MICROMACHINING AND MICROFABRICATION
25-31 January 2003
San Jose, CA, United States
MEMS/MOEMS Reliability Methodology
Proc. SPIE 4980, DMD reliability: a MEMS success story, 0000 (16 January 2003); doi: 10.1117/12.478212
Proc. SPIE 4980, Reliability evaluation of thermally actuated micromachined relays for space applications, 0000 (16 January 2003); doi: 10.1117/12.472726
Proc. SPIE 4980, Wear mechanisms in a reliability methodology, 0000 (16 January 2003); doi: 10.1117/12.476345
MEMS/MOEMS Characterization Techniques
Proc. SPIE 4980, MEMS characterization using laser Doppler vibrometry, 0000 (16 January 2003); doi: 10.1117/12.478195
Proc. SPIE 4980, Dynamic MEMS devices for multiaxial fatigue and elastic modulus measurement, 0000 (16 January 2003); doi: 10.1117/12.476332
Proc. SPIE 4980, Template-based software for accurate MEMS characterization, 0000 (16 January 2003); doi: 10.1117/12.478204
Failure Modes, Analysis, Tools, and Techniques of MEMS/MOEMS
Proc. SPIE 4980, Anodic oxidation-induced delamination of the SUMMiT poly 0 to silicon nitride interface, 0000 (16 January 2003); doi: 10.1117/12.476366
Proc. SPIE 4980, Electrical breakdown and ESD phenomena for devices with nanometer-to-micron gaps, 0000 (16 January 2003); doi: 10.1117/12.478191
Proc. SPIE 4980, Failure analysis of a multi-degree-of-freedom spatial microstage, 0000 (16 January 2003); doi: 10.1117/12.478207
Proc. SPIE 4980, A new SEM/FIB crossbeam inspection tool for high-resolution materials and device characterization, 0000 (16 January 2003); doi: 10.1117/12.476340
Reliability of MEMS Material Surfaces
Proc. SPIE 4980, Micro/nanoscale tribology and mechanics of MEMS/NEMS materials and devices, 0000 (16 January 2003); doi: 10.1117/12.476353
Proc. SPIE 4980, Surface characterization and adhesion analysis for polysilicon surface micromachined flaps, 0000 (16 January 2003); doi: 10.1117/12.472729
Proc. SPIE 4980, Degradation of monolayer lubricants for MEMS, 0000 (16 January 2003); doi: 10.1117/12.478194
Proc. SPIE 4980, Use of thermal cycling to reduce adhesion of OTS-coated MEMS cantilevers, 0000 (16 January 2003); doi: 10.1117/12.472731
Proc. SPIE 4980, Reciprocating silicon microtribometer, 0000 (16 January 2003); doi: 10.1117/12.478200
Reliability and Characterization of MEMS Materials
Proc. SPIE 4980, Fatigue of LIGA nickel, 0000 (16 January 2003); doi: 10.1117/12.472732
Proc. SPIE 4980, Fracture toughness study on LIGA fabricated microstructures, 0000 (16 January 2003); doi: 10.1117/12.478209
Proc. SPIE 4980, Temperature effects on microstructural evolution and resulting surface mechanical properties of Ni-based MEMS structures, 0000 (16 January 2003); doi: 10.1117/12.478193
Proc. SPIE 4980, Mechanical reliabilty of MEMS fabricated by a special technology using standard silicon wafers, 0000 (16 January 2003); doi: 10.1117/12.472725
Proc. SPIE 4980, Thermal stability of SU-8 fabricated microstructures as a function of photo initiator and exposure doses, 0000 (16 January 2003); doi: 10.1117/12.478197
Back End of Line (BEOL) Process
Proc. SPIE 4980, MEMS production and yield improvement using a flux-free/void-free assembly process, 0000 (16 January 2003); doi: 10.1117/12.478205
Proc. SPIE 4980, Resonant frequency method for monitoring MEMS fabrication, 0000 (16 January 2003); doi: 10.1117/12.478201
Proc. SPIE 4980, Diffusive transport in supercritical CO2 drying of MEMS structures, 0000 (16 January 2003); doi: 10.1117/12.478208
Proc. SPIE 4980, Vapor deposition of amino-functionalized self-assembled monolayers on MEMS, 0000 (16 January 2003); doi: 10.1117/12.478206
MEMS Packaging Reliability and Techniques I
Proc. SPIE 4980, MEMS packaging efforts at Sandia National Laboratories, 0000 (16 January 2003); doi: 10.1117/12.476331
Proc. SPIE 4980, New getter configuration at wafer level for assuring long-term stability of MEMS, 0000 (16 January 2003); doi: 10.1117/12.472718
Proc. SPIE 4980, Utilization of Pb-free solders in MEMS packaging, 0000 (16 January 2003); doi: 10.1117/12.478555
Proc. SPIE 4980, Investigation of NEG thick film for vacuum packaging of MEMS, 0000 (16 January 2003); doi: 10.1117/12.472716
MEMS Packaging Reliability and Techniques II
Proc. SPIE 4980, Solder bonding for microelectromechanical systems (MEMS) applications, 0000 (16 January 2003); doi: 10.1117/12.478202
Proc. SPIE 4980, Novel hermetic packaging methods for MOEMS, 0000 (16 January 2003); doi: 10.1117/12.476338
Proc. SPIE 4980, Dual-function leak detector for MEMS devices, 0000 (16 January 2003); doi: 10.1117/12.472715
Validation, Verification, Qualification, and Nondestructive Evaluation
Proc. SPIE 4980, Reliability and qualification of an integrated MEMS attenuator for optical component applications, 0000 (16 January 2003); doi: 10.1117/12.472728
Proc. SPIE 4980, Burn-in test reduction for the digital micromirror device (DMD), 0000 (16 January 2003); doi: 10.1117/12.478211
Proc. SPIE 4980, Characterization of MOEMS devices for the instrumentation of the Next-Generation Space Telescope, 0000 (16 January 2003); doi: 10.1117/12.478210
MEMS/MOEMS Reliability Methodology
Proc. SPIE 4980, Long-term drift measurements in MEMS-based mass flow controllers, 0000 (16 January 2003); doi: 10.1117/12.498239
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