PROCEEDINGS VOLUME 4558
MICROMACHINING AND MICROFABRICATION | 21-25 OCTOBER 2001
Reliability, Testing, and Characterization of MEMS/MOEMS
MICROMACHINING AND MICROFABRICATION
21-25 October 2001
San Francisco, CA, United States
Reliability Methodology
Proc. SPIE 4558, MEMS reliability, characterization, and test, 0000 (2 October 2001); doi: 10.1117/12.442987
Proc. SPIE 4558, Design for reliability of MEMS/MOEMS for lightwave telecommunications, 0000 (2 October 2001); doi: 10.1117/12.442996
Proc. SPIE 4558, Physical and reliability issues in MEMS microrelays with gold contacts, 0000 (2 October 2001); doi: 10.1117/12.443006
Proc. SPIE 4558, Parametric yield enhancement of a microresonator using statistical optimazation tools, 0000 (2 October 2001); doi: 10.1117/12.443014
MEMS Reliability: Thermomechanical
Proc. SPIE 4558, Thermally induced change in deformation of multimorph MEMS structures, 0000 (2 October 2001); doi: 10.1117/12.443016
Proc. SPIE 4558, Holographic rapid access system for onboard testing of MEMS in microgravity, 0000 (2 October 2001); doi: 10.1117/12.443017
MEMS Reliability Methodology and Qualification
Proc. SPIE 4558, Design and fabrication of MEMS-based micropropulsion devices at JPL, 0000 (2 October 2001); doi: 10.1117/12.443018
Proc. SPIE 4558, Reliable integration of piezoelectric lead zirconate titanate with MEMS fabrication processes, 0000 (2 October 2001); doi: 10.1117/12.442988
Proc. SPIE 4558, Method for testing electrostatic discharge tolerance for fingerprint sensor LSI, 0000 (2 October 2001); doi: 10.1117/12.442989
Proc. SPIE 4558, CNES reliability approach for the qualification of MEMS for space, 0000 (2 October 2001); doi: 10.1117/12.442990
MEMS Reliability: Testing and Characterization
Proc. SPIE 4558, Reliability of self-assembled 3D microstructures: dynamic snap-through modeling and experimental validation, 0000 (2 October 2001); doi: 10.1117/12.442991
Proc. SPIE 4558, Stroboscopic interferometry for characterization and improvement of flexural plate-wave transducers, 0000 (2 October 2001); doi: 10.1117/12.442992
Proc. SPIE 4558, Detailed study of scratch drive actuator characteristics using high-speed imaging, 0000 (2 October 2001); doi: 10.1117/12.442993
Reliability of MEMS Materials and Surfaces I
Proc. SPIE 4558, Strength assessment of wafer-bonded micromechanical components using the micro-chevron test, 0000 (2 October 2001); doi: 10.1117/12.442994
Proc. SPIE 4558, Nanoscale elastic imaging of micro-electro-mechanical system based micromirrors, 0000 (2 October 2001); doi: 10.1117/12.442995
Proc. SPIE 4558, Conduction properties of microscopic gold contact surfaces, 0000 (2 October 2001); doi: 10.1117/12.442997
Proc. SPIE 4558, Fracture toughness and fatigue investigations of polycrystalline silicon, 0000 (2 October 2001); doi: 10.1117/12.442998
Failure Analysis of MOEMS/MEMS
Proc. SPIE 4558, Failure analysis of radio frequency (rf) micro-electro-mechanical systems (MEMS), 0000 (2 October 2001); doi: 10.1117/12.442999
Proc. SPIE 4558, Nondestructive acoustic microimaging (AMI) analysis of MEMS materials, manufacturing, and packaging, 0000 (2 October 2001); doi: 10.1117/12.443000
Proc. SPIE 4558, High-speed 3D optical imaging and failure analysis of high- and low-frequency movements in micro-electro-mechanical (MEMS) with nanometer resolution, 0000 (2 October 2001); doi: 10.1117/12.443001
MEMS Package Reliability
Proc. SPIE 4558, Reliability of micro-electro-mechanical systems (MEMS), 0000 (2 October 2001); doi: 10.1117/12.443002
Proc. SPIE 4558, Printing systems for MEMS packaging, 0000 (2 October 2001); doi: 10.1117/12.443003
Proc. SPIE 4558, Moisture and impurities detection and removal in packaged MEMS, 0000 (2 October 2001); doi: 10.1117/12.443004
MEMS Back End of Line (BEOL)
Proc. SPIE 4558, Packaging issues using FEA and experimental verification on a Si-based capacitive microrelay, 0000 (2 October 2001); doi: 10.1117/12.443005
Proc. SPIE 4558, Optimization of anodic bonding to MEMS with self-assembled monolayer (SAM) coatings, 0000 (2 October 2001); doi: 10.1117/12.443007
Proc. SPIE 4558, Parametric monitoring for the SUMMiT V surface-micromachining process, 0000 (2 October 2001); doi: 10.1117/12.443008
Reliability of MEMS Materials and Surfaces II
Proc. SPIE 4558, Characterization of an inchworm actuator fabricated by polysilicon surface micromachining, 0000 (2 October 2001); doi: 10.1117/12.443009
Proc. SPIE 4558, Surface preparation for selective tungsten deposition on MEMS structures, 0000 (2 October 2001); doi: 10.1117/12.443010
Proc. SPIE 4558, Whole wafer critical point drying of MEMS devices, 0000 (2 October 2001); doi: 10.1117/12.443011
Poster Session
Proc. SPIE 4558, Analysis and design of a capacitive accelerometer based on a electrostatically levitated microdisk, 0000 (2 October 2001); doi: 10.1117/12.443012
MEMS Reliability: Testing and Characterization
Proc. SPIE 4558, Experimental microfluidics toolbox for MEMS characterization, 0000 (2 October 2001); doi: 10.1117/12.443013
Poster Session
Proc. SPIE 4558, Characterization of MEMS mechanical properties using nanoscale techniques, 0000 (2 October 2001); doi: 10.1117/12.443015
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