PROCEEDINGS VOLUME 4764
18TH EUROPEAN MASK CONFERENCE ON MASK TECHNOLOGY FOR INTEGRATED CIRCUITS AND MICRO-COMPONENTS | 15-16 JANUARY 2002
18th European Conference on Mask Technology for Integrated Circuits and Microcomponents
18TH EUROPEAN MASK CONFERENCE ON MASK TECHNOLOGY FOR INTEGRATED CIRCUITS AND MICRO-COMPONENTS
15-16 January 2002
Munich-Unterhaching, Germany
Keynote Session
Proc. SPIE 4764, Mask strategy at International SEMATECH, 0000 (16 August 2002); doi: 10.1117/12.479332
Next-Generation Masks I
Proc. SPIE 4764, Mask availability for next-generation lithography, 0000 (16 August 2002); doi: 10.1117/12.479342
Proc. SPIE 4764, Measures to achieve 20nm IPL stencil mask distortion, 0000 (16 August 2002); doi: 10.1117/12.479353
Next-Generation Masks II
Proc. SPIE 4764, EUV mask development: material and process, 0000 (16 August 2002); doi: 10.1117/12.479358
Proc. SPIE 4764, Cleaning of low thermal expansion materials for low-defect EUVL mask substrates, 0000 (16 August 2002); doi: 10.1117/12.479359
Proc. SPIE 4764, Recent progress of low-energy e-beam proximity projection lithography (LEEPL) with B-tool development, 0000 (16 August 2002); doi: 10.1117/12.479360
Mask Application
Proc. SPIE 4764, Mask CD uniformity impact during incoming quality control, 0000 (16 August 2002); doi: 10.1117/12.479361
Proc. SPIE 4764, Application of lithography simulation in reticle inspection, 0000 (16 August 2002); doi: 10.1117/12.479362
Pattern Generation, Materials, and Processes I
Proc. SPIE 4764, Plasma etch of Cr masks utilizing TCP source for a next-generation plasma source, 0000 (16 August 2002); doi: 10.1117/12.479363
Proc. SPIE 4764, Pattern data processing using 1-nm address grid, 0000 (16 August 2002); doi: 10.1117/12.479333
Enhanced Techniques and Data-Processing
Proc. SPIE 4764, Elements of hierarchical mask data preparation, 0000 (16 August 2002); doi: 10.1117/12.479334
Proc. SPIE 4764, Reticle processing induced proximity effects, 0000 (16 August 2002); doi: 10.1117/12.479335
Proc. SPIE 4764, Printability of hard and soft defects in 193-nm lithography, 0000 (16 August 2002); doi: 10.1117/12.479336
Poster Session
Proc. SPIE 4764, Feasibility study of manufacturing process and quality control for the new alternating PSM structure, 0000 (16 August 2002); doi: 10.1117/12.479337
Proc. SPIE 4764, Ion projection lithography (IPL): posters presented at the 5th Intrnational SEMATECH Next-Generation Lithography (NGL) workshop, 0000 (16 August 2002); doi: 10.1117/12.479338
Proc. SPIE 4764, Simulation study of 193-nm phase-shifting masks: analysis of distributed defects of embeded attenuated phase mask (EAPSM), 0000 (16 August 2002); doi: 10.1117/12.479339
Proc. SPIE 4764, Defect inspection and repair reticle (DIRRT) design for the 100-nm and sub-100-nm technology nodes, 0000 (16 August 2002); doi: 10.1117/12.479340
Keynote Session
Proc. SPIE 4764, Review of the 2001 ITRS update, 0000 (16 August 2002); doi: 10.1117/12.479341
Pattern Generation, Materials, and Processes II
Proc. SPIE 4764, CD performance of CA-resits with dynamically controlled multi-zone bake system, 0000 (16 August 2002); doi: 10.1117/12.479343
Proc. SPIE 4764, Defect density engineering for high-end masks (=0.14 technology phase-shift masks), 0000 (16 August 2002); doi: 10.1117/12.479344
Proc. SPIE 4764, Environmental monitoring system, 0000 (16 August 2002); doi: 10.1117/12.479345
Metrology
Proc. SPIE 4764, Calibration of test reticles for qualification of imaging properties of microlithographic projection lenses, 0000 (16 August 2002); doi: 10.1117/12.479346
Proc. SPIE 4764, Long-term performance of the DUV optical metrology tool for the 90-nm node, 0000 (16 August 2002); doi: 10.1117/12.479347
Proc. SPIE 4764, Actual performance data obtained on new transmitted light mask metrology system, 0000 (16 August 2002); doi: 10.1117/12.479348
Proc. SPIE 4764, Advanced optical imaging platform for CD metrology and defect review on 130-nm to 100-nm node reticles: an overview of preliminary results, 0000 (16 August 2002); doi: 10.1117/12.479349
Proc. SPIE 4764, OPC aware mask and wafer metrology, 0000 (16 August 2002); doi: 10.1117/12.479350
Inspection and Repair I
Proc. SPIE 4764, Multibeam resolution die-to-database reticle inspection, 0000 (16 August 2002); doi: 10.1117/12.479351
Proc. SPIE 4764, Inspection of alternating PSM reticles using UV-based 365-nm reticle inspection tool, 0000 (16 August 2002); doi: 10.1117/12.479352
Proc. SPIE 4764, Productivity and OPC reticle inspectability using multibeam UV wavelength inspection, 0000 (16 August 2002); doi: 10.1117/12.479354
Inspection and Repair II
Proc. SPIE 4764, Measuring and assessing printability of reticle pinhole defects, 0000 (16 August 2002); doi: 10.1117/12.479355
Proc. SPIE 4764, High-precision mask repair using nanomachining, 0000 (16 August 2002); doi: 10.1117/12.479356
Proc. SPIE 4764, Noncontact fluorence measurements for inspection and imprint depth control in nanoimprint lithography, 0000 (16 August 2002); doi: 10.1117/12.479357
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