PROCEEDINGS VOLUME 5045
NDE FOR HEALTH MONITORING AND DIAGNOSTICS | 2-6 MARCH 2003
Testing, Reliability, and Application of Micro- and Nano-Material Systems
IN THIS VOLUME

0 Sessions, 27 Papers, 0 Presentations
Overviews  (5)
NDE FOR HEALTH MONITORING AND DIAGNOSTICS
2-6 March 2003
San Diego, California, United States
Overviews
Proc. SPIE 5045, Micro- and nano-NDE systems for aircraft: great things in small packages, 0000 (22 July 2003); doi: 10.1117/12.484665
Proc. SPIE 5045, Recent results and trends in health monitoring with surface acoustic waves (SAWs), 0000 (22 July 2003); doi: 10.1117/12.483783
Proc. SPIE 5045, Nanoacoustics: probing acoustic waves on the nanoscale, 0000 (22 July 2003); doi: 10.1117/12.483776
Proc. SPIE 5045, International Center for Nano-Materials reliability, 0000 (22 July 2003); doi: 10.1117/12.483995
Imaging Techniques
Proc. SPIE 5045, Nondestructive nanomechanical imaging: cross-sectional ultrasonic force microscopy of integrated circuit test structures, 0000 (22 July 2003); doi: 10.1117/12.483994
Proc. SPIE 5045, AFM/MFM hybrid nanocharacterization of martensitic transformation and degradation for Fe-Pd shape memory alloy, 0000 (22 July 2003); doi: 10.1117/12.484274
Proc. SPIE 5045, Microstructural study of nanoprecipitates in RRA treated Al-7075 T6 using AFM/UFM/STEM, 0000 (22 July 2003); doi: 10.1117/12.484000
Proc. SPIE 5045, Microscopic NDE of hidden corrosion, 0000 (22 July 2003); doi: 10.1117/12.483999
Acoustic Microscopy
Proc. SPIE 5045, Nanoscale nondestructive evaluation of materials and devices by ultrasonic atomic force microscopy, 0000 (22 July 2003); doi: 10.1117/12.483823
Proc. SPIE 5045, Acoustic microscopy: a powerful tool to inspect microstructures of electronic devices, 0000 (22 July 2003); doi: 10.1117/12.483797
Proc. SPIE 5045, Imaging the microstructure of copper with the atomic force microscope (AFM) and ultrasonic force microscope (UFM), 0000 (22 July 2003); doi: 10.1117/12.483824
X-Ray Techniques and MEMS Testing
Proc. SPIE 5045, X-ray microscopy, 0000 (22 July 2003); doi: 10.1117/12.484277
Proc. SPIE 5045, In situ real-time x-ray quality assessment of BGA and uBGA connections during soldering, 0000 (22 July 2003); doi: 10.1117/12.484664
Proc. SPIE 5045, Determination of polarization profiles inside ferroelectric thin films using the laser intensity modulation method, 0000 (22 July 2003); doi: 10.1117/12.483784
Proc. SPIE 5045, Optical interferometric measurements of the static/dynamic response characteristics of MEMS ultrasonic transducers, 0000 (22 July 2003); doi: 10.1117/12.483997
Overviews
Proc. SPIE 5045, Evaluating microdefect structures by AFM-based deformation measurement, 0000 (22 July 2003); doi: 10.1117/12.483826
Interfaces, Layers, and Polymers
Proc. SPIE 5045, Processing and electrical characterization in intrinsic conducting polymers for electronic and MEMS applications, 0000 (22 July 2003); doi: 10.1117/12.484280
Proc. SPIE 5045, Monte Carlo simulations of environmental degradation on polymer coatings, 0000 (22 July 2003); doi: 10.1117/12.483814
Proc. SPIE 5045, In situ measurements of stress-corrosion crack growth using laser ultrasonics, 0000 (22 July 2003); doi: 10.1117/12.483998
Microwave and Radar Techniques
Proc. SPIE 5045, Modern frequency estimation algorithms for FMCW radar systems, 0000 (22 July 2003); doi: 10.1117/12.484130
Proc. SPIE 5045, Use of ground-penetrating radar for asphalt thickness determination, 0000 (22 July 2003); doi: 10.1117/12.484114
Poster Session
Proc. SPIE 5045, Zinc coating layer thickness on steel wires, 0000 (22 July 2003); doi: 10.1117/12.483992
Proc. SPIE 5045, GMR-based eddy current probes for RRA treated Al-7075 T6 and other high-temperature applications, 0000 (22 July 2003); doi: 10.1117/12.483993
Proc. SPIE 5045, Investigation of the foaming process of metals by synchrotron radiation imaging, 0000 (22 July 2003); doi: 10.1117/12.484282
Proc. SPIE 5045, Measurement of complex permittivity of moist sawdust by perturbation method with a dielectric ring resonator, 0000 (22 July 2003); doi: 10.1117/12.484176
Imaging Techniques
Proc. SPIE 5045, Cylindrical polarization symmetry for nondestructive nanocharacterization, 0000 (22 July 2003); doi: 10.1117/12.497948
Interfaces, Layers, and Polymers
Proc. SPIE 5045, Characteristics of solder joints under fatigue loads using piezomechanical actuation, 0000 (22 July 2003); doi: 10.1117/12.497949
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