PROCEEDINGS VOLUME 4700
SPIE'S 9TH ANNUAL INTERNATIONAL SYMPOSIUM ON SMART STRUCTURES AND MATERIALS | 17-21 MARCH 2002
Smart Structures and Materials 2002: Smart Electronics, MEMS, and Nanotechnology
SPIE'S 9TH ANNUAL INTERNATIONAL SYMPOSIUM ON SMART STRUCTURES AND MATERIALS
17-21 March 2002
San Diego, California, United States
Nanotechnology I
Proc. SPIE 4700, Three-dimensional MEMS with functionalized carbon nanotubes, 0000 (11 July 2002); doi: 10.1117/12.475024
Nanotechnology II
Proc. SPIE 4700, Electronic noise in nanoelectronic building elements for nanoMEMS and bioMEMS, 0000 (11 July 2002); doi: 10.1117/12.475041
Smart Electronics and RF MEMS
Proc. SPIE 4700, Novel scheme for a higher bandwidth sensor readout, 0000 (11 July 2002); doi: 10.1117/12.475050
Proc. SPIE 4700, Laterally movable gate FET (LMGFET) as a resonant gate device, 0000 (11 July 2002); doi: 10.1117/12.475051
Proc. SPIE 4700, Development of micromachined RF switches with piezofilm actuation, 0000 (11 July 2002); doi: 10.1117/12.475052
Proc. SPIE 4700, On-chip dome-shape spiral micro-inductor for high-frequency applications, 0000 (11 July 2002); doi: 10.1117/12.475053
Proc. SPIE 4700, RF MEMS phase shifter by microstereolithography on silicon, 0000 (11 July 2002); doi: 10.1117/12.475017
Microsensors and MEMS I
Proc. SPIE 4700, Development of a MEMS-rate sensor with PZT actuation and sensing, 0000 (11 July 2002); doi: 10.1117/12.475018
Proc. SPIE 4700, Design concept and preliminary experimental demonstration of MEMS gyroscopes with 4-DOF master-slave architecture, 0000 (11 July 2002); doi: 10.1117/12.475019
Proc. SPIE 4700, Micromachined cochlear-like acoustic sensor, 0000 (11 July 2002); doi: 10.1117/12.475020
Proc. SPIE 4700, Integrated MOSFET-based hydrophone device for underwater applications, 0000 (11 July 2002); doi: 10.1117/12.475021
Microsensors and MEMS II
Proc. SPIE 4700, MEMS-based sensor arrays for military applications, 0000 (11 July 2002); doi: 10.1117/12.475022
Proc. SPIE 4700, Active skin for turbulent drag reduction, 0000 (11 July 2002); doi: 10.1117/12.475023
Micsosensors and MEMS III
Proc. SPIE 4700, Hierarchical model for MEMS device performance simulation, 0000 (11 July 2002); doi: 10.1117/12.475025
Proc. SPIE 4700, Vertical electrostatic actuator with extended digital range via tailored topology, 0000 (11 July 2002); doi: 10.1117/12.475026
Proc. SPIE 4700, Identification of anisoelasticity for electrostatic trimming of rate-integrating gyroscopes, 0000 (11 July 2002); doi: 10.1117/12.475027
Proc. SPIE 4700, Numerical simulation of a surface acoustic wave (SAW) gyroscope using HP EEsof, 0000 (11 July 2002); doi: 10.1117/12.475028
Fabrication
Proc. SPIE 4700, Application of composite particles to electronic devices, 0000 (11 July 2002); doi: 10.1117/12.475029
Proc. SPIE 4700, Novel technique for fabrication of multilayered microcoils in microelectromechanical systems (MEMS) applications, 0000 (11 July 2002); doi: 10.1117/12.475030
Proc. SPIE 4700, Carbon and ceramic microcoils for MEMS by microwave CVD, 0000 (11 July 2002); doi: 10.1117/12.475031
Proc. SPIE 4700, Fabrication of microgaps in electroplated metallic structures for MEMS, 0000 (11 July 2002); doi: 10.1117/12.475032
Smart Skin and Reconfigurable Antenna and Frequency Selective Surface (FSS)
Proc. SPIE 4700, Rectenna performances for smart membrane actuators, 0000 (11 July 2002); doi: 10.1117/12.475033
Proc. SPIE 4700, Simulation and optimization of a smart reconfigurable aperture antenna, 0000 (11 July 2002); doi: 10.1117/12.475034
Proc. SPIE 4700, Power systems and requirements for the integration of smart structures into aircraft, 0000 (11 July 2002); doi: 10.1117/12.475035
Proc. SPIE 4700, Self-configurable digital controllers for smart structural systems using FPGAs, 0000 (11 July 2002); doi: 10.1117/12.475036
Proc. SPIE 4700, Implemetation of local area wireless sensor networks using Bluetooth, 0000 (11 July 2002); doi: 10.1117/12.475037
Proc. SPIE 4700, Optimized multilayered graded fractal FSS: microgenetic algorithm and comparison with experiment, 0000 (11 July 2002); doi: 10.1117/12.475038
Packaging
Proc. SPIE 4700, Vacuum packaging of microresonators by rapid thermal processing, 0000 (11 July 2002); doi: 10.1117/12.475039
Microsensors and MEMS IV
Proc. SPIE 4700, Front-end wafer-level microsystem packaging technique with micro-cap array, 0000 (11 July 2002); doi: 10.1117/12.475040
Proc. SPIE 4700, Thermomechanical optimization of thermally actuated cantilever arrays, 0000 (11 July 2002); doi: 10.1117/12.475042
Proc. SPIE 4700, Evaluation of micromachined actuators based on electrostrictive P(VDF-TrFE) polymers, 0000 (11 July 2002); doi: 10.1117/12.475043
Proc. SPIE 4700, Microminiature temperature-compensated magnetoelastic strain gauge, 0000 (11 July 2002); doi: 10.1117/12.475044
Applications
Proc. SPIE 4700, High-yield microfabrication process for biomimetic artificial haircell sensors, 0000 (11 July 2002); doi: 10.1117/12.475045
Proc. SPIE 4700, Microelectrooptical DNA array sensor, 0000 (11 July 2002); doi: 10.1117/12.475046
Proc. SPIE 4700, Lessons learned about wireless technologies for data acquistion, 0000 (11 July 2002); doi: 10.1117/12.475047
Proc. SPIE 4700, Wireless health monitoring of cracks in structures with MEMS-IDT sensors, 0000 (11 July 2002); doi: 10.1117/12.475048
Poster Session
Proc. SPIE 4700, Characterization of nanocrystalline silicon films, 0000 (11 July 2002); doi: 10.1117/12.475049
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