PROCEEDINGS VOLUME 5116
MICROTECHNOLOGIES FOR THE NEW MILLENNIUM 2003 | 19-21 MAY 2003
Smart Sensors, Actuators, and MEMS
IN THIS VOLUME

0 Sessions, 106 Papers, 0 Presentations
Materials  (8)
Sensors I  (7)
MEMS I  (6)
Actuators I  (5)
Actuators II  (7)
Sensors II  (7)
MEMS II  (7)
MEMS III  (9)
MICROTECHNOLOGIES FOR THE NEW MILLENNIUM 2003
19-21 May 2003
Maspalomas, Gran Canaria, Canary Islands, Spain
Materials
Proc. SPIE 5116, SOI silicon as structural layer for NEMS applications, 0000 (24 April 2003); doi: 10.1117/12.499010
Proc. SPIE 5116, Fusion-bonded multilayered SOI for MEMS applications, 0000 (24 April 2003); doi: 10.1117/12.502741
Proc. SPIE 5116, Microstructuring of Pyrex glass and polymers by excimer laser, 0000 (24 April 2003); doi: 10.1117/12.499002
Proc. SPIE 5116, Stereolithography of lead zirconate titanate ceramics for MEMS applications, 0000 (24 April 2003); doi: 10.1117/12.498777
Proc. SPIE 5116, Fabrication of micromachined TiNi-based microgripper with compliant structure, 0000 (24 April 2003); doi: 10.1117/12.498184
Proc. SPIE 5116, Electroactive characteristics of hydrogels composed of poly(vinyl alcohol) and poly(N-isopropylacrylamide), 0000 (24 April 2003); doi: 10.1117/12.498713
Proc. SPIE 5116, Surface microstructuring of biocompatible bone analogue material HAPEX using LIGA technique and embossing, 0000 (24 April 2003); doi: 10.1117/12.498779
Proc. SPIE 5116, Modified sol-gel-derived PZT ceramics, 0000 (24 April 2003); doi: 10.1117/12.488346
Sensors I
Proc. SPIE 5116, Smart sensors development based on a distributed bus for microsystems applications, 0000 (24 April 2003); doi: 10.1117/12.498491
Proc. SPIE 5116, Low-temperature InO<sub>x</sub> thin films for O<sub>3</sub> and NO<sub>2</sub> gas sensing, 0000 (24 April 2003); doi: 10.1117/12.501464
Proc. SPIE 5116, Design fabrication and test of micromachined-silicon capacitive gas sensors with integrated readout, 0000 (24 April 2003); doi: 10.1117/12.498660
Proc. SPIE 5116, Development of strain sensors utilizing giant magnetoresistive and tunneling magnetoresistive devices, 0000 (24 April 2003); doi: 10.1117/12.500012
Proc. SPIE 5116, Hybrid neural networks for ISFET source separation, 0000 (24 April 2003); doi: 10.1117/12.498634
Proc. SPIE 5116, Compatibility of gas and flow sensor technology fabrication, 0000 (24 April 2003); doi: 10.1117/12.498995
Proc. SPIE 5116, Pencil probe system for electrochemical analysis and modification in nanometer dimensions, 0000 (24 April 2003); doi: 10.1117/12.499065
MEMS I
Proc. SPIE 5116, Overview of MEMS/NEMS technology development for space applications at NASA/JPL, 0000 (24 April 2003); doi: 10.1117/12.497796
Proc. SPIE 5116, Adhesive wafer bonding for MEMS applications, 0000 (24 April 2003); doi: 10.1117/12.499077
Proc. SPIE 5116, High-performance polysilicon air-gap thin film transistor on low-temperature substrates, 0000 (24 April 2003); doi: 10.1117/12.498860
Proc. SPIE 5116, Soft lithographic patterning of oxide thin films, 0000 (24 April 2003); doi: 10.1117/12.499780
Proc. SPIE 5116, Observability and exact controllability of piezoelectric medium coupled to electronic systems, 0000 (24 April 2003); doi: 10.1117/12.498953
Actuators I
Proc. SPIE 5116, Optical components and actuators for integrated near-field optical data storage, 0000 (24 April 2003); doi: 10.1117/12.498885
Proc. SPIE 5116, Integrated near-field optical head for hybrid recording, 0000 (24 April 2003); doi: 10.1117/12.498721
Proc. SPIE 5116, Optomechanical cycles of photochromic-polymer microsystems induced by laser irradiation, 0000 (24 April 2003); doi: 10.1117/12.501327
Proc. SPIE 5116, Smart tong grippers for microparts, 0000 (24 April 2003); doi: 10.1117/12.499009
Proc. SPIE 5116, Shell-type micromechanical oscillator, 0000 (24 April 2003); doi: 10.1117/12.499107
Actuators II
Proc. SPIE 5116, Thermal actuator improvements: tapering and folding, 0000 (24 April 2003); doi: 10.1117/12.499129
Proc. SPIE 5116, Smart electrostrictive composite materials for actuators, 0000 (24 April 2003); doi: 10.1117/12.499595
