Fundamentals of Laser-Matter Interaction
Proc. SPIE 4637, Consequences of combined chemical and radiative exposure of solid surfaces, 0000 (18 June 2002); doi: 10.1117/12.470616
Proc. SPIE 4637, Onset of laser ablation in CaF2 crystal under excimer laser irradiation, 0000 (18 June 2002); doi: 10.1117/12.470624
Diagnostics and Mechanisms of Laser Ablation
Proc. SPIE 4637, Diagnostics of nanoparticle formation process by laser ablation in a background gas, 0000 (18 June 2002); doi: 10.1117/12.470633
Proc. SPIE 4637, Ultrafast laser-induced plasma diagnostics with time-spatial-resolved shadow and interferometric techniques, 0000 (18 June 2002); doi: 10.1117/12.470643
Proc. SPIE 4637, Effects of laser parameters on plume characteristics and ablation rate, 0000 (18 June 2002); doi: 10.1117/12.470649
Proc. SPIE 4637, Modeling of chemical processes in the dynamic expansion for pulsed laser deposition, 0000 (18 June 2002); doi: 10.1117/12.470658
Surface and Thin Film Treatment
Proc. SPIE 4637, General concept of a surface microgeometry reconstruction based on laser technology, 0000 (18 June 2002); doi: 10.1117/12.470668
Proc. SPIE 4637, Laser induced diffusible resistance: device characterization and process modeling, 0000 (18 June 2002); doi: 10.1117/12.470672
Proc. SPIE 4637, Photoluminescence study of laser ablated gallium nitride thin films, 0000 (18 June 2002); doi: 10.1117/12.470609
Proc. SPIE 4637, Excimer ablation of ITO on flexible substrates for large format display applications, 0000 (18 June 2002); doi: 10.1117/12.470610
Proc. SPIE 4637, Generation of functional structures by laser pyrolysis of polysilazane, 0000 (18 June 2002); doi: 10.1117/12.470611
Pulsed Laser Deposition
Proc. SPIE 4637, Preparation of carbonous nanoparticles for anode electrodes of ultrathin lithium ion rechargeable batteries by laser ablation, 0000 (18 June 2002); doi: 10.1117/12.470612
Proc. SPIE 4637, Background gas effects on structural properties in thin films deposited by pulsed laser deposition, 0000 (18 June 2002); doi: 10.1117/12.470613
Ultrafast Laser Processing I
Proc. SPIE 4637, German national femtosecond technology project (FST), 0000 (18 June 2002); doi: 10.1117/12.470614
Proc. SPIE 4637, Laser ablation of nitrogen-solid films by UV ps-laser irradiation: surface modification of materials by fragments in laser ablation plume, 0000 (18 June 2002); doi: 10.1117/12.470615
Proc. SPIE 4637, TEM investigations of thermal effects on material structure induced by femtosecond and nanosecond laser processing, 0000 (18 June 2002); doi: 10.1117/12.470617
Ultrafast Laser Processing II
Proc. SPIE 4637, Microfabrication by a high-fluence femtosecond exposure: mechanism and applications, 0000 (18 June 2002); doi: 10.1117/12.470618
Proc. SPIE 4637, Processing multilayer systems using femtosecond, picosecond, and nanosecond laser pulses at different wavelengths, 0000 (18 June 2002); doi: 10.1117/12.470619
Proc. SPIE 4637, Development of dicing technique for thin semiconductor substrates with femtosecond laser ablation, 0000 (18 June 2002); doi: 10.1117/12.470620
Ultrafast Laser Processing III
Proc. SPIE 4637, Waveguides produced by ultrashort laser pulses inside glasses and crystals, 0000 (18 June 2002); doi: 10.1117/12.470621
Proc. SPIE 4637, Fabrication of birefringent microstructures in transparent materials with femtosecond laser pulses, 0000 (18 June 2002); doi: 10.1117/12.470622
Proc. SPIE 4637, Ultrafast laser-induced processing of materials: fundamentals and applications in micromachining, 0000 (18 June 2002); doi: 10.1117/12.470623
Proc. SPIE 4637, Femtosecond laser machining of fluidic microchannels for miniaturized bioanalytical systems, 0000 (18 June 2002); doi: 10.1117/12.470625
F2 Laser Processing
Proc. SPIE 4637, Glass micromachining using the VUV F2 laser, 0000 (18 June 2002); doi: 10.1117/12.470626
Proc. SPIE 4637, High-resolution F2-laser machining of micro-optic components, 0000 (18 June 2002); doi: 10.1117/12.470627
Proc. SPIE 4637, Laser processing of ion-exchange waveguides in glass, 0000 (18 June 2002); doi: 10.1117/12.470628
Proc. SPIE 4637, High-efficiency refractive index modification of fused silica by F2 and KrF excimer laser multiwavelength excitation process, 0000 (18 June 2002); doi: 10.1117/12.491056
