PROCEEDINGS VOLUME 4979
MICROMACHINING AND MICROFABRICATION | 25-31 JANUARY 2003
Micromachining and Microfabrication Process Technology VIII
MICROMACHINING AND MICROFABRICATION
25-31 January 2003
San Jose, CA, United States
Bulk and Surface Micromachining I
Proc. SPIE 4979, Performance enhancement and evaluation of deep dry etching on a production cluster platform, 0000 (15 January 2003); doi: 10.1117/12.478242
Proc. SPIE 4979, Scalloping minimization in deep Si etching on Unaxis DSE tools, 0000 (15 January 2003); doi: 10.1117/12.472750
Proc. SPIE 4979, Advanced dry etching for oxide deep trench, 0000 (15 January 2003); doi: 10.1117/12.478280
Proc. SPIE 4979, Reduction in surface roughness and aperture size effect for XeF2 etching of Si, 0000 (15 January 2003); doi: 10.1117/12.473376
Proc. SPIE 4979, Optimization of EDP solutions for feature-size-independent silicon etching, 0000 (15 January 2003); doi: 10.1117/12.478257
Bulk and Surface Micromachining II
Proc. SPIE 4979, Polymer protective coating for wet deep silicon etching processes, 0000 (15 January 2003); doi: 10.1117/12.472717
Proc. SPIE 4979, Bi/In as patterning and masking layers for alkaline-based Si anisotropic etching, 0000 (15 January 2003); doi: 10.1117/12.472807
Proc. SPIE 4979, Generation and application of opto-mechancial microstructures on glass, 0000 (15 January 2003); doi: 10.1117/12.479559
Proc. SPIE 4979, Microfabrication of ultrathick SU-8 photoresist for microengines, 0000 (15 January 2003); doi: 10.1117/12.478248
Proc. SPIE 4979, Fabrication of a porous membrane for gas precombustion, 0000 (15 January 2003); doi: 10.1117/12.473377
Bulk and Surface Micromachining III
Proc. SPIE 4979, Chemical mechanical planarization of large-area wells for MEMS and MOEMS, 0000 (15 January 2003); doi: 10.1117/12.478290
Proc. SPIE 4979, Chemical mechanical planarization: an effective microfabrication and micromachining technology for MEMS, 0000 (15 January 2003); doi: 10.1117/12.478291
Proc. SPIE 4979, Planarization of a CMOS die for an integrated metal MEMS, 0000 (15 January 2003); doi: 10.1117/12.472803
Proc. SPIE 4979, Modular process for integrating thick polysilicon MEMS devices with submicron CMOS, 0000 (15 January 2003); doi: 10.1117/12.478294
Proc. SPIE 4979, Batch-fabricated silicon electrostatic micropositioner for dual-stage actuation, 0000 (15 January 2003); doi: 10.1117/12.478240
Bulk and Surface Micromachining IV
Proc. SPIE 4979, Fabrication of PZT-actuated cantilevers on silicon-on-insulator wafers for rf microswitches, 0000 (15 January 2003); doi: 10.1117/12.478245
Proc. SPIE 4979, Double-sided MEMS mirror for L-switching matrix, 0000 (15 January 2003); doi: 10.1117/12.478256
Proc. SPIE 4979, Thin film metal surface micromachining: a new enabling foundry technology, 0000 (15 January 2003); doi: 10.1117/12.478289
Proc. SPIE 4979, Quartz substrate infrared photonic crystal, 0000 (15 January 2003); doi: 10.1117/12.472809
Proc. SPIE 4979, Blazed silicon grating made of (111) silicon wafer, 0000 (15 January 2003); doi: 10.1117/12.478239
Proc. SPIE 4979, Novel MEMS-technology-based silicon and polymer hybrid actuator and applications as a tunable filter in telecom and in IR chemical detectors, 0000 (15 January 2003); doi: 10.1117/12.478293
Laser Processing I
Proc. SPIE 4979, Depth and surface roughness control on laser micromachined polyimide for direct-write deposition, 0000 (15 January 2003); doi: 10.1117/12.472801
Proc. SPIE 4979, Microjoining of dissimilar materials for optoelectronic and biomedical applications, 0000 (15 January 2003); doi: 10.1117/12.478282
Proc. SPIE 4979, Fabrication of planar grating by direct ablation using ultrashort-pulse laser with a novel optical configuration, 0000 (15 January 2003); doi: 10.1117/12.478296
Proc. SPIE 4979, Application of the technology of excimer laser etching to fabricate three-dimensional microstructures, 0000 (15 January 2003); doi: 10.1117/12.478288
Laser Processing II
Proc. SPIE 4979, Design concept for tong grippers for automated microassembly, 0000 (15 January 2003); doi: 10.1117/12.472722
Proc. SPIE 4979, Novel through-die connections for MEMS applications, 0000 (15 January 2003); doi: 10.1117/12.472804