Proc. SPIE 5116, Electronic circuitry development in a micropyrotechnic system for micropropulsion applications, 0000 (24 April 2003); doi: 10.1117/12.501504
Proc. SPIE 5116, Sigma-delta microsystems for readout and servo control, 0000 (24 April 2003); doi: 10.1117/12.498787
Proc. SPIE 5116, Microfluid pump in brass with a built-in magnetic driver, 0000 (24 April 2003); doi: 10.1117/12.499048
Proc. SPIE 5116, Laser beam microforming as a new adjustment technology using dedicated actuator structures, 0000 (24 April 2003); doi: 10.1117/12.498626
Proc. SPIE 5116, Design and fabrication of a three-dimensional long-stretch microdrive by electroplating, 0000 (24 April 2003); doi: 10.1117/12.498920
Sensors II
Proc. SPIE 5116, Fabrication of bead-size sorting chip for chemical array sensor, 0000 (24 April 2003); doi: 10.1117/12.499025
Proc. SPIE 5116, Polymeric mechanical sensors with integrated readout in a microfluidic system, 0000 (24 April 2003); doi: 10.1117/12.498934
Proc. SPIE 5116, Compact and smart laser diode systems for cancer treatment, 0000 (24 April 2003); doi: 10.1117/12.499483
Proc. SPIE 5116, Fluidic technology: adding control, computation, and sensing capability to microfluidics, 0000 (24 April 2003); doi: 10.1117/12.501450
Proc. SPIE 5116, Long-periodic grating in multimode fiber for measuring traces of chromium in water, 0000 (24 April 2003); doi: 10.1117/12.499059
Proc. SPIE 5116, Resonating cantilever mass sensor with mechanical on-plane excitation, 0000 (24 April 2003); doi: 10.1117/12.501339
Proc. SPIE 5116, Simulation of bulk micromachined vibration sensor with low noise, 0000 (24 April 2003); doi: 10.1117/12.498848
MEMS II
Proc. SPIE 5116, A novel method for the measurement of the residual stress of surface-micromachined structures for MEMS, 0000 (24 April 2003); doi: 10.1117/12.504384
Proc. SPIE 5116, Contactless laser bending of silicon microstructures, 0000 (24 April 2003); doi: 10.1117/12.498961
Proc. SPIE 5116, Rapid prototyping and structure generation using three-dimensional nanolithography with electron-beam-induced chemical reactions, 0000 (24 April 2003); doi: 10.1117/12.500603
Proc. SPIE 5116, Fabrication of nano-interdigitated electrodes, 0000 (24 April 2003); doi: 10.1117/12.488975
Proc. SPIE 5116, Dynamic characterization of SiO<sub>2</sub>-Au microcantilevers using Michelson interferometer, 0000 (24 April 2003); doi: 10.1117/12.498827
Proc. SPIE 5116, Characterization of SU-8 as a resist for electron-beam lithography, 0000 (24 April 2003); doi: 10.1117/12.499112
Proc. SPIE 5116, Characterization of embedded root method in UV-LIGA process, 0000 (24 April 2003); doi: 10.1117/12.498898
Optical Applications
Proc. SPIE 5116, MEMS mirror array for a wavelength-selective 1xK switch, 0000 (24 April 2003); doi: 10.1117/12.504381
Proc. SPIE 5116, MEMS variable optical attenuator for volume production, 0000 (24 April 2003); doi: 10.1117/12.502020
Proc. SPIE 5116, Monolithic III-V and hybrid polysilicon-III-V microelectromechanical tunable multilayer filters and vertical-cavity surface-emitting lasers, 0000 (24 April 2003); doi: 10.1117/12.499674
Proc. SPIE 5116, A back-to-back micromirror device for optical add/drop multiplexer applications, 0000 (24 April 2003); doi: 10.1117/12.498870
Proc. SPIE 5116, Enhancement of optical attenuation by a tunable nonsmooth mirror, 0000 (24 April 2003); doi: 10.1117/12.498969
Proc. SPIE 5116, FDTD simulation of hexagonal micropillar cavities, 0000 (24 April 2003); doi: 10.1117/12.498932
Proc. SPIE 5116, Fabrication of a highly efficient optical modulator based on silicon-on-insulator, 0000 (24 April 2003); doi: 10.1117/12.498967
RF/Integrated Circuits
Proc. SPIE 5116, Polymers in RF and millimeter-wave applications, 0000 (24 April 2003); doi: 10.1117/12.499052
Proc. SPIE 5116, Infrared wavelength-selective micromachined microbolometers, 0000 (24 April 2003); doi: 10.1117/12.499017
Proc. SPIE 5116, Finline technology for millimeter-wave MEMS, 0000 (24 April 2003); doi: 10.1117/12.487702