and oblique x-ray lithography of SU-8 negative photoresist, 0000 (28 September 2001); doi: 10.1117/12.442979
Proc. SPIE 4557, Process strategies for ultradeep x-ray lithography at the Advanced Photon Source, 0000 (28 September 2001); doi: 10.1117/12.442984
Proc. SPIE 4557, Stacked ultradeep x-ray lithography exposures: preliminary results, 0000 (28 September 2001); doi: 10.1117/12.442985
Bulk and Surface Micromachining
Proc. SPIE 4557, Stiction-free release etch with anhydrous HF/water vapor processes, 0000 (28 September 2001); doi: 10.1117/12.442986
Laser Processing
Proc. SPIE 4557, Laser microchemical etching of waveguides and quasi-optical components, 0000 (28 September 2001); doi: 10.1117/12.442932
Proc. SPIE 4557, Novel process for high reflectivity of Al sidewalls of optical mirrors using KrF excimer laser annealing, 0000 (28 September 2001); doi: 10.1117/12.442933
Proc. SPIE 4557, Excimer laser surface micromachining of LiNbO3 for realization of optimized optical modulator electrode structures, 0000 (28 September 2001); doi: 10.1117/12.442934
Proc. SPIE 4557, Fabrication of axisymmetric ceramic microparts using pulsed laser ablation, 0000 (28 September 2001); doi: 10.1117/12.442935
Proc. SPIE 4557, Prediction of particulate characteristics in an expanding laser plume, 0000 (28 September 2001); doi: 10.1117/12.442936
Packaging/Wafer Bonding I
Proc. SPIE 4557, Mechanical gripper system for handling and assembly in MEMS, 0000 (28 September 2001); doi: 10.1117/12.442937
Proc. SPIE 4557, Parallel micromanipulation method for microassembly, 0000 (28 September 2001); doi: 10.1117/12.442938
Proc. SPIE 4557, Method of bond strength evaluation for silicon direct wafer bonding, 0000 (28 September 2001); doi: 10.1117/12.442939
Proc. SPIE 4557, Wafer dicing by laser-induced thermal shock process, 0000 (28 September 2001); doi: 10.1117/12.442940
Packaging/Wafer Bonding II
Proc. SPIE 4557, Integrated cavity wafer level chip size package for MEMS applications, 0000 (28 September 2001); doi: 10.1117/12.442942
Proc. SPIE 4557, Ultraprecision manufacturing of self-assembled microsystems, 0000 (28 September 2001); doi: 10.1117/12.442945
Proc. SPIE 4557, Silicon grisms fabricated by anisotropic wet etching and direct silicon bonding for high-resolution IR spectroscopy, 0000 (28 September 2001); doi: 10.1117/12.442946
Proc. SPIE 4557, Gold damascene interconnect technology for millimeter-wave photonics on silicon, 0000 (28 September 2001); doi: 10.1117/12.442947
Proc. SPIE 4557, Micromachining of packaging materials for MEMS using lasers, 0000 (28 September 2001); doi: 10.1117/12.442948
Analysis/Characterization/Test I
Proc. SPIE 4557, Young's modulus measurement of aluminum thin film with cantilever structure, 0000 (28 September 2001); doi: 10.1117/12.442949
Proc. SPIE 4557, Fluid flow in a microchannel: a stochastic approach, 0000 (28 September 2001); doi: 10.1117/12.442950
Proc. SPIE 4557, Micromachined silicon slits for beam diagnostics in particle accelerators, 0000 (28 September 2001); doi: 10.1117/12.442951
Proc. SPIE 4557, Modeling of the comb actuator deformed by microloading effect in deep reactive ion etching, 0000 (28 September 2001); doi: 10.1117/12.442952
Proc. SPIE 4557, Real-time in-situ microscopic observation of bubbles and roughening in KOH etching of silicon, 0000 (28 September 2001); doi: 10.1117/12.442954
Analysis/Characterization/Test II
Proc. SPIE 4557, Mechanical and structural properties of in-situ doped PECVD silicon carbide layer for post-processing surface micromachining, 0000 (28 September 2001); doi: 10.1117/12.442955
Proc. SPIE 4557, Novel bonding method for polymer-based microfluidic platforms, 0000 (28 September 2001); doi: 10.1117/12.442956
Poster Session