Proc. SPIE 4979, Vacuum wafer-level packaging for MEMS applications, 0000 (15 January 2003); doi: 10.1117/12.478249
Proc. SPIE 4979, Alignment and fabrication of micro-optic assemblies using fiber fusion, 0000 (15 January 2003); doi: 10.1117/12.478250
Proc. SPIE 4979, Fabrication of microchannels for compliant wafer-level packaging using sacrificial materials, 0000 (15 January 2003); doi: 10.1117/12.479568
Proc. SPIE 4979, Chip on flex with 5-micron features, 0000 (15 January 2003); doi: 10.1117/12.478238
Material and Equipment I
Proc. SPIE 4979, Processable high-carbon-yielding polymer for micro- and nanofabrication, 0000 (15 January 2003); doi: 10.1117/12.478252
Proc. SPIE 4979, Three-dimensional polymer MEMS with functionalized carbon nanotubes by micro-stereo-lithography, 0000 (15 January 2003); doi: 10.1117/12.479567
Proc. SPIE 4979, European MEMS foundries, 0000 (15 January 2003); doi: 10.1117/12.478554
Proc. SPIE 4979, Design rules for the fabrication of binary half-tone masks used for MEMS and photonic devices, 0000 (15 January 2003); doi: 10.1117/12.478283
Proc. SPIE 4979, Microfabrication services at INO, 0000 (15 January 2003); doi: 10.1117/12.472738
Proc. SPIE 4979, Novel micromachining method based on AFM and high-accuracy stage, 0000 (15 January 2003); doi: 10.1117/12.472724
Material and Equipment II
Proc. SPIE 4979, Plasma etching of polymers like SU8 and BCB, 0000 (15 January 2003); doi: 10.1117/12.472734
Proc. SPIE 4979, Thick SU-8 photolithography for BioMEMS, 0000 (15 January 2003); doi: 10.1117/12.478244
Proc. SPIE 4979, SU-8-based deep x-ray lithography/LIGA, 0000 (15 January 2003); doi: 10.1117/12.478246
Proc. SPIE 4979, Expansion of SU-8 application scope by PAG concentration modification, 0000 (15 January 2003); doi: 10.1117/12.478254
Proc. SPIE 4979, Process conditions and lithographic performance arch durimide<tm> polyimides in the ultra-thick film regime, 0000 (15 January 2003); doi: 10.1117/12.478241
Proc. SPIE 4979, Cyclotene diaphragm for MEMS-based IR detectors, 0000 (15 January 2003); doi: 10.1117/12.472808
LIGA Plating/Molding/High-Aspect Ratio I
Proc. SPIE 4979, Micromolding and sintering of nanoparticle preforms into microparts, 0000 (15 January 2003); doi: 10.1117/12.472736
Proc. SPIE 4979, Microstructure and mechanical properties of nickel microparts electroformed in replicated LIGA molds, 0000 (15 January 2003); doi: 10.1117/12.472748
Proc. SPIE 4979, Sacrificial layer for the fabrication of electroformed cantilevered LIGA microparts, 0000 (15 January 2003); doi: 10.1117/12.472751
Proc. SPIE 4979, Novel micromolded structures, 0000 (15 January 2003); doi: 10.1117/12.478243
Proc. SPIE 4979, High-aspect-ratio microstructures for magnetoelectronic applications, 0000 (15 January 2003); doi: 10.1117/12.472792
Proc. SPIE 4979, Direct thin film imaging (DTFI) based on PMOD (photochemical metal-organic deposition) methodology, 0000 (15 January 2003); doi: 10.1117/12.478292
LIGA Plating/Molding/High-Aspect Ratio II
Proc. SPIE 4979, Modeling of secondary radiation damage in LIGA PMMA resist exposure, 0000 (15 January 2003); doi: 10.1117/12.478237
Proc. SPIE 4979, High-aspect-ratio microfabrication of crosslinked polytetrafluoroethylene using synchrotron radiation direct photo-etching, 0000 (15 January 2003); doi: 10.1117/12.472802
Proc. SPIE 4979, New process to fabricate DXRL x-ray mask by direct pattern writing, 0000 (15 January 2003); doi: 10.1117/12.478253
Proc. SPIE 4979, High-resolution x-ray masks for high-aspect-ratio microelectromechanical systems (HARMS), 0000 (15 January 2003); doi: 10.1117/12.478268
Proc. SPIE 4979, Borosilicate-glass-based x-ray masks for LIGA microfabrication, 0000 (15 January 2003); doi: 10.1117/12.478258
Proc. SPIE 4979, Embossing of microscale features in Pb and Zn, 0000 (15 January 2003); doi: 10.1117/12.472758
Poster Session
Proc. SPIE 4979, Wafer thinning for high-density through-wafer interconnects, 0000 (15 January 2003); doi: 10.1117/12.473374
Proc. SPIE 4979, Inverse model for optimizing the process of fabricating a microstructure by laser chemical vapor deposition, 0000 (15 January 2003); doi: 10.1117/12.478255