Proc. SPIE 4637, F2-laser microfabrication of buried waveguide structures in transparent glasses, 0000 (18 June 2002); doi: 10.1117/12.470629
Micromachining and Microstructuring
Proc. SPIE 4637, UV laser radiation-induced modifications and microstructuring of glass, 0000 (18 June 2002); doi: 10.1117/12.470630
Poster Session
Proc. SPIE 4637, Effect of laser parameters on the exposure and selective etch rate in photostructurable glass, 0000 (18 June 2002); doi: 10.1117/12.470631
Micromachining and Microstructuring
Proc. SPIE 4637, Crack-free laser processing of glass substrate and its mechanisms, 0000 (18 June 2002); doi: 10.1117/12.470632
Proc. SPIE 4637, Production of innovative geometries with UV lasers, 0000 (18 June 2002); doi: 10.1117/12.470634
Proc. SPIE 4637, Microscale bending of brittle materials using pulsed and CW lasers, 0000 (18 June 2002); doi: 10.1117/12.470635
Microsystems and Microdevices
Proc. SPIE 4637, Development of a 100-gm-class inspector satellite using photostructurable glass/ceramic materials, 0000 (18 June 2002); doi: 10.1117/12.470636
Proc. SPIE 4637, Laser micromachining of biofactory-on-a-chip devices, 0000 (18 June 2002); doi: 10.1117/12.470637
Proc. SPIE 4637, Laser micromachining of polymeric mold inserts for rapid prototyping of PMMA devices via photomolding, 0000 (18 June 2002); doi: 10.1117/12.470638
Proc. SPIE 4637, Bimetallic thermal activated films for microfabrication, photomasks, and data storage, 0000 (18 June 2002); doi: 10.1117/12.470639
Direct Write Processing
Proc. SPIE 4637, Cell-by-cell construction of living tissue, 0000 (18 June 2002); doi: 10.1117/12.470640
Proc. SPIE 4637, Direct writing of planar ultracapacitors by laser forward transfer processing, 0000 (18 June 2002); doi: 10.1117/12.470641
Proc. SPIE 4637, Direct-write of sensor devices by a laser forward transfer technique, 0000 (18 June 2002); doi: 10.1117/12.470642
Innovative Technology for Industrial Applications
Proc. SPIE 4637, Integrated tool for fabrication of electronic components by laser direct write, 0000 (18 June 2002); doi: 10.1117/12.470644
Proc. SPIE 4637, Laser-based sample preparation for electronic package failure analysis, 0000 (18 June 2002); doi: 10.1117/12.470645
Proc. SPIE 4637, Short-pulse-width micromachining of hard materials using DPSS Nd:YAG lasers, 0000 (18 June 2002); doi: 10.1117/12.470646
Proc. SPIE 4637, Laser-assisted manufacture for performance-optimized dielectrically loaded GPS antennas for mobile telephones, 0000 (18 June 2002); doi: 10.1117/12.470647
Poster Session
Proc. SPIE 4637, Laser plasma emission of small particles in different gas atmospheres, 0000 (18 June 2002); doi: 10.1117/12.470648
Proc. SPIE 4637, Xe(He,Kr)-I2(Cl2) glow, barrier and capacitive discharge excilamps, 0000 (18 June 2002); doi: 10.1117/12.470650
Proc. SPIE 4637, Pulsed laser deposition of silicon dioxide thin films with silicone targets for fabricating waveguide devices, 0000 (18 June 2002); doi: 10.1117/12.470651
Proc. SPIE 4637, Application and observation of laser-induced forward transfer process, 0000 (18 June 2002); doi: 10.1117/12.470652
Physics and Chemistry of Laser-based Packaging
Proc. SPIE 4637, Physical and chemical aspects of laser-materials interactions relevant to laser processing, 0000 (18 June 2002); doi: 10.1117/12.470653
Proc. SPIE 4637, Laser-material processing: an industrial view of packaging applications, 0000 (18 June 2002); doi: 10.1117/12.470654
Proc. SPIE 4637, Plasma behavior during high-brightness (DPSS) laser-materials interaction, 0000 (18 June 2002); doi: 10.1117/12.470655
Cutting, Bending, Bonding, and Annealing
Proc. SPIE 4637, Water-jet guided laser: possibilities and potential for singulation of electronic packages, 0000 (18 June 2002); doi: 10.1117/12.470656
Proc. SPIE 4637, Laser joining of glass with silicon, 0000 (18 June 2002); doi: 10.1117/12.470657
Proc. SPIE 4637, Processing of silicon by Nd:YAG lasers with harmonics generation, 0000 (18 June 2002); doi: 10.1117/12.470659
Microwelding
Proc. SPIE 4637, Laser welding of polymers using high-power diode lasers, 0000 (18 June 2002); doi: 10.1117/12.470660
Proc. SPIE 4637, Laser microwelding of electronic components, 0000 (18 June 2002); doi: 10.1117/12.470661
Proc. SPIE 4637, Laser welding of plastics transparent to near-infrared radiation, 0000 (18 June 2002); doi: 10.1117/12.470662