PROCEEDINGS VOLUME 4945
PHOTONICS FABRICATION EUROPE | 28 OCTOBER - 1 NOVEMBER 2002
MEMS/MOEMS: Advances in Photonic Communications, Sensing, Metrology, Packaging and Assembly
IN THIS VOLUME

0 Sessions, 23 Papers, 0 Presentations
Session 1  (8)
Session 2  (6)
Session 3  (3)
Session 4  (4)
PHOTONICS FABRICATION EUROPE
28 October - 1 November 2002
Bruges, Belgium
Session 1
Proc. SPIE 4945, Optical MEMS and MOEMS for telecommunications, 0000 (25 March 2003); doi: 10.1117/12.468416
Proc. SPIE 4945, Novel low-cost and simple fabrication technology for tunable dielectric active and passive optical air-gap devices, 0000 (25 March 2003); doi: 10.1117/12.471987
Proc. SPIE 4945, Continuously tunable InP-based multiple air-gap MOEMS filters with ultrawide tuning range, 0000 (25 March 2003); doi: 10.1117/12.471977
Proc. SPIE 4945, Micromachined two-chip, low-cost tunable filters for WDM, 0000 (25 March 2003); doi: 10.1117/12.468418
Proc. SPIE 4945, Design, manufacture, and reliabilty of 2D MEMS optical switches, 0000 (25 March 2003); doi: 10.1117/12.468414
Proc. SPIE 4945, Realization of a spectrometer with micromachined scanning grating, 0000 (25 March 2003); doi: 10.1117/12.471993
Proc. SPIE 4945, Micromachined poly-SiGe bolometer arrays for infrared imaging and spectroscopy, 0000 (25 March 2003); doi: 10.1117/12.468410
Proc. SPIE 4945, Micro all-optical and optoelectronic devices, 0000 (25 March 2003); doi: 10.1117/12.471990
Session 2
Proc. SPIE 4945, Characterization of MEMS structures by microscopic digital holography, 0000 (25 March 2003); doi: 10.1117/12.471989
Proc. SPIE 4945, Interferometry system for the mechanical characterization of membranes with silicon oxynitride thin films fabricated by PECVD, 0000 (25 March 2003); doi: 10.1117/12.468412
Proc. SPIE 4945, Gripping tool for MEMS assembly with an absolute distance measurement sensor using a fiber optic WL interferometer with high measuring frequency, 0000 (25 March 2003); doi: 10.1117/12.468417
Proc. SPIE 4945, Assessment of vacuum casting replication technology for refractive and diffractive micro-optomechanical components, 0000 (25 March 2003); doi: 10.1117/12.468420
Proc. SPIE 4945, Arrays of spherical micromirrors and molded microlenses fabricated with bulk Si micromachining, 0000 (25 March 2003); doi: 10.1117/12.471992
Proc. SPIE 4945, Variants of LIGA technology for the production of plastic microcomponents, 0000 (25 March 2003); doi: 10.1117/12.468413
Poster Session
Proc. SPIE 4945, Lithographic performance of an ASML i-line step-and-repeat system by using photosensitive Durimides, 0000 (25 March 2003); doi: 10.1117/12.471974
Proc. SPIE 4945, One-step lithography for fabrication of a hybrid microlens array using a coding gray-level mask, 0000 (25 March 2003); doi: 10.1117/12.468419
Session 3
Proc. SPIE 4945, Thermal strain analysis for flip chip packaging, 0000 (25 March 2003); doi: 10.1117/12.469030
Proc. SPIE 4945, Nonmigration conductive adhesive, 0000 (25 March 2003); doi: 10.1117/12.468638
Proc. SPIE 4945, Calibration of a 2D piezoresistive stress sensor in (100) silicon using a 4PB fixture, 0000 (25 March 2003); doi: 10.1117/12.468424
Session 4
Proc. SPIE 4945, Algorithmic solutions for thermal and electrostatic simulation of MEMS, 0000 (25 March 2003); doi: 10.1117/12.472702
Proc. SPIE 4945, Highly thermally conductive substrates with adjustable CTE for diode laser bar packaging, 0000 (25 March 2003); doi: 10.1117/12.468639
Proc. SPIE 4945, Experimental study of external heat sinks attached on an optical parallel fiber module, 0000 (25 March 2003); doi: 10.1117/12.468635
Proc. SPIE 4945, Investigation of interfacial behavior of a Si-epoxy-FR4 structure under thermal testing using moiré interferometry, 0000 (25 March 2003); doi: 10.1117/12.468423
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