Fundamental Processes
Proc. SPIE 4977, Surface analysis by laser-induced desorption time-of-flight mass spectrometry, 0000 (17 October 2003); doi: 10.1117/12.479418
Proc. SPIE 4977, Dynamics study of multiwavelength excitation process using F2 and KrF excimer lasers, 0000 (17 October 2003); doi: 10.1117/12.479542
Laser and Techniques
Proc. SPIE 4977, Autonomous production cell for um- and nm-processing, 0000 (17 October 2003); doi: 10.1117/12.479536
Proc. SPIE 4977, Novel beam delivery system for microvia drilling using holographic and refractive optics, 0000 (17 October 2003); doi: 10.1117/12.472854
Proc. SPIE 4977, New fiber lasers with temporal pulse shaping of nanosecond pulses for tailoring flexible laser material processing, 0000 (17 October 2003); doi: 10.1117/12.479230
Proc. SPIE 4977, High-brightness solid state laser systems with fiber phase conjugate mirrors for micro material processing, 0000 (17 October 2003); doi: 10.1117/12.479409
Laser Microengineering I
Proc. SPIE 4977, New developments in laser processing of silicon devices, 0000 (17 October 2003); doi: 10.1117/12.479411
Proc. SPIE 4977, High-speed cutting of thin materials with a Q-switched laser in a water-jet versus conventional laser cutting with a free running laser, 0000 (17 October 2003); doi: 10.1117/12.479228
Proc. SPIE 4977, Water jet guided laser versus saw dicing, 0000 (17 October 2003); doi: 10.1117/12.479414
Proc. SPIE 4977, Laser bending of silicon, 0000 (17 October 2003); doi: 10.1117/12.472849
Femtosecond Laser Processing
Proc. SPIE 4977, Three-dimensional recording by femtosecond pulses in dielectrics, 0000 (17 October 2003); doi: 10.1117/12.479405
Proc. SPIE 4977, Ultrashort-pulse laser micromachining testbed development, 0000 (17 October 2003); doi: 10.1117/12.479225
Proc. SPIE 4977, Femtosecond laser machining of steel, 0000 (17 October 2003); doi: 10.1117/12.479229
Proc. SPIE 4977, Femtosecond laser processing tailored for biomedical materials and laser power delivery through optical fibers, 0000 (17 October 2003); doi: 10.1117/12.479575
Proc. SPIE 4977, Femtosecond pulsed laser induced phase transition in iron, 0000 (17 October 2003); doi: 10.1117/12.479232
Laser Nanoengineering
Proc. SPIE 4977, Laser-assisted nanofabrication, 0000 (17 October 2003); doi: 10.1117/12.479236
Proc. SPIE 4977, Laser-promoted nanostructure evolution and nanoparticle alignment, 0000 (17 October 2003); doi: 10.1117/12.479532
Proc. SPIE 4977, Holographic fabrication of micron structures using interfered femtosecond laser beams split by diffractive optics, 0000 (17 October 2003); doi: 10.1117/12.479546
Pulsed-Laser Deposition
Proc. SPIE 4977, Preparation of thin film GaAs on glass by pulsed-laser deposition, 0000 (17 October 2003); doi: 10.1117/12.472848
Laser Microengineering II
Proc. SPIE 4977, Laser micromachining in the microelectronics industry: emerging applications, 0000 (17 October 2003); doi: 10.1117/12.479555
Proc. SPIE 4977, CAD/CAM software for an industrial laser manufacturing tool, 0000 (17 October 2003); doi: 10.1117/12.479533
Proc. SPIE 4977, Micromachining of liquid crystal polymer film with frequency converted diode-pumped Nd:YVO4 laser, 0000 (17 October 2003); doi: 10.1117/12.479227
Proc. SPIE 4977, Femtosecond laser micromachining of silicon for MEMS, 0000 (17 October 2003); doi: 10.1117/12.479556
Laser-Engineered Photonic Structures
Proc. SPIE 4977, Subsurface 3D structures by laser-induced modification of the optical properties of transparent materials, 0000 (17 October 2003); doi: 10.1117/12.479233
Proc. SPIE 4977, Fabrication of diffractive optical elements by ArF-laser ablation of fused silica, 0000 (17 October 2003); doi: 10.1117/12.479226
Proc. SPIE 4977, Laser processing of photonic and microelectronic components using multiple visible and UV wavelength source, 0000 (17 October 2003); doi: 10.1117/12.479238
Proc. SPIE 4977, Subsurface photorefractive effect in LiNbO3 under high-power 248 nm laser irradiation, 0000 (17 October 2003); doi: 10.1117/12.479248
Laser Direct-Write
Proc. SPIE 4977, Single step direct-write photomask made from bimetallic Bi/In thermal resist, 0000 (17 October 2003); doi: 10.1117/12.479415