Proc. SPIE 4557, Comparative analysis of silicon wafers micromachining versus nonconventional technology, 0000 (28 September 2001); doi: 10.1117/12.442957
Material and Equipment I
Proc. SPIE 4557, Micromachining of ultrananocrystalline diamond, 0000 (28 September 2001); doi: 10.1117/12.442958
Proc. SPIE 4557, Progress on 300-mm wafer lithography equipment and processes, 0000 (28 September 2001); doi: 10.1117/12.442959
Proc. SPIE 4557, Direct spray coating of photoresist for MEMS applications, 0000 (28 September 2001); doi: 10.1117/12.442960
Proc. SPIE 4557, Engineering in- and out-of-plane stress in PECVD silicon nitride for CMOS-compatible surface micromachining, 0000 (28 September 2001); doi: 10.1117/12.442962
Material and Equipment II
Proc. SPIE 4557, Conformal deposition of LPCVD TEOS, 0000 (28 September 2001); doi: 10.1117/12.442963
Proc. SPIE 4557, Applications of shape memory alloys: advantages, disadvantages, and limitations, 0000 (28 September 2001); doi: 10.1117/12.442964
Proc. SPIE 4557, Photochemical selective surface modification using micromirror array for biochip fabrication, 0000 (28 September 2001); doi: 10.1117/12.442965
Proc. SPIE 4557, Heterogeneous catalysis in a microscale reactor fabricated from a biologically active polymer, 0000 (28 September 2001); doi: 10.1117/12.442966
Liga/Plating/Molding/High-Aspect Ratio
Proc. SPIE 4557, Lamb waves generated by laser, 0000 (28 September 2001); doi: 10.1117/12.442967
Poster Session
Proc. SPIE 4557, Binary optic diffuser design, 0000 (28 September 2001); doi: 10.1117/12.442968
Proc. SPIE 4557, New structure and fabrication process for thermal-type microsensors, 0000 (28 September 2001); doi: 10.1117/12.442969
Proc. SPIE 4557, Fabrication of electromagnetic micromirror array, 0000 (28 September 2001); doi: 10.1117/12.442971
Proc. SPIE 4557, Micromachined thermal actuated microlegs for an insectlike microrobot, 0000 (28 September 2001); doi: 10.1117/12.442972
Proc. SPIE 4557, Fabrication of highly sensitive thermal microflow sensor with surface-micromachined vacuum platform for gas and liquid applications, 0000 (28 September 2001); doi: 10.1117/12.442973
Proc. SPIE 4557, Integrated microreactor and its components for dehydrogenation of cyclohexane to benzene, 0000 (28 September 2001); doi: 10.1117/12.442974
Proc. SPIE 4557, Method to achieve large displacements using comb drive actuators, 0000 (28 September 2001); doi: 10.1117/12.442975
Proc. SPIE 4557, Properties of (311) planes anisotropically etched in (100) silicon by TMAH, 0000 (28 September 2001); doi: 10.1117/12.442976
Proc. SPIE 4557, Improved microwave performance on low-resistivity Si substrates by introducing an oxidized porous Si interlayer, 0000 (28 September 2001); doi: 10.1117/12.442977
Proc. SPIE 4557, Optimization of EDP solutions for feature-size-independent silicon etching, 0000 (28 September 2001); doi: 10.1117/12.442978
Proc. SPIE 4557, Orthogonal method for processing of SU-8 resist in UV-LIGA, 0000 (28 September 2001); doi: 10.1117/12.442980
Proc. SPIE 4557, Anodic alumina as a basis for various-purpose micro-electro-mechanical devices, 0000 (28 September 2001); doi: 10.1117/12.442981
Proc. SPIE 4557, Mechanism of enzyme-etching dichromated gelatin and swelling of gelatin, 0000 (28 September 2001); doi: 10.1117/12.442982
Proc. SPIE 4557, Design and fabrication of micromachined microwave transmission lines, 0000 (28 September 2001); doi: 10.1117/12.442983
Bulk and Surface Micromachining
Proc. SPIE 4557, Progress and profit through microtechnologies: commercial applications of MEMS/MOEMS, 0000 (28 September 2001); doi: 10.1117/12.442943
Proc. SPIE 4557, MEMS/MOEMS application to optical communication, 0000 (28 September 2001); doi: 10.1117/12.442944
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