PROCEEDINGS VOLUME 4997
INTEGRATED OPTOELECTRONICS DEVICES | 25-31 JANUARY 2003
Photonics Packaging and Integration III
IN THIS VOLUME

0 Sessions, 26 Papers, 0 Presentations
Session 1  (3)
Session 2  (4)
Session 3  (3)
Session 4  (3)
Session 5  (3)
Session 6  (6)
INTEGRATED OPTOELECTRONICS DEVICES
25-31 January 2003
San Jose, CA, United States
Session 1
Proc. SPIE 4997, Reliability of fiber arrays, 0000 (30 May 2003); doi: 10.1117/12.475476
Proc. SPIE 4997, Integrated 3D micro-optical interconnection system, 0000 (30 May 2003); doi: 10.1117/12.475465
Session 2
Proc. SPIE 4997, Effect of welding sequence on laser-welding-induced alignment distortion in butterfly laser diode module packages, 0000 (30 May 2003); doi: 10.1117/12.475471
Proc. SPIE 4997, Flexible scalable photonic manufacturing method, 0000 (30 May 2003); doi: 10.1117/12.475475
Proc. SPIE 4997, High-precision die bonding for photonics packaging, 0000 (30 May 2003); doi: 10.1117/12.475483
Proc. SPIE 4997, Temperature sensitivity characteristics of AWGs, 0000 (30 May 2003); doi: 10.1117/12.475477
Poster Session
Proc. SPIE 4997, Optical centralized shared bus architecture for high-performance multiprocessing systems, 0000 (30 May 2003); doi: 10.1117/12.475479
Proc. SPIE 4997, New architecture of optical interconnection using 45-deg.-ended connection rods in waveguide-embedded printed circuit boards, 0000 (30 May 2003); doi: 10.1117/12.475472
Proc. SPIE 4997, Photonic switching network with VCSEL array packaging for parallel multiprocessor cluster system, 0000 (30 May 2003); doi: 10.1117/12.475466
Session 3
Proc. SPIE 4997, Hybrid integrated photonic components based on a polymer platform, 0000 (30 May 2003); doi: 10.1117/12.473279
Proc. SPIE 4997, Fabrication of low-loss optical waveguides using a novel photosensitive polyimide, 0000 (30 May 2003); doi: 10.1117/12.475449
Proc. SPIE 4997, Integration of polymeric optical waveguides with SOI MEMS structures, 0000 (30 May 2003); doi: 10.1117/12.479462
Session 4
Proc. SPIE 4997, Applications of CMOS processing to realize functional on-chip optical interconnects for VLSI, 0000 (30 May 2003); doi: 10.1117/12.479477
Proc. SPIE 4997, Flip-chip bonded optoelectronic integration based on ultrathin silicon (UTSi) CMOS, 0000 (30 May 2003); doi: 10.1117/12.476657
Proc. SPIE 4997, High-speed short-wavelength silicon photodetectors fabricated in 130-nm CMOS process, 0000 (30 May 2003); doi: 10.1117/12.479474
Session 5
Proc. SPIE 4997, Recent progress in the design, simulation, and fabrication of small cross-section silicon-on-insulator VOAs, 0000 (30 May 2003); doi: 10.1117/12.479466
Proc. SPIE 4997, Fabrication of silicon-on-insulator adiabatic tapers for low-loss optical interconnection of photonic devices, 0000 (30 May 2003); doi: 10.1117/12.479371
Proc. SPIE 4997, Coupling optical fibers to thin semiconductor waveguides, 0000 (30 May 2003); doi: 10.1117/12.479446
Session 6
Proc. SPIE 4997, Birefringence compensation in silicon-on-insulator planar waveguide demultiplexers using a buried oxide layer, 0000 (30 May 2003); doi: 10.1117/12.476661
Proc. SPIE 4997, Development of small silicon modulators in silicon-on-insulator (SOI), 0000 (30 May 2003); doi: 10.1117/12.476666
Proc. SPIE 4997, Hybrid integration of III-V optoelectronic devices on Si platform using BCB, 0000 (30 May 2003); doi: 10.1117/12.479453
Proc. SPIE 4997, A review of the various approaches to a silicon laser, 0000 (30 May 2003); doi: 10.1117/12.476660
Proc. SPIE 4997, Bragg gratings interrogation system using MEMS and optical circuits, 0000 (30 May 2003); doi: 10.1117/12.473275
Proc. SPIE 4997, Effect of growth conditions on epitaxial lateral overgrowth of InP on InP/Si (001) substrate by hydride vapor phase epitaxy, 0000 (30 May 2003); doi: 10.1117/12.473278
Poster Session
Proc. SPIE 4997, Silicon-on-insulator interferometric strain sensor, 0000 (30 May 2003); doi: 10.1117/12.476663
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