Proc. SPIE 4977, Surface microfabrication of silica glass by excimer laser irradiation of toluene solution, 0000 (17 October 2003); doi: 10.1117/12.479420
Laser Microengineering III
Proc. SPIE 4977, Diode-pumped TEM00 mode solid state lasers and their micromachining applications, 0000 (17 October 2003); doi: 10.1117/12.479574
Proc. SPIE 4977, High-quality laser microdrilling of metals and ceramics with maximum aspect ratio, 0000 (17 October 2003); doi: 10.1117/12.479235
Proc. SPIE 4977, Laser-based manufacturing of high-accuracy electrodes into brittle materials, 0000 (17 October 2003); doi: 10.1117/12.479535
Microstructuring
Proc. SPIE 4977, 3D microstructuring inside photosensitive glass by use of a femtosecond laser for lab-on-chip applications, 0000 (17 October 2003); doi: 10.1117/12.479539
Proc. SPIE 4977, Fabrication of microstructures in FOTURAN using excimer and femtosecond lasers, 0000 (17 October 2003); doi: 10.1117/12.479239
Proc. SPIE 4977, Thermal and fluid processes of a thin melt zone during femtosecond laser ablation of glass, 0000 (17 October 2003); doi: 10.1117/12.479527
Proc. SPIE 4977, Direct laser-assisted processing of polymers for microfluidic and micro-optical applications, 0000 (17 October 2003); doi: 10.1117/12.479406
Laser-Engineered Semiconductor Structures
Proc. SPIE 4977, Modeling electrical characteristics of laser tuned silicon microdevices, 0000 (17 October 2003); doi: 10.1117/12.479412
Poster Session
Proc. SPIE 4977, Synthesis of metal oxide nanoparticles by laser ablation: nanoparticle-assisted deposition of nanostructured ZnO, 0000 (17 October 2003); doi: 10.1117/12.479530
Proc. SPIE 4977, Effect of VUV F2 laser irradiation on fluoride crystal, 0000 (17 October 2003); doi: 10.1117/12.479244
Proc. SPIE 4977, Semiconductor laser crystallization of a-Si:H, 0000 (17 October 2003); doi: 10.1117/12.479573
Proc. SPIE 4977, Femtosecond laser interferometric processing of Nd:GGG planar optical waveguide, 0000 (17 October 2003); doi: 10.1117/12.479243
Proc. SPIE 4977, Femtosecond laser ablation processing of x-cut LiNbO3 substrates for optical communication devices, 0000 (17 October 2003); doi: 10.1117/12.479245
Proc. SPIE 4977, Optical waveguide fabrication inside transparent materials by use of plasma channeling induced by tailored femtosecond laser, 0000 (17 October 2003); doi: 10.1117/12.479241
Proc. SPIE 4977, F2-laser micropatterning of chrome-coated CaF2 for vacuum-ultraviolet masks, 0000 (17 October 2003); doi: 10.1117/12.479538
Proc. SPIE 4977, Direct laser marking on ROM media for identification, 0000 (17 October 2003); doi: 10.1117/12.479540
Proc. SPIE 4977, Heat-affected zone of metals ablated with femtosecond laser pulses, 0000 (17 October 2003); doi: 10.1117/12.479242
Proc. SPIE 4977, Excimer and femtosecond pulsed laser induced forward transfer process of metal thin film, 0000 (17 October 2003); doi: 10.1117/12.479249
Proc. SPIE 4977, Spontaneous UV radiation source based on pulsed discharge in xenon, 0000 (17 October 2003); doi: 10.1117/12.472850
Reviews and Laser Joining
Proc. SPIE 4977, Opportunities and challenges for laser technology in microelectronics and photonics, 0000 (17 October 2003); doi: 10.1117/12.478607
Proc. SPIE 4977, Laser beam welding of thermoplastics, 0000 (17 October 2003); doi: 10.1117/12.478606
Proc. SPIE 4977, Laser beam soldering: an attractive alternative to conventional soldering technologies, 0000 (17 October 2003); doi: 10.1117/12.478609
Welding
Proc. SPIE 4977, Out of the SHADOW: watch parts in the spotlight -- laser beam microwelding of delicate watch components, 0000 (17 October 2003); doi: 10.1117/12.482627
Proc. SPIE 4977, Process spread reduction of laser microspot welding of thin copper parts using real-time control, 0000 (17 October 2003); doi: 10.1117/12.478612
Proc. SPIE 4977, 3D-MID and process monitoring for microjoining applications, 0000 (17 October 2003); doi: 10.1117/12.478920
Proc. SPIE 4977, Laser droplet weld: an innovative joining technology opens new application possibilities, 0000 (17 October 2003); doi: 10.1117/12.479576
Drilling and Cutting
Proc. SPIE 4977, Application of melt ejection criterion in simulation of micromachining with laser, 0000 (17 October 2003); doi: 10.1117/12.478610