PROCEEDINGS VOLUME 4973
HIGH-POWER LASERS AND APPLICATIONS | 25-31 JANUARY 2003
High-Power Diode Laser Technology and Applications
IN THIS VOLUME

0 Sessions, 19 Papers, 0 Presentations
Session 1  (4)
Session 2  (5)
Session 3  (5)
Session 4  (4)
HIGH-POWER LASERS AND APPLICATIONS
25-31 January 2003
San Jose, CA, United States
Session 1
Proc. SPIE 4973, High-brightness highly reliable InGaAlAs/GaAs laser bars with reduced fill factor and 60% efficiency, 0000 (19 June 2003); doi: 10.1117/12.478364
Proc. SPIE 4973, High-power single-lateral-mode diode lasers, 0000 (19 June 2003); doi: 10.1117/12.482630
Proc. SPIE 4973, High-power diode laser bars with 19 up to 48 individually addressable emitters, 0000 (19 June 2003); doi: 10.1117/12.478368
Proc. SPIE 4973, High-power passive-cooled diode laser device, 0000 (19 June 2003); doi: 10.1117/12.478377
Session 2
Proc. SPIE 4973, High-brightness high-power fiber-coupled diode laser system for material processing and laser pumping, 0000 (19 June 2003); doi: 10.1117/12.478365
Proc. SPIE 4973, Spectral beam combining of diode laser bars to achieve efficient near diffraction limited output power, 0000 (19 June 2003); doi: 10.1117/12.478375
Proc. SPIE 4973, Fiber-coupled high-brightness high-power diode laser for solid-state laser pumping and material processing, 0000 (19 June 2003); doi: 10.1117/12.478369
Proc. SPIE 4973, Fiber optic for high-power diode lasers, 0000 (19 June 2003); doi: 10.1117/12.478371
Proc. SPIE 4973, Investigation of indium solder interfaces for high-power diode lasers, 0000 (19 June 2003); doi: 10.1117/12.478370
Session 3
Proc. SPIE 4973, Application adapted diode laser systems: a result of the German national research project MDS, 0000 (19 June 2003); doi: 10.1117/12.478372
Proc. SPIE 4973, Welding of aluminum alloy with a high-power direct diode laser, 0000 (19 June 2003); doi: 10.1117/12.478376
Proc. SPIE 4973, Precise hardening with high-power diode lasers using beam-shaping mirror optics, 0000 (19 June 2003); doi: 10.1117/12.478380
Proc. SPIE 4973, Case studies of industrial applications of a high-power diode laser in Finland, 0000 (19 June 2003); doi: 10.1117/12.478373
Proc. SPIE 4973, Effect of welding parameters on high-power diode laser welding of thin sheet, 0000 (19 June 2003); doi: 10.1117/12.478366
Session 4
Proc. SPIE 4973, Comparison of multifeed and off-axis high-power diode laser (HPDL) cladding, 0000 (19 June 2003); doi: 10.1117/12.478367
Proc. SPIE 4973, Compact high-power diode laser pump modules for intersatellite communications, 0000 (19 June 2003); doi: 10.1117/12.478374
Proc. SPIE 4973, High-power diode array reliability experiment, 0000 (19 June 2003); doi: 10.1117/12.501865
Poster Session
Proc. SPIE 4973, Pressure tuning of high-power laser diodes, 0000 (19 June 2003); doi: 10.1117/12.501964
Session 4
Proc. SPIE 4973, Diode laser soldering: a lumped parameter mathematical model and comparison of different optical soldering technologies, 0000 (19 June 2003); doi: 10.1117/12.505321
Back to Top